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Infineon Technologies S25FL128P0XNFI000M
- Part No.:
- S25FL128P0XNFI000M
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
S25FL128P0XNFI000M.pdf
- Description:
- IC FLASH 128MBIT SPI 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,085
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Product details
Overview
S25FL128P0XNFI000M from Cypress Semiconductor is a 128-Mbit, 3.0 V SPI Flash memory with uniform 64 KB sector architecture, 104 MHz max clock rate, and industrial temperature range (–40°C to +85°C). It supports Page Program (up to 256 bytes in 1.5 ms), 64 KB sector erase (0.5 s typical), and Deep Power Down mode (3 µA typical), deployed in embedded boot code storage for microcontroller-based industrial controllers.
For engineers reviewing the S25FL128P0XNFI000M datasheet, S25FL128P0XNFI000M pinout, S25FL128P0XNFI000M application, or S25FL128P0XNFI000M equivalent, key selection considerations include 64 KB uniform sector granularity, WP#/ACC pin-enabled accelerated programming, SO/WSON package compatibility, and software-controlled block protection via BP3–BP0 bits.
Technical Context
The S25FL128P0XNFI000M implements a serial peripheral interface compliant with SPI Modes 0 and 3 (CPOL=0/CPHA=0 and CPOL=1/CPHA=1), latching input on SCK rising edge and driving output on falling edge. It uses internal charge pumps to generate programming voltages, eliminating external high-voltage supplies except when using Accelerated Programming mode via 8.5–9.5 V applied to WP#/ACC.
Memory organization comprises 256 uniform 64 KB sectors (128 Mbit total), with non-volatile block protection controlled by four Status Register bits (BP3–BP0) and hardware write protection enabled when SRWD=1 and WP#/ACC is low. Erase operations are executed via SE (20h/D8h) and BE (60h/C7h) commands, while program verification is handled internally without host polling beyond WIP bit monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (16 MB), organized as 256 × 64 KB sectors - enables full firmware image storage for mid-tier MCUs. |
| Supply Voltage | 2.7 V to 3.6 V single supply - compatible with standard 3.3 V system rails without level-shifting. |
| Max Clock Rate | 104 MHz - supports high-speed read throughput up to ~13 MB/s in FAST_READ mode. |
| Page Program Time | 1.5 ms typical (256-byte page) - defines minimum write latency per page in standard mode. |
| 64 KB Sector Erase | 0.5 s typical - determines firmware update granularity and field upgrade responsiveness. |
| Data Retention | 20 years typical - ensures long-term reliability for unpowered industrial deployments. |
| Cycling Endurance | 100,000 program/erase cycles per sector - supports frequent OTA updates in edge devices. |
| Deep Power Down Current | 3 µA typical - enables ultra-low-power sleep states in battery-backed systems. |
Pinout & Package
Package: 8-pin WSON (6 mm × 8 mm, no-lead), with exposed thermal pad (not electrically connected; may be tied to GND with zero potential difference).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; device enters active power mode only when CS# is low and remains responsive to commands. |
| SO | Serial Output | Drives data on falling edge of SCK; tri-stated when CS# is high or HOLD# is asserted. |
| WP#/ACC | Write Protect / Accelerated Programming Input | Low = hardware write protection; 8.5–9.5 V = enables faster 1.2 ms page programming. |
| HOLD# | Hold Input | Pauses ongoing SPI transaction without deselecting device; requires CS# low to function. |
| SCK | Serial Clock Input | Controls timing: latches SI on rising edge, drives SO on falling edge; supports Mode 0 and Mode 3. |
| SI | Serial Input | Receives commands, addresses, and program data on rising edge of SCK. |
| VCC | Power Supply | 2.7–3.6 V main supply; powers internal logic and charge pumps for program/erase operations. |
| GND | Ground | Reference return path for all signals and internal voltage regulation. |
Key Features
| Feature | Design Value |
|---|---|
| Uniform 64 KB Sector Architecture | Enables precise firmware partitioning and over-the-air update of individual functional modules without erasing unrelated code. |
| Accelerated Programming Mode | Reduces page program time from 1.5 ms to 1.2 ms using externally applied 8.5–9.5 V on WP#/ACC - cuts cumulative write time in large-image updates. |
| Four-Bit Block Protection (BP3–BP0) | Configures up to 16 distinct protected memory regions (e.g., bootloader, calibration tables) via software-only writes to Status Register. |
| Deep Power Down (DP) Command | Reduces current draw to 3 µA while locking out all program/erase commands - prevents corruption during brown-out or backup battery operation. |
| Hardware Write Protection (SRWD + WP#/ACC) | When SRWD=1 and WP#/ACC is low, BP3–BP0 and SRWD become read-only - eliminates accidental reconfiguration of protected regions. |
Applications
| Industrial PLC Firmware Storage | Medical Device Bootloader Memory |
|---|---|
|
Use Scenario: Storing certified bootloader and application firmware in DIN-rail mounted programmable logic controllers requiring field-upgradable code with tamper resistance. IC Role / Device Role / Timing Role: Non-volatile boot code repository accessed at power-on reset via SPI master; executes within 100 ms of VCC stabilization. Use Value: 64 KB uniform sectors allow independent update of safety-critical bootloader without affecting application logic; BP3–BP0 bits prevent unauthorized modification during service access. |
Use Scenario: Holding FDA-compliant boot firmware and diagnostic routines in portable ultrasound units with strict power budget and data integrity requirements. IC Role / Device Role / Timing Role: SPI-connected primary boot memory; initialized by ARM Cortex-M4 before loading RTOS kernel from external RAM. Use Value: Deep Power Down mode (3 µA) extends battery life between charges; 20-year data retention ensures calibration persistence across device lifetime. |
