Infineon Technologies S25FL128P0XMFI011M
- Part No.:
- S25FL128P0XMFI011M
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL128P0XMFI011M.pdf
- Description:
- IC FLASH 128MBIT SPI 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:4,177
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Product details
Overview
S25FL128P0XMFI011M from Cypress Semiconductor is a 128-Mbit, 3.0 V SPI Flash memory with uniform 64 KB sector architecture, 104 MHz max clock rate, 256-byte page programming (1.5 ms typical), and industrial temperature range (–40°C to +85°C). It operates from 2.7V to 3.6V, supports hardware write protection via WP#/ACC pin, and is used in firmware storage for embedded microcontrollers in industrial control systems.
For engineers reviewing the S25FL128P0XMFI011M datasheet, S25FL128P0XMFI011M pinout, S25FL128P0XMFI011M application, or S25FL128P0XMFI011M equivalent, key selection criteria include sector size configuration (64 KB vs. 256 KB), accelerated programming voltage requirement (8.5–9.5 V on WP#/ACC), Deep Power Down current (3 µA typical), and SOIC-16 vs. WSON-8 package compatibility.
Technical Context
This device implements a serial peripheral interface (SPI) compliant with modes 0 (CPOL=0, CPHA=0) and 3 (CPOL=1, CPHA=1), latching input on SCK rising edge and driving output on falling edge. It uses Cypress's 0.09 µm MirrorBit® process and supports both standard and accelerated programming via external high-voltage injection on WP#/ACC.
Memory organization is configurable as either 256 sectors × 64 KB or 64 sectors × 256 KB; this part (S25FL128P0XMFI011M) is the 64 KB uniform sector variant (model number "00" per ordering table). Protection is enforced through non-volatile BP3–BP0 bits in the status register and hardware SRWD bit activation when WP#/ACC is low.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (16 MB), organized as 256 × 64 KB sectors |
| Supply Voltage | 2.7 V to 3.6 V - single supply enables direct integration with 3.3 V logic without level shifters |
| Max Clock Rate | 104 MHz - supports high-speed firmware readout in boot loaders and real-time code execution |
| Page Program Time | 1.5 ms typical - defines minimum time between consecutive 256-byte writes during field updates |
| Sector Erase Time | 0.5 s typical for 64 KB sector - determines firmware patch latency in over-the-air update scenarios |
| Data Retention | 20 years typical - ensures long-term reliability of stored calibration data or configuration parameters |
| Endurance | 100,000 program/erase cycles per sector - validates suitability for logging or parameter storage with frequent rewrites |
Pinout & Package
Package: 16-pin SOIC (300-mil body width), industry-standard footprint compatible with legacy PCB layouts and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; must fall before any command; places device in active power mode |
| SCK | Serial Clock Input | Drives timing for all SPI transactions; rising edge latches SI, falling edge triggers SO |
| SI | Serial Input | Receives commands, addresses, and program data; sampled on SCK rising edge |
| SO | Serial Output | Transmits read data and status; driven on SCK falling edge; high-impedance when CS# high or HOLD# active |
| HOLD# | Hold Input | Pauses ongoing SPI transfer without deselecting device; requires CS# low to function |
| WP#/ACC | Write Protect / Accelerated Programming Input | Low = hardware write protection; 8.5–9.5 V = enables faster 1.2 ms page programming |
| VCC | Power Supply | 2.7–3.6 V main supply; internally regulates voltages for program/erase operations |
| GND | Ground | Reference for all I/O and internal circuitry; central pad on WSON variant may be tied to GND if at same potential |
Key Features
| Feature | Design Value |
|---|---|
| Uniform 64 KB Sector Architecture | Enables fine-grained firmware partitioning (e.g., bootloader, app, config) with independent erase control |
| Accelerated Programming Mode | Reduces page program time from 1.5 ms to 1.2 ms using 8.5–9.5 V on WP#/ACC pin |
| Deep Power Down Mode | Draws only 3 µA typical - critical for battery-backed systems requiring ultra-low standby current |
| Hardware Write Protection | WP#/ACC pin + SRWD bit prevents accidental writes even during firmware corruption or reset glitches |
| Electronic Signature Readout | RES (ABh) command returns one-byte signature for backward-compatible device identification |
Applications
| Firmware Storage in PLC Controllers | Boot Code Storage for Industrial Gateways |
|---|---|
Use Scenario: Stores firmware image and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile code storage accessed during cold boot and runtime updates via SPI interface. Use Value: 20-year data retention and 100,000-cycle endurance ensure reliable operation across multi-year maintenance cycles without field replacement. | Use Scenario: Holds secure boot loader and encrypted application binaries in edge gateways connecting legacy machinery to cloud platforms. IC Role / Device Role / Timing Role: Primary SPI flash for XIP-capable MCU boot sequence; supports fast 104 MHz reads during initialization. Use Value: Uniform 64 KB sectors allow isolated update of boot loader without erasing application partitions, minimizing downtime. |
| Calibration Data Storage in Test Equipment | FPGA Configuration Storage in Motor Drives |
