My Inquiry
My Account
Infineon Technologies S25FL127SABNFI101
- Part No.:
- S25FL127SABNFI101
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
S25FL127SABNFI101.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:705
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL127SABNFI101 from Infineon is a 128 Mb (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and 2.7–3.6 V operating range. It supports Quad Read at up to 54 MBps, features hardware ECC, 100,000 program-erase cycles per sector, and 20-year data retention. Used in boot code storage for industrial microcontrollers and FPGA configuration.
For engineers reviewing the S25FL127SABNFI101 datasheet, S25FL127SABNFI101 pinout, S25FL127SABNFI101 application, or S25FL127SABNFI101 equivalent, key selection factors include hybrid/uniform sector erase options, OTP array size (1024 bytes), AEC-Q100 Grade 2 qualification, and WSON 6×5 mm package compatibility with legacy FL-S footprints.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with dual-plane read capability and configurable addressing (24-/32-bit). Its SPI-MIO interface supports all four clock modes (0/3 polarity-phase combinations) and enables simultaneous dual/quad I/O transfers during read and QPP programming.
The internal ECC engine performs real-time single-bit error correction without software overhead, while the CFI and SFDP (JESD216B) tables provide standardized configuration discovery. Sector protection is implemented via status register bits, ASP commands, and hardware WP#/HOLD# pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mb (16 MB) - sufficient for full FPGA bitstreams or multi-stage bootloader images |
| Read Speed | Quad Read at 108 MHz = 54 MBps - enables sub-300 ms boot time for 16 MB firmware |
| Erase Architecture | Hybrid sector: sixteen 4-KB sectors + remaining 64-KB sectors - balances fine-grained update flexibility with bulk erase efficiency |
| Endurance | 100,000 program-erase cycles per sector - supports field firmware updates over 10+ years of operation |
| Data Retention | 20 years minimum at 85°C - validated for industrial control systems with no maintenance access |
| OTP Array | 1024 bytes one-time programmable - stores cryptographic keys or device-specific calibration data permanently |
| Supply Range | 2.7 V to 3.6 V - compatible with 3.3 V logic rails and tolerates brown-out conditions down to 2.7 V |
Pinout & Package
Package: 8-contact WSON (6 mm × 5 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock | Input clock driving all SPI timing; supports up to 108 MHz for Quad Read and QPP operations |
| IO0 | Serial Input / Data Line 0 | Bi-directional; carries command/address/data in single/dual/quad mode; functions as SI in standard SPI |
| IO1 | Serial Output / Data Line 1 | Bi-directional; outputs read data in single/dual/quad mode; functions as SO in standard SPI |
| IO2 | Write Protect / Data Line 2 | Hardware write protection when low; serves as input during quad reads and QPP programming |
| IO3 | Hold / Data Line 3 | Pauses ongoing SPI transfer when low; doubles as RESET# in some configurations |
| VCC | Power Supply | 3.0 V nominal core supply; requires local 1 µF ceramic decoupling adjacent to pin |
| VSS | Ground | Signal and power return path; must be connected to low-impedance PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Function | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates external boot controller requirement |
| Internal Hardware ECC | Real-time single-bit error correction with no CPU intervention - ensures reliability in radiation-prone environments |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - prevents unauthorized firmware modification in deployed devices |
| Uniform Sector Option | 256-KB logical erase blocks - maintains software compatibility across FL-S family densities and future upgrades |
| SFDP Compliance | JESD216B-compliant parameter table - enables automatic driver configuration in Linux MTD and U-Boot |
Applications
| Industrial PLC Firmware Storage | FPGA Configuration Memory |
|---|---|
Use Scenario: Storing firmware images and runtime parameters in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped to microcontroller address space; accessed via SPI during cold start and firmware updates. Use Value: Hybrid sector architecture allows patching of critical control routines in 4-KB sectors without erasing full 64-KB blocks, minimizing downtime. | Use Scenario: Holding configuration bitstreams for Xilinx Artix-7 and Intel Cyclone V FPGAs in test equipment and medical imaging systems. IC Role / Device Role / Timing Role: Quad Read-capable serial flash providing fast, deterministic configuration load times under tight timing constraints. Use Value: 54 MBps Quad Read speed reduces FPGA configuration time to <250 ms, meeting system-level boot latency requirements. |
| Automotive ADAS Boot Loader | Network Router Secure Boot |
