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Infineon Technologies S25FL128P0XMFI003M
- Part No.:
- S25FL128P0XMFI003M
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL128P0XMFI003M.pdf
- Description:
- IC FLASH 128MBIT SPI 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,607
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Product details
Overview
S25FL128P0XMFI003M from Cypress Semiconductor is a 128-Mbit, 3.0 V SPI Flash memory with uniform 64 KB sector architecture, 104 MHz max clock rate, 256-byte page programming (1.5 ms typical), and industrial temperature range (–40°C to +85°C). It supports standard and fast read, sector/bulk erase, deep power-down (3 µA typical), and hardware/software write protection - deployed in embedded boot code storage for industrial controllers.
For engineers reviewing the S25FL128P0XMFI003M datasheet, S25FL128P0XMFI003M pinout, S25FL128P0XMFI003M application, or S25FL128P0XMFI003M equivalent, key selection criteria include sector size uniformity (64 KB), WP#/ACC-accelerated programming capability, SOIC-16 vs WSON-8 package compatibility, and migration path to S25FL128S.
Technical Context
This SPI Flash implements a single-supply 2.7–3.6 V interface with CPOL=0/CPHA=0 and CPOL=1/CPHA=1 mode support. It uses Cypress's 0.09 µm MirrorBit® process and features dual erase granularity: 0.5 s typical for 64 KB sectors and 128 s for bulk erase.
Memory protection combines hardware (WP#/ACC pin) and software (Status Register BP3–BP0 bits) control, enabling selective lock of memory regions. The device supports accelerated programming via 8.5–9.5 V applied to WP#/ACC, reducing page program time to 1.2 ms typical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mbit (16 MB) - sufficient for firmware images and configuration data in resource-constrained embedded systems |
| Supply Voltage | 2.7 V to 3.6 V - compatible with standard 3.3 V logic rails without level-shifting |
| Max Clock Rate | 104 MHz - enables high-throughput boot code loading over SPI |
| Page Program Time | 1.5 ms typical (256 bytes) - defines minimum latency per write burst in firmware update routines |
| Sector Erase Time | 0.5 s typical (64 KB sector) - determines granularity and speed of field-upgradable partition erasure |
| Deep Power Down Current | 3 µA typical - critical for battery-backed or energy-harvesting applications requiring ultra-low quiescent draw |
| Data Retention | 20 years typical - ensures long-term reliability of stored calibration or security keys |
| Cycling Endurance | 100,000 cycles per sector - supports frequent OTA update partitions without premature wear-out |
Pinout & Package
Package: 16-pin SOIC (300 mil, 7.5 mm width), industry-standard footprint with x8 parallel programming support.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; must fall before any command execution; places device in active power mode |
| SCK | Serial Clock Input | Drives timing for SI latching (rising edge) and SO output (falling edge); supports SPI Modes 0 and 3 |
| SI | Serial Input | Accepts commands, addresses, and program data; latched on rising SCK edge |
| SO/PO7 | Serial Output / Parallel Data Bit 7 | Outputs read data on falling SCK edge; functions as PO7 in x8 parallel mode (SOIC only) |
| HOLD# | Hold Input | Pauses ongoing SPI transfer without deselecting device; requires CS# low to activate |
| WP#/ACC | Write Protect / Accelerated Programming Input | Low = hardware write protection; 8.5–9.5 V = enables faster 1.2 ms page programming |
| VCC | Power Supply | Single 2.7–3.6 V supply powers all operations including internal voltage generation for programming |
| GND | Ground | Reference for all I/O and internal circuitry; central thermal pad on WSON variant must be tied to GND at 0 mV potential |
Key Features
| Feature | Design Value |
|---|---|
| Uniform 64 KB Sector Architecture | Enables deterministic erase scheduling and simplifies flash translation layer (FTL) implementation in MCU-based bootloaders |
| Accelerated Programming Mode | Reduces page program time from 1.5 ms to 1.2 ms typical when 8.5–9.5 V applied to WP#/ACC - improves firmware update throughput |
| Hardware + Software Write Protection | WP#/ACC pin and Status Register BP3–BP0 bits jointly enforce multi-layer protection against accidental overwrite of bootloader or security keys |
| Deep Power Down Mode (3 µA) | Extends battery life in always-on IoT edge nodes by suppressing all internal activity while retaining memory contents |
| Industrial Temperature Range (–40°C to +85°C) | Validates operation in harsh environments such as factory automation PLCs and outdoor metering equipment |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
Use Scenario: Storing boot firmware and runtime configuration in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic 0.5 s sector erase and 104 MHz read access for fast startup. Use Value: Uniform 64 KB sectors simplify firmware partitioning; 100,000-cycle endurance supports field updates over 10+ years. | Use Scenario: Holding calibrated sensor offsets, device serial numbers, and regulatory compliance data in portable diagnostic instruments. IC Role / Device Role / Timing Role: Secure, long-retention parameter storage with hardware write protection via WP#/ACC pin. Use Value: 20-year data retention and SRWD-enabled hardware lock prevent unauthorized modification of calibration-critical values. |
| Automotive Infotainment Boot Loader | Smart Energy Meter Firmware |
