Infineon Technologies S25FL127SABNFB100
- Part No.:
- S25FL127SABNFB100
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
S25FL127SABNFB100.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:

- Shipping:

Inventory:367
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Product details
Overview
S25FL127SABNFB100 from Infineon is a 128 Mb (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and 64 KB uniform sector erase capability. It supports Quad Read at up to 54 MBps, features hardware ECC for single-bit error correction, and includes 1024-byte OTP array for secure configuration storage. Used in industrial embedded boot code storage where fast, reliable nonvolatile code execution is required.
For engineers reviewing the S25FL127SABNFB100 datasheet, S25FL127SABNFB100 pinout, S25FL127SABNFB100 application, or S25FL127SABNFB100 equivalent, key selection criteria include Quad I/O read performance, 20-year data retention, AEC-Q100 Grade 2 qualification, hybrid/uniform sector erase flexibility, and SPI command compatibility with legacy S25FL-A/K/P families.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-plane memory organization, enabling concurrent program/erase operations across planes. It supports both 24-bit and 32-bit addressing modes and integrates CFI and JEDEC JESD216B SFDP for automatic configuration discovery by host controllers.
The SPI-MIO interface operates in clock modes 0 and 3, with dedicated IO0–IO3 pins supporting Normal/Fast/Dual/Quad Read and Quad Input Page Programming. Internal hardware ECC operates transparently during read cycles without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - sufficient for full firmware images and parameter tables in resource-constrained microcontrollers. |
| Read Speed (Quad) | 54 MBps at 108 MHz - enables near-parallel memory access performance over serial interface. |
| Erase Granularity | 256 KB uniform sectors - ensures software compatibility with higher-density FL-S devices and simplifies BSP porting. |
| Data Retention | 20 years minimum - guarantees long-term reliability in unattended industrial deployments. |
| Endurance | 100,000 program-erase cycles per sector - supports frequent field-upgrade scenarios in gateway and edge node applications. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V logic rails and tolerant of brown-out conditions. |
| Temperature Range | –40°C to +105°C (Industrial Plus) - validated for extended thermal operation in enclosed control cabinets. |
Pinout & Package
Package: 8-contact WSON (6 mm × 5 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction. |
| SCK | Serial Clock | Input clock synchronized to host controller; supports up to 108 MHz for Quad Read operations. |
| IO0 | Serial Input / Data I/O 0 | Bi-directional pin used for command/address input and data output in Single/Dual/Quad modes. |
| IO1 | Serial Output / Data I/O 1 | Bi-directional pin; carries data during Dual/Quad Read and receives data during Quad Input Page Program. |
| IO2 | Write Protect / Data I/O 2 | Hardware write protection when pulled low; functions as I/O2 in Quad mode for expanded data bus width. |
| IO3 | Hold / Data I/O 3 | Holds ongoing transaction when asserted low; serves as I/O3 in Quad mode for full 4-bit data transfer. |
| VCC | Power Supply | 3.0 V nominal core and I/O supply; decoupling capacitor required within 10 mm of pin. |
| VSS | Ground | Signal reference plane; must be connected to PCB ground plane with low-inductance path. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Function | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates external boot ROM dependency in MCU-based systems. |
| Internal Hardware ECC | Single-bit error correction applied automatically on every read - removes need for software CRC layers in safety-critical boot paths. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enables secure firmware update partitioning without external security ICs. |
| Hybrid vs Uniform Erase Options | Configurable 4 KB top/bottom sectors + 64 KB remainder OR fixed 256 KB blocks - balances fine-grained update flexibility with legacy software compatibility. |
| JEDEC JESD216B SFDP Support | Self-describing parameter table accessible via standard SPI commands - allows runtime configuration detection by bootloader without hard-coded timing assumptions. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware and calibration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory mapped into MCU address space; provides deterministic <100 µs access latency for critical startup sequences. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity across 15+ year equipment lifecycles without replacement. | Use Scenario: Holding boot code and sensor fusion algorithms for camera/radar ECUs in autonomous driving systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash providing Quad Read acceleration for rapid boot-to-sensor-readiness (<500 ms). Use Value: Integrated ECC and ASP prevent unauthorized firmware modification and mitigate bit-flip risks in high-radiation vehicle cabins. |