Use Scenario: Storing certified boot loader and safety monitor code in AEC-Q100 Grade 2 radar processing modules. IC Role / Device Role / Timing Role: Trusted execution root-of-trust component; OTP array stores hash keys for secure boot verification. Use Value: AEC-Q100 Grade 2 qualification (–40°C to +105°C) and 20-year retention ensure integrity across vehicle lifetime without recalibration. | Use Scenario: Enabling secure firmware validation and rollback protection in enterprise-grade 10G Ethernet routers. IC Role / Device Role / Timing Role: Dual-role memory: holds signed firmware images and stores revocation lists in protected OTP and ASP-locked sectors. Use Value: ASP and block protection prevent malicious overwrite of boot code during remote firmware updates over untrusted networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGNFI101 | Same die, 128 Mb density, but with AEC-Q100 Grade 3 (–40°C to +85°C) and different temperature screening | Qualified for less thermally demanding automotive ECUs; lacks Grade 2 extended temperature support | Select when industrial temperature range suffices and cost optimization is prioritized over extended thermal margin |
| MX25L12835FZNI-10G | 128 Mb Macronix part; supports only 80 MHz max Quad Read (40 MBps); no built-in ECC or ASP | Lacks hardware ECC and advanced sector protection; requires external error handling and software-based protection schemes | Choose where BOM cost is critical and system-level ECC or security is implemented in host firmware |
Compared with S25FL127SABNFI101, the S25FL128SAGNFI101 offers identical performance with relaxed temperature grading, while the MX25L12835FZNI-10G trades hardware reliability features for lower unit cost-making it suitable only when host-side error management and simplified security are acceptable.
Availability
S25FL127SABNFI101 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, FPGA configuration systems, and network infrastructure requiring stable component supply across long product lifecycles.
Supply support for S25FL127SABNFI101 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life non-volatile storage-designed specifically for boot code, FPGA configuration, and firmware update resilience in harsh environments.
FAQ
What is the maximum clock frequency supported for Quad Read operations?
The S25FL127SABNFI101 supports Quad Read at up to 108 MHz, delivering 54 MBps throughput. This is specified under VCC = 3.0 V and TA = 25°C, with timing compliance verified per AC characteristics in Section 6.4 of the datasheet. Operation above 100 MHz requires careful PCB layout with controlled impedance and minimized trace length.
Does this device require external ECC circuitry?
No. The device integrates hardware-based ECC that automatically detects and corrects single-bit errors during read operations. No external circuitry or host CPU intervention is needed. The ECC engine operates transparently and is enabled by default; disabling it is not supported per the datasheet.
Can the 4-KB sectors be erased independently of the 64-KB sectors?
Yes. In hybrid sector mode, the sixteen 4-KB sectors at the top or bottom of the address space are physically distinct and can be erased individually using dedicated 4-KB erase commands. These sectors do not share erase blocks with the main 64-KB regions, enabling precise firmware patching without disturbing adjacent code.
Is the WSON 6×5 mm package pin-compatible with earlier FL-S devices?
Yes. The 8-contact WSON package (6 mm × 5 mm) uses the same pinout and footprint as S25FL064L and S25FL128L devices. Pin assignments for CS#, SCK, IO0–IO3, VCC, and VSS match exactly, allowing drop-in replacement in existing layouts without redesign.
S25FL127SABNFI101 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 108 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (5x6)
S25FL127SABNFI101 FAQ
1.How can I place an order for S25FL127SABNFI101 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL127SABNFI101 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL127SABNFI101 reliable?
The price and inventory of S25FL127SABNFI101 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL127SABNFI101 is usually 5 days.
3.What payment methods are accepted for S25FL127SABNFI101?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL127SABNFI101 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL127SABNFI101?
S25FL127SABNFI101 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL127SABNFI101 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL127SABNFI101?
For technical support, including S25FL127SABNFI101 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL127SABNFI101 requirements.
6.How does Aetrix verify that S25FL127SABNFI101 is sourced from the original manufacturer or authorized distributors?
All S25FL127SABNFI101 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL127SABNFI101 meets industry standards.
7.What is the process for return or replacement of S25FL127SABNFI101?
All S25FL127SABNFI101 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL127SABNFI101, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL127SABNFI101 part is unused and in its original packaging.
Return procedure for S25FL127SABNFI101:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL127SABNFI101 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
