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Infineon Technologies S25FL128P0XNFI003
- Part No.:
- S25FL128P0XNFI003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
S25FL128P0XNFI003.pdf
- Description:
- IC FLASH 128MBIT SPI 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:2,882
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Product details
Overview
S25FL128P0XNFI003 from Cypress Semiconductor is a 128-Mbit, 3.0 V SPI Flash memory with uniform 64 KB sector architecture, 104 MHz max clock rate, 256-byte page programming (1.5 ms typical), and industrial temperature range (–40°C to +85°C) in an 8-pin WSON (6 × 8 mm) package. It supports standard and fast read, sector/bulk erase, deep power-down (3 µA typical), and hardware/software memory protection via WP#/ACC and status register BP bits.
For engineers reviewing the S25FL128P0XNFI003 datasheet, S25FL128P0XNFI003 pinout, S25FL128P0XNFI003 application, or S25FL128P0XNFI003 equivalent, key selection criteria include 64 KB uniform sector granularity, 2.7–3.6 V single-supply operation, SPI Mode 0/3 compatibility, accelerated programming support via WP#/ACC voltage boost, and industrial-grade data retention (20 years).
Technical Context
The S25FL128P0XNFI003 implements a serial peripheral interface (SPI) with CPOL=0/CPHA=0 and CPOL=1/CPHA=1 mode support, using SI/SO for half-duplex serial data transfer synchronized to SCK. It integrates on-chip voltage regulation for program/erase operations and uses internal logic to interpret command opcodes (e.g., 02h for Page Program, D8h/20h for Sector Erase, C7h/60h for Bulk Erase).
Memory organization comprises 256 uniform 64 KB sectors (total 128 Mbit), with block protection controlled by four non-volatile BP3–BP0 bits in the status register. The WP#/ACC pin serves dual function: low-level write protection when grounded, or high-voltage (8.5–9.5 V) enablement of accelerated programming mode-exclusive to this device family's MirrorBit® process.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (16 MB), organized as 256 × 64 KB sectors - enables deterministic firmware partitioning and OTA update staging. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V system rails without level-shifting; internally regulated for program/erase. |
| Max Clock Rate | 104 MHz - supports high-throughput boot code loading and configuration data streaming over SPI. |
| Page Program Time | 1.5 ms typical (256 bytes) - defines minimum latency per write burst; accelerated mode reduces to 1.2 ms with WP#/ACC voltage boost. |
| Sector Erase Time | 0.5 s typical (64 KB) - determines firmware update granularity and recovery window after partial corruption. |
| Data Retention | 20 years typical - ensures long-term reliability in unpowered storage for industrial logging or calibration data. |
| Standby Current | 200 µA max - suitable for low-power wake-on-event architectures where flash remains powered but idle. |
| Deep Power-Down | 3 µA typical - allows near-zero static power during extended sleep cycles without losing memory contents. |
Pinout & Package
Package: 8-pin WSON (6 × 8 mm), exposed thermal pad (not electrically connected; may be tied to GND with zero potential difference).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable signal; must fall before any command; places device in active mode or high-Z SO when high. |
| SO | Serial Output | Drives data on falling edge of SCK; tri-stated during HOLD# or CS# high; shares pin with PO7 in parallel mode (not used in WSON). |
| WP#/ACC | Write Protect / Accelerated Programming Input | Low = hardware write protection; 8.5–9.5 V = enables faster 1.2 ms page programming; requires external voltage source. |
| HOLD# | Hold Input | Pauses ongoing SPI transaction without deselecting device; SO goes high-Z; requires CS# low to be effective. |
| SCK | Serial Clock Input | Controls timing: latches SI on rising edge, outputs SO on falling edge; supports Mode 0 and Mode 3 SPI. |
| SI | Serial Input | Accepts commands, addresses, and program data on rising edge of SCK; no internal pull-up/down. |
| VCC | Power Supply | 2.7–3.6 V single supply; powers core logic, I/O, and internal charge pumps for program/erase. |
| GND | Ground | Reference for all signals and internal regulation; must be low-impedance connection to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Uniform 64 KB Sector Architecture | Enables precise firmware image partitioning and atomic sector-level updates without cross-sector dependencies. |
| Accelerated Programming Mode | Reduces page program time from 1.5 ms to 1.2 ms using externally applied 8.5–9.5 V on WP#/ACC - improves production programming throughput. |
