Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S25FL127SABNFB103

Name: S25FL127SABNFB103
Brand: Infineon Technologies
SKU: S25FL127SABNFB103
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S25FL127SABNFB103

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 8-WDFN Exposed Pad

Datasheet:: S25FL127SABNFB103.pdf

Description:: IC FLASH 128MBIT SPI/QUAD 8WSON

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,464

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S25FL127SABNFB103 from Infineon is a 128 Mb (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and 65-nm MIRRORBIT™ Eclipse architecture. It supports Quad Read at up to 54 MBps, 256/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options. Used in industrial embedded boot storage for microcontrollers requiring fast, reliable nonvolatile code execution.

For engineers reviewing the S25FL127SABNFB103 datasheet, S25FL127SABNFB103 pinout, S25FL127SABNFB103 application, or S25FL127SABNFB103 equivalent, key selection criteria include Quad I/O read bandwidth, OTP security array size, AEC-Q100 Grade 2 qualification, hybrid sector erase flexibility, and SOIC-16 package compatibility with legacy PCB footprints.

Technical Context

This device implements SPI-MIO (Multi-Input/Output) with support for clock polarity/phase modes 0 and 3, 24- or 32-bit addressing, and command sets compatible with S25FL-A/K/P families. It integrates CFI and JEDEC JESD216B SFDP for automatic configuration discovery.

The internal architecture includes dedicated hardware ECC logic correcting single-bit errors on-the-fly during read, plus dual-sector protection schemes: status-register-based block protection and password-controlled Advanced Sector Protection (ASP) for individual 4-KB sectors.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	128 Mb (16 MB) - sufficient for full firmware images and parameter tables in resource-constrained MCUs.
Read Speed (Quad)	54 MBps at 108 MHz - enables near-zero latency XIP (execute-in-place) from flash in real-time control systems.
Erase Options	Hybrid (sixteen 4-KB + remaining 64-KB) or uniform 256-KB blocks - balances fine-grained update capability with software compatibility across density tiers.
Endurance	100,000 program-erase cycles per sector - supports field firmware updates over 10+ years in industrial gateways.
Data Retention	20 years minimum at 85°C - ensures long-term reliability in unattended infrastructure equipment.
Security	1024-byte OTP array + ASP + WP#/HOLD# hardware lock - provides immutable root-of-trust keys and selective sector write lockdown.
Supply Range	2.7 V to 3.6 V - interoperable with 3.3 V logic rails and tolerant of brown-out conditions in battery-backed systems.

Pinout & Package

Package: 16-lead SOIC (300 mil), Pb-free, RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
CS#	Chip Select	Active-low enable for SPI command/address/data transfer; must be deasserted between commands to reset internal state machine.
SCK	Serial Clock	Input clock driving all SPI transactions; supports up to 108 MHz for Quad Read, enabling high-throughput boot loading.
IO0–IO3	Multi-I/O Data Lines	Bidirectional pins supporting single/dual/quad I/O modes; IO0/IO1 used for standard SPI, all four for Quad Read/Program to double bandwidth.
WP#	Write Protect	Hardware lock for status register and sector protection bits; tied low to prevent accidental erase/program during power transients.
HOLD#	Hold Function	Pauses ongoing SPI transaction without deselecting device; shares pin with RESET# in some configurations.
VCC / VSS	Power / Ground	3.0 V nominal core supply; decoupling capacitor required within 10 mm of VCC pin to maintain signal integrity at 108 MHz.

Key Features

Feature	Design Value
AutoBoot Mode	Executes preconfigured Normal or Quad Read at power-up/reset - eliminates external boot controller and reduces BOM count in cost-sensitive edge nodes.
Hardware ECC	On-the-fly single-bit error correction with no CPU overhead - maintains data integrity without software intervention in harsh EMI environments.
Hybrid Sector Erase	16 × 4-KB sectors at top/bottom + 64-KB elsewhere - allows safe bootloader storage in protected small sectors while bulk firmware resides in larger blocks.
Advanced Sector Protection (ASP)	Password- or boot-code controlled per-sector lock - enables secure OTA update partitioning where application and configuration sectors are independently writable.
JEDEC SFDP Support	JESD216B-compliant parameter table - permits automatic driver initialization in Linux/RTOS without hard-coded timing or command tables.

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing firmware and configuration data for programmable logic controllers operating in factory-floor environments with wide temperature swings and electrical noise.

IC Role / Device Role / Timing Role: Primary nonvolatile code storage executing XIP during cold start; delivers Quad Read at 54 MBps to meet <100 ms boot time targets.

Use Value: Hybrid sector layout isolates bootloader in 4-KB sectors with ASP lock, preventing corruption during field firmware upgrades via Modbus TCP.

Use Scenario: Holding boot code and sensor calibration data for radar/EPS ECUs certified to AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: Secure boot memory with OTP-stored cryptographic keys and hardware write-protection on critical sectors.