| Medical Imaging System Configuration | Smart Grid Communication Module |
Use Scenario: Storing DICOM protocol stacks and image processing lookup tables in portable ultrasound and X-ray units. IC Role / Device Role / Timing Role: Secure configuration store with OTP region holding cryptographic keys and device-specific calibration coefficients. Use Value: 1024-byte one-time programmable array enables tamper-proof credential binding without external secure element. | Use Scenario: Hosting firmware and communication stack (DLMS/COSEM, IEC 61850) in utility smart meters and substation gateways. IC Role / Device Role / Timing Role: High-reliability code storage interfaced to ARM Cortex-M7 host via QSPI peripheral with memory-mapped execution support. Use Value: Uniform 256 KB erase blocks simplify OTA update management and reduce flash wear during frequent firmware patching cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGNFI00 | Same die, identical pinout and command set; differs only in temperature grade (–40°C to +85°C Industrial vs +105°C Industrial Plus). | Lacks extended thermal margin for high-ambient enclosures or automotive under-hood proximity. | Select when cost sensitivity outweighs need for >85°C operation and full AEC-Q100 Grade 2 compliance. |
| Winbond W25Q128JVSIM | 128 Mb SPI NOR with Quad I/O, but no integrated hardware ECC or ASP; uses different SFDP layout and lacks AutoBoot. | Requires external error handling and software-managed sector protection - increases firmware complexity and validation burden. | Choose for cost-optimized consumer designs where ECC and advanced protection are not safety-critical. |
Compared with S25FL127SABNFB100, the Cypress alternative trades thermal robustness for lower cost, while the Winbond part shifts ECC and sector protection responsibility to software - making the Infineon device uniquely suited for functional-safety-aware industrial and automotive boot memory.
Availability
S25FL127SABNFB100 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across multi-year production programs.
Supply support for S25FL127SABNFB100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FL-S family targets high-reliability embedded systems needing fast, secure, and long-life serial NOR flash - designed specifically for boot code execution, firmware updates, and configuration storage in safety-critical environments.
FAQ
What is the maximum clock frequency supported for Quad Read operations?
The S25FL127SABNFB100 supports Quad Read at up to 108 MHz, delivering 54 MBps throughput. This requires proper PCB layout with matched trace lengths for IO0–IO3 and controlled impedance routing to maintain signal integrity at high speed.
Does this device require external hardware for error correction?
No. The device includes fully integrated hardware ECC that automatically detects and corrects single-bit errors during every read operation. No external circuitry or software overhead is needed to implement this functionality.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. It is intended for immutable data such as cryptographic keys, device IDs, or calibration constants.
Is the AutoBoot feature configurable for different read modes and addresses?
Yes. AutoBoot behavior is configured via status register bits and can be set to execute either Normal or Quad Read commands starting from any user-defined 24-bit or 32-bit address upon power-up or reset - enabling flexible boot vector placement.
S25FL127SABNFB100 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (5x6)
S25FL127SABNFB100 FAQ
1.How can I place an order for S25FL127SABNFB100 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL127SABNFB100 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL127SABNFB100 reliable?
The price and inventory of S25FL127SABNFB100 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL127SABNFB100 is usually 5 days.
3.What payment methods are accepted for S25FL127SABNFB100?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL127SABNFB100 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL127SABNFB100?
S25FL127SABNFB100 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL127SABNFB100 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL127SABNFB100?
For technical support, including S25FL127SABNFB100 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL127SABNFB100 requirements.
6.How does Aetrix verify that S25FL127SABNFB100 is sourced from the original manufacturer or authorized distributors?
All S25FL127SABNFB100 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL127SABNFB100 meets industry standards.
7.What is the process for return or replacement of S25FL127SABNFB100?
All S25FL127SABNFB100 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL127SABNFB100, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL127SABNFB100 part is unused and in its original packaging.
Return procedure for S25FL127SABNFB100:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL127SABNFB100 Tags

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