My Inquiry
My Account
Infineon Technologies S25FL127SABNFI100
- Part No.:
- S25FL127SABNFI100
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
S25FL127SABNFI100.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:828
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL127SABNFI100 from Infineon is a 128 Mb (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and 65-nm MIRRORBIT™ Eclipse architecture. It supports Quad Read at up to 54 MBps, 256/512-byte page programming, hardware ECC, hybrid/uniform sector erase options, and operates from –40°C to +105°C (Industrial Plus). Used in boot code storage for industrial gateways and edge AI inference modules requiring fast, reliable nonvolatile code execution.
For engineers reviewing the S25FL127SABNFI100 datasheet, S25FL127SABNFI100 pinout, S25FL127SABNFI100 application, or S25FL127SABNFI100 equivalent, key selection criteria include Quad I/O read bandwidth, AutoBoot address configuration, OTP security array size, sector protection granularity, and AEC-Q100 Grade 2 qualification for extended-temperature embedded control.
Technical Context
This device implements a SPI-MIO (Multi-I/O) interface supporting clock modes 0 and 3, with configurable 24-/32-bit addressing and JEDEC JESD216B SFDP compliance. It integrates on-die ECC for single-bit correction and supports both hybrid (16 × 4-KB + remainder 64-KB) and uniform (256-KB) sector erase architectures.
The flash uses Infineon's Eclipse architecture with MIRRORBIT™ technology to enable simultaneous read-while-write capability and deterministic latency for boot-from-flash applications. Its CFI-compliant register set and OTP array (1024 bytes) provide standardized configuration access and immutable security provisioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB) - sufficient for full firmware images plus configuration data in resource-constrained edge nodes. |
| Read Throughput | Quad Read: 54 MBps at 108 MHz - enables sub-300 ms boot time for 12 MB kernel+rootfs. |
| Erase Granularity | Hybrid option: sixteen 4-KB sectors + 64-KB sectors - allows fine-grained OTA update partitioning. |
| Endurance | 100,000 program-erase cycles per sector - supports frequent field firmware updates over 10-year product life. |
| Data Retention | 20 years minimum at +85°C - ensures long-term reliability in unattended industrial deployments. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V logic rails and brown-out tolerant power domains. |
| Temperature Range | –40°C to +105°C (Industrial Plus) - qualified for fanless enclosures in factory automation environments. |
Pinout & Package
Package: 8-contact WSON (6 mm × 5 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before SCK edge for valid transaction initiation. |
| SCK | Serial Clock | Input clock driving all SPI transfers; supports up to 108 MHz for Quad Read operations. |
| IO0 (SI) | Serial Input / Data Line 0 | Primary input for commands and addresses in single/dual/quad mode; bidirectional in multi-I/O configurations. |
| IO1 (SO) | Serial Output / Data Line 1 | Primary output for read data; functions as SI during write in dual/quad mode. |
| IO2 (WP#) | Write Protect / Data Line 2 | Hardware write lock when low; repurposed as IO2 in Quad I/O mode for parallel data transfer. |
| IO3 (HOLD#) | Hold / Data Line 3 | Pauses ongoing SPI transfer when asserted; serves as fourth data line in Quad mode. |
| VCC | Power Supply | 3.0 V nominal core and I/O supply; decoupling capacitor required within 5 mm of pin per layout guidelines. |
| VSS | Ground | Signal reference for all I/O and internal logic; separate analog/digital ground not required. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Function | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates external boot controller in cost-sensitive designs. |
| Internal Hardware ECC | Single-bit error correction without CPU intervention - reduces firmware overhead and improves system-level MTBF. |
| OTP Security Array | 1024-byte one-time programmable region - stores cryptographic keys or device-specific identifiers with irreversible write locking. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enables secure OTA update staging without global erase. |
| Hybrid Sector Architecture | Mix of 4-KB and 64-KB physical sectors - balances small update footprint with efficient bulk erase for large binaries. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware and safety-critical configuration in programmable logic controllers deployed in harsh factory environments. IC Role / Device Role / Timing Role: Primary boot memory executing code directly via XIP (execute-in-place) with deterministic <100 ns read latency. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity across decades of unattended operation without refresh. |
Use Scenario: Hosting boot loader and sensor fusion firmware for camera-based lane-departure warning systems in vehicles operating at –40°C to +105°C. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash providing certified boot code storage with AutoBoot-triggered Quad Read startup. Use Value: OTP array secures cryptographic root-of-trust keys; ASP enables secure over-the-air patching of vision algorithms without exposing full memory map. |
| Edge AI Inference Accelerator | Smart Energy Meter Firmware |