Use Scenario: Hosting primary boot loader and fail-safe recovery image in head unit ECUs where AEC-Q100 qualification is required. IC Role / Device Role / Timing Role: SPI-connected boot memory supporting fast read and controlled erase for dual-bank OTA updates. Use Value: 104 MHz clock enables sub-100 ms boot time; deep power-down mode reduces standby current during vehicle sleep states. | Use Scenario: Storing tariff tables, communication stack binaries, and tamper logs in utility-grade electricity meters with 15+ year service life. IC Role / Device Role / Timing Role: High-reliability firmware archive with 100,000-cycle endurance and industrial temp rating for outdoor deployment. Use Value: Uniform 64 KB sectors align with DLMS/COSEM firmware update blocks; 2.7–3.6 V operation matches meter power rail constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128S0XMFI003 | Successor device with enhanced reliability, same 128 Mbit density, 64 KB sectors, and 104 MHz speed; supports newer Cypress HyperFlash-compatible command set | Designed for new designs; includes improved ECC and extended lifecycle support beyond S25FL128P | Select for new projects requiring long-term availability and factory-supported migration path |
| MX25L12833FZNI-10G | 128 Mbit SPI Flash from Macronix; 104 MHz, 64 KB sectors, 2.7–3.6 V, but lacks WP#/ACC accelerated programming mode and uses different status register layout | Drop-in replacement for basic read/write/erase functions; not suitable where accelerated programming or Cypress-specific protection schemes are used | Choose only if migrating away from Cypress ecosystem and accepting revalidation of protection and timing behavior |
Compared with S25FL128S0XMFI003, the S25FL128P0XMFI003M offers identical sector architecture and timing but lacks updated reliability features and long-term supply assurance; versus MX25L12833FZNI-10G, it provides Cypress-specific accelerated programming and tighter integration with PSoC/Traveo boot ROMs, at the cost of vendor lock-in.
Availability
S25FL128P0XMFI003M is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, and smart energy meter firmware requiring stable component supply despite end-of-life status.
Supply support for S25FL128P0XMFI003M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor, now part of Infineon Technologies, designs high-performance memory and microcontroller solutions for embedded systems, emphasizing reliability and system-level integration.
The S25FL family delivers SPI Flash optimized for secure, high-speed boot code execution in industrial and automotive applications, with emphasis on deterministic erase timing and robust write protection.
FAQ
Is S25FL128P0XMFI003M still recommended for new designs?
No. Cypress explicitly states this part is not recommended for new or current designs. The S25FL128S is the factory-recommended migration path, offering enhanced reliability, extended lifecycle support, and updated command-set compatibility. Designers should transition to S25FL128S for all new projects.
What is the function of the WP#/ACC pin beyond write protection?
The WP#/ACC pin serves dual roles: when driven low, it enables hardware write protection; when supplied with 8.5–9.5 V, it activates accelerated programming mode, reducing page program time from 1.5 ms to 1.2 ms typical. This high-voltage mode requires external charge pump circuitry and is not used during standard operation.
Does S25FL128P0XMFI003M support both SPI Mode 0 and Mode 3?
Yes. The device supports CPOL=0/CPHA=0 (Mode 0) and CPOL=1/CPHA=1 (Mode 3). Input data is latched on the rising edge of SCK, and output data appears after the falling edge in both modes. The bus master must maintain SCK at logic 0 (Mode 0) or logic 1 (Mode 3) during idle periods.
How does the 64 KB uniform sector architecture impact firmware update design?
Uniform 64 KB sectors allow predictable, fixed-time erase operations (0.5 s typical per sector), simplifying flash translation layer (FTL) logic and enabling deterministic OTA update windows. It avoids variable erase times associated with mixed-sector devices, improving real-time system responsiveness during field upgrades.
S25FL128P0XMFI003M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL128P0XMFI003M FAQ
1.How can I place an order for S25FL128P0XMFI003M through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL128P0XMFI003M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL128P0XMFI003M reliable?
The price and inventory of S25FL128P0XMFI003M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL128P0XMFI003M is usually 5 days.
3.What payment methods are accepted for S25FL128P0XMFI003M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL128P0XMFI003M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL128P0XMFI003M?
S25FL128P0XMFI003M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL128P0XMFI003M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL128P0XMFI003M?
For technical support, including S25FL128P0XMFI003M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL128P0XMFI003M requirements.
6.How does Aetrix verify that S25FL128P0XMFI003M is sourced from the original manufacturer or authorized distributors?
All S25FL128P0XMFI003M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL128P0XMFI003M meets industry standards.
7.What is the process for return or replacement of S25FL128P0XMFI003M?
All S25FL128P0XMFI003M units undergo pre-shipment inspection (PSI). If there is an issue with S25FL128P0XMFI003M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL128P0XMFI003M part is unused and in its original packaging.
Return procedure for S25FL128P0XMFI003M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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