| Smart Energy Meter Code Storage | Automotive Body Control Module (BCM) Configuration |
|
Use Scenario: Storing metrology firmware and tariff tables in ANSI C12.22-compliant smart meters operating in outdoor enclosures (-40°C to +85°C). IC Role / Device Role / Timing Role: Industrial-temp-rated SPI Flash providing deterministic read latency (<50 ns address setup) for real-time metering calculations. Use Value: 100,000 P/E cycles support daily firmware patches over 27 years; uniform sectors simplify secure OTA delta updates. |
Use Scenario: Storing vehicle-specific configuration parameters (e.g., door lock logic, lighting profiles) in BCMs where EEPROM endurance is insufficient. IC Role / Device Role / Timing Role: Secondary non-volatile memory mapped via SPI for parameter storage separate from main MCU flash. Use Value: Hardware write protection (SRWD + WP#/ACC) prevents inadvertent overwrite during CAN bus reprogramming sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128S0XNFI000M | Successor device with enhanced 133 MHz clock, 1.2 ms sector erase, and improved ECC for bit error correction. | Required for new designs per Cypress migration notice; supports higher-speed bootloading and extended data integrity. | Select for new designs needing longer product lifecycle support and tighter bit-error tolerance. |
| MX25L12833FZNI-10G | 128 Mbit SPI Flash with 104 MHz clock, but uses different command set (e.g., 4-byte addressing not supported) and lacks WP#/ACC accelerated mode. | Compatible in basic read/write use cases but requires firmware changes for erase command mapping and protection register layout. | Choose only if existing design already uses Macronix toolchain and cannot accommodate Cypress-specific acceleration or BP bit structure. |
Compared with S25FL128S0XNFI000M, this part lacks ECC and newer timing specs but retains identical pinout and command compatibility for legacy board reuse; versus MX25L12833FZNI-10G, it offers superior protection configurability and accelerated programming - critical for secure, high-throughput firmware updates.
Availability
S25FL128P0XNFI000M is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device bootloader memory, and smart energy meter code storage requiring stable component supply and long-term obsolescence management.
Supply support for S25FL128P0XNFI000M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability non-volatile memory and microcontroller solutions for industrial, automotive, and IoT applications.
The S25FL family delivers SPI Flash optimized for embedded boot code storage, featuring robust data retention, flexible protection schemes, and industrial-grade temperature performance - specifically engineered for mission-critical firmware persistence.
FAQ
Is S25FL128P0XNFI000M still recommended for new designs?
No. Cypress explicitly states this part is not recommended for new or current designs. The S25FL128S0XNFI000M is the factory-recommended migration path, offering higher speed, improved erase times, and enhanced ECC. Design reuse is permissible only for legacy repair or continuity programs with documented lifecycle risk acceptance.
What is the function of the exposed pad on the WSON package?
The exposed central pad on the 8-pin WSON package is a thermal pad with no electrical connection. It must not be tied to any voltage or signal net. Connecting it to GND is allowed only if PCB routing guarantees 0 mV potential difference between the pad and the GND (VSS) lead - otherwise, thermal stress or leakage may occur.
How does Accelerated Programming mode reduce programming time?
Applying 8.5–9.5 V to the WP#/ACC pin activates an internal high-voltage pump that speeds up Fowler-Nordheim tunneling during programming. This reduces typical 256-byte page program time from 1.5 ms to 1.2 ms - a 20% improvement confirmed in the datasheet's AC characteristics table.
Can S25FL128P0XNFI000M be used in parallel programming mode?
No. Parallel programming mode (x8 data bus via PO[7:0]) is supported only on the 16-pin SO package variant. The S25FL128P0XNFI000M uses the 8-pin WSON package (NFI suffix), which has no PO pins and operates exclusively in serial SPI mode.
S25FL128P0XNFI000M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x8)
S25FL128P0XNFI000M FAQ
1.How can I place an order for S25FL128P0XNFI000M through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL128P0XNFI000M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL128P0XNFI000M reliable?
The price and inventory of S25FL128P0XNFI000M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL128P0XNFI000M is usually 5 days.
3.What payment methods are accepted for S25FL128P0XNFI000M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL128P0XNFI000M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL128P0XNFI000M?
S25FL128P0XNFI000M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL128P0XNFI000M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL128P0XNFI000M?
For technical support, including S25FL128P0XNFI000M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL128P0XNFI000M requirements.
6.How does Aetrix verify that S25FL128P0XNFI000M is sourced from the original manufacturer or authorized distributors?
All S25FL128P0XNFI000M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL128P0XNFI000M meets industry standards.
7.What is the process for return or replacement of S25FL128P0XNFI000M?
All S25FL128P0XNFI000M units undergo pre-shipment inspection (PSI). If there is an issue with S25FL128P0XNFI000M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL128P0XNFI000M part is unused and in its original packaging.
Return procedure for S25FL128P0XNFI000M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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