Use Scenario: Loading neural network weights and inference engine binaries into FPGA-based accelerators at network edge locations with intermittent power. IC Role / Device Role / Timing Role: High-bandwidth Quad Read interface feeding DMA engines with minimal CPU involvement during model loading. Use Value: 54 MBps read rate reduces model load time by >60% vs. legacy SPI flash, enabling rapid reconfiguration for dynamic workloads. |
Use Scenario: Storing metrology firmware, tariff tables, and tamper logs in ANSI C12.22-compliant utility meters exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Nonvolatile storage with hardware write protection (WP#) and sector-locking to prevent unauthorized firmware modification. Use Value: Hybrid sector erase allows independent update of tariff tables (4-KB sectors) while preserving calibration data in protected 64-KB blocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGNFI101 | Same die, identical pinout and timing, but rated only to +85°C (Industrial grade); lacks AEC-Q100 qualification. | Not suitable for automotive under-hood or extended-temperature industrial control cabinets. | Select when cost sensitivity outweighs extended temperature need and AEC-Q100 is not mandated. |
| Winbond W25Q128JVSIM | 128 Mb SPI flash with Quad I/O, but no integrated ECC, no OTP array, and only 10K erase cycles. | Lacks hardware-level data integrity and secure provisioning features required for safety-certified systems. | Choose for basic code storage where ECC and security are handled externally or omitted. |
Compared with S25FL127SABNFI100, the S25FL128SAGNFI101 offers identical functionality at lower cost but sacrifices extended temperature and automotive qualification, while the W25Q128JVSIM trades robustness and security for broader vendor availability and simpler integration in non-safety-critical designs.
Availability
S25FL127SABNFI100 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, and edge AI accelerators requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 2 qualification.
Supply support for S25FL127SABNFI100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FL-S family targets high-reliability embedded systems needing fast, secure, and temperature-resilient serial flash - designed specifically for boot code storage, firmware updates, and configuration persistence in mission-critical environments.
FAQ
Does S25FL127SABNFI100 support XIP (execute-in-place) operation?
Yes, it supports XIP via Quad Read commands with deterministic latency and no internal wait states. The device delivers consistent <100 ns access time across temperature and voltage ranges, enabling direct code execution from flash without copying to RAM - verified in Infineon's AN219147 application note for Cortex-M7 microcontrollers.
What is the function of the HOLD# pin in Quad I/O mode?
In Quad I/O mode, HOLD# becomes IO3 - the fourth bidirectional data line used for parallel data transfer during Quad Read, Quad Page Program, and Quad Enable commands. Its hold function is disabled when Quad mode is active, as confirmed in Section 3.9 of the datasheet Rev. *K.
How is the 1024-byte OTP array programmed and locked?
The OTP array is programmed using the 0x4B Advanced Sector Protection command with password authentication, then permanently locked via the 0x9F OTP Lock command. Once locked, no further writes or erases are possible - this behavior is hardware-enforced and irreversible, as specified in Section 10.7 of the datasheet.
Can S25FL127SABNFI100 be used in place of S25FL128SAGNFI101?
Yes, pinout, command set, and timing are identical, making it a drop-in replacement - but S25FL127SABNFI100 adds AEC-Q100 Grade 2 qualification and +105°C operation. Designers must validate thermal margin and automotive qualification requirements before substitution in production systems.
S25FL127SABNFI100 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (5x6)
S25FL127SABNFI100 FAQ
1.How can I place an order for S25FL127SABNFI100 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL127SABNFI100 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL127SABNFI100 reliable?
The price and inventory of S25FL127SABNFI100 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL127SABNFI100 is usually 5 days.
3.What payment methods are accepted for S25FL127SABNFI100?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL127SABNFI100 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL127SABNFI100?
S25FL127SABNFI100 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL127SABNFI100 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL127SABNFI100?
For technical support, including S25FL127SABNFI100 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL127SABNFI100 requirements.
6.How does Aetrix verify that S25FL127SABNFI100 is sourced from the original manufacturer or authorized distributors?
All S25FL127SABNFI100 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL127SABNFI100 meets industry standards.
7.What is the process for return or replacement of S25FL127SABNFI100?
All S25FL127SABNFI100 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL127SABNFI100, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL127SABNFI100 part is unused and in its original packaging.
Return procedure for S25FL127SABNFI100:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL127SABNFI100 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
