My Inquiry
My Account
Infineon Technologies S25FL127SABMFIZ01
- Part No.:
- S25FL127SABMFIZ01
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
S25FL127SABMFIZ01.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,492
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL127SABMFIZ01 from Infineon is a 128 Mb (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and 65-nm MIRRORBIT™ Eclipse architecture. It supports Quad Read at up to 54 MBps, features hardware ECC, OTP array (1024 bytes), and hybrid/uniform sector erase options for industrial and automotive applications including boot code storage in microcontroller-based systems.
For engineers reviewing the S25FL127SABMFIZ01 datasheet, S25FL127SABMFIZ01 pinout, S25FL127SABMFIZ01 application, or S25FL127SABMFIZ01 equivalent, key selection criteria include Quad I/O read performance, 24-/32-bit addressing support, AEC-Q100 Grade 2 qualification, OTP security, and compatibility with S25FL-P family footprint and command set.
Technical Context
This device implements SPI Multi-I/O (SPI-MIO) with configurable clock polarity/phase (modes 0 and 3), supporting Normal, Fast, Dual, and Quad Read commands. It integrates internal hardware ECC for single-bit error correction and auto-boot functionality that executes a preselected read command on power-up or reset.
The flash uses hybrid sector architecture (sixteen 4-KB sectors + remaining 64-KB sectors) or uniform 256-KB logical sector erase, enabling software compatibility across density generations. Configuration is managed via status, configuration, and OTP registers accessible through standard SPI commands.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - sufficient for full firmware images and parameter storage in resource-constrained embedded hosts |
| Read Speed (Quad) | 54 MBps at 108 MHz - enables fast boot execution and real-time code shadowing |
| Erase Endurance | 100,000 cycles per sector - supports frequent field firmware updates in industrial gateways |
| Data Retention | 20 years minimum - ensures long-term reliability in unattended infrastructure equipment |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V logic rails and brown-out tolerant designs |
| Temperature Range | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive ECUs and industrial PLCs |
| Security | 1024-byte OTP array + ASP + block protection - enables secure boot key storage and write-locking of critical sectors |
Pinout & Package
Package: 8-contact WSON (6 × 5 mm), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock | Input clock driving all SPI timing; supports up to 108 MHz for Quad Read operations |
| IO0 | Serial Input / IO0 | Bi-directional data line used for command/address input and data output in single/dual mode |
| IO1 | Serial Output / IO1 | Bi-directional data line used for data output in single mode and dual/quad I/O data transfer |
| IO2 | Write Protect / IO2 | Hardware write-protection control or quad I/O data line; tied high to disable WP function in quad mode |
| IO3 | Hold / IO3 / RESET# | Pauses ongoing SPI transaction when asserted low; also serves as hardware reset input |
| VCC | Power Supply | 3.0 V nominal core and I/O supply; decoupling capacitor required within 10 mm of pin |
| VSS | Ground | Signal and power return path; requires low-impedance connection to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Executes Normal or Quad Read automatically at power-up/reset from user-defined address - eliminates external boot controller overhead |
| Internal Hardware ECC | Single-bit error correction without CPU intervention - improves system-level data integrity in noisy environments |
| Hybrid Sector Architecture | 16 × 4-KB sectors at top/bottom + 64-KB sectors elsewhere - optimizes small-parameter updates while preserving large-code-block efficiency |
| CFI & SFDP Support | Common Flash Interface and JESD216B-compliant SFDP tables - enables automatic driver configuration in Linux U-Boot and RTOS bootloaders |
| AEC-Q100 Grade 2 | Qualified for –40°C to +105°C operation - meets thermal requirements for engine control modules and ADAS domain controllers |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Stores calibrated engine maps, diagnostic routines, and OTA update payloads in diesel/gasoline ECUs. IC Role / Device Role / Timing Role: Non-volatile boot memory with AEC-Q100 Grade 2 qualification and 20-year retention. Use Value: Enables secure, reliable firmware execution under extreme thermal cycling and EMI exposure. | Use Scenario: Holds ladder logic firmware, I/O configuration tables, and safety-critical runtime parameters in modular PLC backplanes. IC Role / Device Role / Timing Role: High-endurance SPI flash for field-upgradable control software with OTP-protected calibration constants. Use Value: Supports 100K+ program-erase cycles for frequent firmware revisions without memory wear-out. |
| Medical Imaging Subsystem | Network Edge Router Boot Memory |
