My Inquiry
My Account
Infineon Technologies S25FL127SABMFI003
- Part No.:
- S25FL127SABMFI003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL127SABMFI003.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,906
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL127SABMFI003 from Infineon is a 128 Mb (16 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, and 64 KB uniform sector erase capability. It supports Quad Read at up to 54 MBps, features hardware ECC for single-bit error correction, and includes OTP array (1024 bytes) and advanced sector protection. Used in industrial embedded boot code storage and firmware update storage for microcontrollers.
For engineers reviewing the S25FL127SABMFI003 datasheet, S25FL127SABMFI003 pinout, S25FL127SABMFI003 application, or S25FL127SABMFI003 equivalent, key selection criteria include Quad I/O read performance, 20-year data retention, AEC-Q100 Grade 2 qualification, hybrid/uniform erase options, and CFI/SFDP register compatibility with legacy S25FL-A/K/P families.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-plane memory organization and on-die ECC logic. It supports SPI clock modes 0 and 3, 24-/32-bit addressing, and AutoBoot execution from preselected addresses on power-up or reset.
The command set includes standard and extended instructions for Quad Input Page Programming (QPP), 4-KB/64-KB/256-KB erase granularity, and secure OTP programming. Configuration registers control write protection, sector lock bits, and SFDP parameter visibility per JEDEC JESD216B.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - sufficient for full MCU boot image + firmware partitioning |
| Read Speed (Quad) | 54 MBps at 108 MHz - enables fast XIP execution without external cache |
| Erase Granularity | 256-KB uniform blocks - ensures software compatibility across FL-S family densities |
| Data Retention | 20 years minimum - validated under industrial temperature cycling (-40°C to +85°C) |
| Endurance | 100,000 program-erase cycles per sector - supports frequent field firmware updates |
| Voltage Range | 2.7 V to 3.6 V - compatible with 3.3 V LDOs and mixed-voltage SoC interfaces |
| Temperature Grade | Industrial Plus (–40°C to +105°C) - qualified for extended thermal environments |
Pinout & Package
Package: 8-contact WSON (6 mm × 5 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be held low during multi-byte transfers |
| SCK | Serial Clock | Input clock for synchronous SPI communication; supports up to 108 MHz operation |
| IO0 | Serial Input / Data I/O 0 | Primary data line for standard SPI reads/writes; functions as QSPI IO0 in quad mode |
| IO1 | Serial Output / Data I/O 1 | Primary output in standard mode; serves as QSPI IO1 in quad configuration |
| IO2 | Write Protect / Data I/O 2 | Hardware WP# input or QSPI IO2; enables sector-level write lock when asserted |
| IO3 | Hold / Data I/O 3 | Pauses ongoing read/write transfers; doubles as QSPI IO3 in quad mode |
| VCC | Supply Voltage | 3.0 V nominal core and I/O supply; decoupling capacitor required within 5 mm of pin |
| VSS | Ground | Signal and power reference plane; requires low-inductance connection to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI Interface | Enables 4x throughput vs standard SPI via simultaneous 4-bit data transfer on IO0–IO3 |
| AutoBoot Function | Executes predefined Quad Read at power-on/reset - eliminates external boot controller dependency |
| On-Die ECC | Hardware-generated Hamming code corrects single-bit errors transparently during read |
| Hybrid/Uniform Erase Options | Configurable via status register: 4-KB top/bottom sectors + 64-KB remainder, or all 256-KB blocks |
| Secure OTP Array | 1024-byte one-time programmable region for cryptographic keys or calibration data |
Applications
| Industrial Control Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing bootloader and real-time OS kernel in PLCs and motor drives requiring field-upgradable firmware. IC Role / Device Role / Timing Role: Primary nonvolatile boot source with AutoBoot execution and 20-year data retention. Use Value: Eliminates need for external initialization logic; uniform 256-KB erase simplifies OTA update partitioning. | Use Scenario: Holding safety-critical boot code and sensor fusion firmware in radar ECUs operating at +105°C ambient. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash providing deterministic boot timing via Quad Read at 54 MBps. Use Value: Meets ASIL-B timing constraints with hardware ECC ensuring integrity of boot image under EMI stress. |
| Medical Imaging System Configuration | Networking Equipment Image Backup |