Use Scenario: Retains sensor calibration coefficients and user-defined test profiles in automated test systems recalibrated quarterly. IC Role / Device Role / Timing Role: Parameter storage accessed via SPI during system power-up and calibration routines. Use Value: Hardware write protection (WP#/ACC + SRWD) prevents overwrite during transient ESD events or software faults. | Use Scenario: Stores FPGA bitstream for servo motor control logic in variable-frequency drives subject to thermal cycling. IC Role / Device Role / Timing Role: Configuration memory loaded at power-on-reset via SPI master; supports parallel programming mode in SOIC package. Use Value: 64 KB sector erase (0.5 s typical) enables rapid reconfiguration without full device erase, reducing commissioning time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128S0XMFI011M | Successor device with enhanced reliability, same pinout/package, 104 MHz speed, but improved ECC and longer endurance (200K cycles) | Designed for new designs requiring extended lifecycle support and higher data integrity | Select for new designs; migration path recommended by Cypress |
| MX25L12833FZNI-10G | 128 Mbit SPI Flash, 104 MHz, 64 KB sectors, but lacks accelerated programming mode and uses different status register layout | Compatible for basic read/write use cases but requires firmware adaptation for protection and erase command mapping | Use only if S25FL128P is unavailable and design can accommodate non-accelerated programming and alternate protection scheme |
Compared with S25FL128P0XMFI011M, the S25FL128S offers higher endurance and built-in ECC for mission-critical firmware, while MX25L12833F requires driver-level changes due to differing command set and protection implementation - making S25FL128S the preferred drop-in upgrade.
Availability
S25FL128P0XMFI011M is available at Aetrix Electronics and suitable for industrial control systems, embedded gateways, test instrumentation, and motor drive firmware storage requiring stable component supply and long-term obsolescence management.
Supply support for S25FL128P0XMFI011M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer applications.
The S25FL family was designed specifically for high-reliability, low-power SPI Flash applications in industrial and embedded systems where firmware integrity, long data retention, and robust write protection are essential.
FAQ
What is the function of the WP#/ACC pin on S25FL128P0XMFI011M?
The WP#/ACC pin serves dual functions: when held low, it enables hardware write protection for memory regions defined by status register BP bits; when supplied with 8.5–9.5 V, it activates accelerated programming mode, reducing page program time from 1.5 ms to 1.2 ms. It is not a standard logic-level input in accelerated mode and requires external voltage generation.
Does S25FL128P0XMFI011M support Quad SPI or Dual SPI modes?
No, S25FL128P0XMFI011M supports only standard single-data-line SPI (Mode 0 and Mode 3). It does not implement Quad SPI (QSPI) or Dual SPI protocols. The SO and SI pins are dedicated single-ended lines; no QIO, QOUT, DIO, or DOUT commands are defined in its command set.
Can S25FL128P0XMFI011M be used in place of S25FL128S in existing designs?
S25FL128P0XMFI011M is not a drop-in replacement for S25FL128S: the S25FL128S includes enhanced features like on-die ECC and higher endurance (200K vs. 100K cycles), and its status register layout differs. While pinout and basic command set are compatible, firmware validation is required to confirm behavior under error conditions and protection settings.
What is the purpose of the exposed pad on the WSON package variant?
The exposed central pad on the WSON-8 package (not used in this SOIC variant) is a thermal and mechanical feature, not an electrical connection. It must not be connected to any voltage or signal. If tied to GND, PCB routing must ensure 0 mV potential difference between the pad and the GND pin to avoid leakage or latch-up; otherwise, it should remain floating per Cypress recommendation.
S25FL128P0XMFI011M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL128P0XMFI011M FAQ
1.How can I place an order for S25FL128P0XMFI011M through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL128P0XMFI011M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL128P0XMFI011M reliable?
The price and inventory of S25FL128P0XMFI011M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL128P0XMFI011M is usually 5 days.
3.What payment methods are accepted for S25FL128P0XMFI011M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL128P0XMFI011M transactions.
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S25FL128P0XMFI011M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL128P0XMFI011M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL128P0XMFI011M?
For technical support, including S25FL128P0XMFI011M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL128P0XMFI011M requirements.
6.How does Aetrix verify that S25FL128P0XMFI011M is sourced from the original manufacturer or authorized distributors?
All S25FL128P0XMFI011M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL128P0XMFI011M meets industry standards.
7.What is the process for return or replacement of S25FL128P0XMFI011M?
All S25FL128P0XMFI011M units undergo pre-shipment inspection (PSI). If there is an issue with S25FL128P0XMFI011M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL128P0XMFI011M part is unused and in its original packaging.
Return procedure for S25FL128P0XMFI011M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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