Use Scenario: Stores FPGA configuration bitstreams and image processing firmware in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Quad I/O flash providing >50 MBps read throughput for rapid FPGA reconfiguration. Use Value: Reduces boot time by 60% vs. standard SPI flash, accelerating device readiness in clinical settings. | Use Scenario: Hosts bootloader, kernel, and root filesystem for ARM-based network processors in carrier-grade edge routers. IC Role / Device Role / Timing Role: Secure boot memory with OTP keys and ASP-locked boot sectors. Use Value: Prevents unauthorized firmware modification via hardware-enforced write protection and cryptographic key isolation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGMFI000 | Same die, identical pinout and command set; differs only in marking and packaging (SOIC-16 vs. WSON-8) | Requires PCB redesign for SOIC-16 footprint; no change in firmware or driver stack | Select when board layout accommodates larger package and legacy SOIC sourcing is preferred |
| Winbond W25Q128JVSIM | 128 Mb density, 3.3 V, Quad SPI, but lacks AEC-Q100 qualification and hybrid sector option | Not suitable for automotive or extended-temperature industrial use; lower endurance (100K vs. same) | Choose for cost-sensitive consumer or commercial applications where automotive qualification is unnecessary |
Compared with S25FL127SABMFIZ01, the S25FL128SAGMFI000 offers identical functionality in SOIC-16, while the W25Q128JVSIM provides lower-cost commodity flash without automotive qualification or advanced sector management-making it unsuitable for safety-critical or thermally demanding deployments.
Availability
S25FL127SABMFIZ01 is available at Aetrix Electronics and suitable for automotive engine control units, industrial programmable logic controllers, medical imaging subsystems, and network edge router boot memory requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S25FL127SABMFIZ01 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The FL-S family targets high-reliability embedded systems requiring fast, secure, and AEC-Q100-qualified serial NOR flash for boot code and firmware storage in space- and power-constrained designs.
FAQ
Is S25FL127SABMFIZ01 pin-compatible with earlier S25FL-A or S25FL-K devices?
Yes - it maintains identical pinout and command set compatibility with S25FL-A, S25FL-K, and S25FL-P families in the same package variant. The WSON-8 footprint matches S25FL127SABMFIZ00, and no hardware changes are needed for migration from prior-generation FL-S devices.
Does this device support 32-bit addressing in all operating modes?
Yes - extended addressing is supported in both 24-bit and 32-bit modes via the Bank Address Register (BAR) and Extended Address Register (EAR). 32-bit addressing is required to access the full 128 Mb address space and is enabled by default after power-on reset.
What is the role of the HOLD# pin when configured as RESET#?
When HOLD# is asserted low during power-up, it functions as a hardware reset input that forces the device into a known state and clears internal command latches. This dual-role behavior is enabled automatically at power-on and does not require external configuration.
Can the OTP array be reprogrammed after initial programming?
No - the 1024-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. Once written, bits can only transition from '1' to '0'; any attempt to reprogram results in verification failure and no physical change.
S25FL127SABMFIZ01 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
S25FL127SABMFIZ01 FAQ
1.How can I place an order for S25FL127SABMFIZ01 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL127SABMFIZ01 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL127SABMFIZ01 reliable?
The price and inventory of S25FL127SABMFIZ01 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL127SABMFIZ01 is usually 5 days.
3.What payment methods are accepted for S25FL127SABMFIZ01?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL127SABMFIZ01 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL127SABMFIZ01?
S25FL127SABMFIZ01 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL127SABMFIZ01 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL127SABMFIZ01?
For technical support, including S25FL127SABMFIZ01 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL127SABMFIZ01 requirements.
6.How does Aetrix verify that S25FL127SABMFIZ01 is sourced from the original manufacturer or authorized distributors?
All S25FL127SABMFIZ01 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL127SABMFIZ01 meets industry standards.
7.What is the process for return or replacement of S25FL127SABMFIZ01?
All S25FL127SABMFIZ01 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL127SABMFIZ01, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL127SABMFIZ01 part is unused and in its original packaging.
Return procedure for S25FL127SABMFIZ01:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL127SABMFIZ01 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