Use Scenario: Storing FPGA configuration bitstreams and calibration tables in portable ultrasound devices with strict reliability requirements. IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores device-specific calibration coefficients; block protection prevents accidental overwrite. Use Value: 1024-byte OTP guarantees immutability of calibration data across product lifetime. | Use Scenario: Dual-image backup storage in enterprise switches supporting hitless firmware rollback after failed upgrade. IC Role / Device Role / Timing Role: High endurance (100k cycles) and CFI/SFDP support enable robust dual-bank firmware management. Use Value: Uniform 256-KB erase aligns with typical network stack image sizes, minimizing wear leveling overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI001 | Same die, 128 Mb density, but SOIC-16 package and Industrial grade only (–40°C to +85°C) | Lacks AEC-Q100 qualification and +105°C rating; no AutoBoot address preconfiguration | Select when board space allows SOIC-16 and automotive temp range is not required |
| MX25L12833FZNI-10G | Micron-compatible pinout, 3.3 V, 104 MHz max clock, no on-die ECC or ASP | No OTP array or advanced sector protection; SFDP v1.5 only (no JESD216B v1.7) | Choose for cost-sensitive designs where ECC and secure sector lock are not mandated |
Compared with S25FL127SABMFI003, the S25FL128SAGMFI001 trades temperature range and AutoBoot flexibility for SOIC-16 ease-of-handling, while MX25L12833FZNI-10G sacrifices security and ECC for broader second-source availability and lower unit cost.
Availability
S25FL127SABMFI003 is available at Aetrix Electronics and suitable for industrial control firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply and long-term lifecycle assurance.
Supply support for S25FL127SABMFI003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FL-S family targets high-reliability embedded systems needing fast, secure, and scalable SPI NOR flash with automotive-grade qualification and advanced data integrity features.
FAQ
What is the default AutoBoot address and how is it configured?
The AutoBoot address is factory-programmed into the configuration register and can be modified via Write Status Register command. Default value is 0x000000 for standard boot; valid addresses must align to 256-byte boundaries. Configuration requires Write Enable before issuing Write Status Register instruction.
Does S25FL127SABMFI003 support Dual Transfer Rate (DTR) mode?
No, this device does not support DTR mode. It operates exclusively in Single Transfer Rate (STR) with SPI clock modes 0 and 3. Quad I/O functionality is implemented using standard STR timing with four data lines active simultaneously during read/write cycles.
How is the OTP array protected after programming?
Once programmed, the 1024-byte OTP region is permanently locked and cannot be erased or rewritten. Protection is enforced by internal fuse logic; subsequent attempts to program OTP return status register error flags. No software unlock sequence exists - locking is irreversible at silicon level.
Can the hybrid sector option be used alongside Advanced Sector Protection (ASP)?
Yes, hybrid sector layout and ASP are independent features. ASP applies per-sector lock control via boot code or password, regardless of whether sectors are 4-KB, 64-KB, or 256-KB. The configuration register bits for sector size and ASP enablement operate orthogonally.
S25FL127SABMFI003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL127SABMFI003 FAQ
1.How can I place an order for S25FL127SABMFI003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL127SABMFI003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL127SABMFI003 reliable?
The price and inventory of S25FL127SABMFI003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL127SABMFI003 is usually 5 days.
3.What payment methods are accepted for S25FL127SABMFI003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL127SABMFI003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL127SABMFI003?
S25FL127SABMFI003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL127SABMFI003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL127SABMFI003?
For technical support, including S25FL127SABMFI003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL127SABMFI003 requirements.
6.How does Aetrix verify that S25FL127SABMFI003 is sourced from the original manufacturer or authorized distributors?
All S25FL127SABMFI003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL127SABMFI003 meets industry standards.
7.What is the process for return or replacement of S25FL127SABMFI003?
All S25FL127SABMFI003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL127SABMFI003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL127SABMFI003 part is unused and in its original packaging.
Return procedure for S25FL127SABMFI003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL127SABMFI003 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