Use Value: 20-year data retention and 100K-cycle endurance ensure functional safety compliance over vehicle lifetime without refresh cycles.

Medical Imaging System Parameter Archive

Smart Grid Communication Module

Use Scenario: Archiving calibration coefficients, DICOM metadata templates, and regulatory audit logs in portable ultrasound devices requiring traceable data history.

IC Role / Device Role / Timing Role: Nonvolatile parameter store with CFI/SFDP self-description for plug-and-play driver compatibility across OEM platforms.

Use Value: 1024-byte OTP array stores immutable device serial number and FDA registration hash, satisfying UDI traceability requirements.

Use Scenario: Hosting protocol stacks (DLMS/COSEM, IEC 61850) and firmware for cellular/NB-IoT smart meters deployed in utility substations.

IC Role / Device Role / Timing Role: Dual-role memory: executes boot code via Quad Read and stores encrypted OTA update payloads in uniform 256-KB blocks.

Use Value: Uniform erase simplifies update management software; 2.7–3.6 V operation tolerates wide-input DC-DC output ripple in transformer-fed meter designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S25FL128SAGMFI101	Same die, identical pinout and command set; differs only in marking and packaging (WSON-8 vs SOIC-16).	Requires PCB redesign for WSON footprint; lacks SOIC-16 mechanical compatibility.	Select when board space is constrained and thermal profile permits WSON reflow.
Winbond W25Q128JVSIM	No hardware ECC; uses software-managed ECC or relies on host-level correction; 32-bit addressing only.	Lacks AutoBoot and ASP; requires external MCU firmware to manage sector locks and boot sequencing.	Choose for cost-sensitive consumer designs where ECC and security are handled in application layer.

Compared with S25FL127SABNFB103, the S25FL128SAGMFI101 offers identical functionality in smaller form factor but sacrifices SOIC-16 drop-in replacement capability, while the W25Q128JVSIM reduces cost by omitting hardware ECC and advanced protection-requiring additional MCU resources and validation effort.

Availability

S25FL127SABNFB103 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging subsystems, and smart grid communication modules requiring stable component supply across extended product lifecycles.

Supply support for S25FL127SABNFB103 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.

The FL-S family targets high-reliability embedded systems needing fast, secure, and long-life serial NOR flash with automotive-grade qualification and hardware-assisted data integrity.

FAQ

Does S25FL127SABNFB103 support 32-bit addressing in all operating modes?

Yes. The device supports both 24-bit and 32-bit addressing via the Extended Address Register (EAR). When EAR is set to 0x01, all subsequent read/program/erase commands use 32-bit addresses, enabling full access to the 128 Mb address space without bank switching.

What is the function of the HOLD# pin when shared with RESET#?

In SOIC-16 packaging, HOLD# and RESET# share Pin 16. When configured as RESET#, it performs hardware reset of the internal state machine; when configured as HOLD#, it pauses active SPI transfers. Configuration is determined by the value sampled on this pin at power-up, per the "Hardware Reset" section of the datasheet.

How does AutoBoot interact with the Status Register Write Enable (WREN) state?

AutoBoot executes independently of WREN status. It triggers a predefined read command (Normal or Quad) at a fixed address immediately after power-up or hardware reset, regardless of whether WREN has been issued. This ensures deterministic boot behavior even if the status register is write-protected.

Is the 1024-byte OTP array one-time programmable per byte or per word?

The OTP array is programmed in 8-byte words. Once any bit in a word is set to '0', that word cannot be reprogrammed. Programming is irreversible and requires issuing the Program OTP command with valid address and data; no erase operation is supported for OTP memory.

S25FL127SABNFB103 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FL-S

Package/Case:: 8-WDFN Exposed Pad

Packaging:: Tape & Reel (TR)

Product Status:: Last Time Buy

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 16M x 8

Memory Interface:: SPI - Quad I/O

Clock Frequency:: 108 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-WSON (5x6)

S25FL127SABNFB103 FAQ

1.How can I place an order for S25FL127SABNFB103 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL127SABNFB103 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL127SABNFB103 reliable?

The price and inventory of S25FL127SABNFB103 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL127SABNFB103 is usually 5 days.

3.What payment methods are accepted for S25FL127SABNFB103?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL127SABNFB103 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL127SABNFB103?

S25FL127SABNFB103 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL127SABNFB103 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL127SABNFB103?

For technical support, including S25FL127SABNFB103 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL127SABNFB103 requirements.

6.How does Aetrix verify that S25FL127SABNFB103 is sourced from the original manufacturer or authorized distributors?

All S25FL127SABNFB103 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL127SABNFB103 meets industry standards.

7.What is the process for return or replacement of S25FL127SABNFB103?

All S25FL127SABNFB103 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL127SABNFB103, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL127SABNFB103 part is unused and in its original packaging.

Return procedure for S25FL127SABNFB103:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…