| Four-Bit Block Protection (BP3–BP0) | Allows software-defined read-only locking of up to 1/2, 1/4, 1/8, or full memory array - prevents accidental overwrite of bootloader or calibration tables. |
| Deep Power-Down (DP) Command (B9h) | Reduces current to 3 µA while preserving memory state - critical for battery-backed systems requiring multi-year standby. |
| Electronic Signature Read (RES, ABh) | Provides one-byte backward-compatible ID for legacy system compatibility checks without requiring full RDID/READ_ID sequence. |
Applications
| Industrial PLC Firmware Storage | Medical Device Configuration Memory |
|---|---|
|
Use Scenario: Storing firmware images and field-upgradeable logic in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic 64 KB erase boundaries and 20-year data retention under thermal cycling. Use Value: Enables safe, sector-atomic firmware updates without risk of partial corruption; WP#/ACC pin allows factory-programming acceleration. |
Use Scenario: Holding calibrated sensor offsets, user preferences, and regulatory-compliant device settings in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, low-power configuration store with hardware write protection and deep power-down for battery longevity. Use Value: BP3–BP0 bits lock calibration data against runtime writes; 3 µA deep power-down extends single-charge battery life beyond 5 years. |
| Automotive Infotainment Boot Memory | Network Router Configuration Archive |
|
Use Scenario: Hosting boot code and recovery images for head-unit microcontrollers in vehicles meeting AEC-Q100 Grade 3 requirements. IC Role / Device Role / Timing Role: SPI-connected primary boot memory with industrial temperature rating (–40°C to +85°C) and fast 104 MHz read access. Use Value: 104 MHz clock supports rapid boot sequences; uniform 64 KB sectors align with automotive OTA update packet sizes. |
Use Scenario: Archiving router configuration profiles, certificates, and failover images across multiple firmware versions. IC Role / Device Role / Timing Role: High-reliability SPI Flash with 100,000 program/erase cycles per sector and status register monitoring for write completion. Use Value: WIP bit polling enables robust host-side write verification; sector erase (0.5 s) allows quick config rollback without full reflash. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SPI Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128S0XNFI003 | Successor device with same density, package, and pinout; improved 133 MHz clock, lower 1.8 V–3.6 V VCC range, and enhanced ECC support. | Designed for new designs requiring longer product lifecycle and higher performance; not drop-in due to voltage and timing changes. | Select for new designs needing extended availability and higher-speed read; verify timing margins and voltage regulator compatibility. |
| MX25L12833FZNI-10G | 128 Mbit SPI Flash in 8-pin WSON; 104 MHz max, 64 KB sectors, but lacks WP#/ACC accelerated programming and uses different status register layout. | Compatible for basic read/write/erase functions; no hardware-accelerated programming or identical BP bit mapping. | Use where accelerated programming is unnecessary and existing firmware does not rely on Cypress-specific RES/ABh signature or BP bit behavior. |
Compared with S25FL128S0XNFI003, this part offers legacy support and known timing but lacks ECC and wider voltage range; versus MX25L12833FZNI-10G, it provides unique WP#/ACC acceleration and Cypress-specific command compatibility at the cost of vendor lock-in.
Availability
S25FL128P0XNFI003 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device configuration memory, and automotive infotainment boot memory requiring stable component supply across extended production lifecycles.
Supply support for S25FL128P0XNFI003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power memory and microcontroller solutions for industrial, automotive, and communications markets.
The S25FL family delivers SPI Flash memory optimized for reliable code execution, secure firmware updates, and long-term data retention in resource-constrained embedded systems.
FAQ
Is S25FL128P0XNFI003 pin-compatible with S25FL128S0XNFI003?
No, they are not pin-compatible despite identical package and pin count. S25FL128S introduces revised DC characteristics, including lower minimum VCC (1.8 V), altered timing parameters, and updated status register bit definitions. Hardware redesign and firmware validation are required for migration.
What is the function of the exposed pad on the WSON package?
The exposed central pad on the WSON package is a thermal pad with no electrical connection. It may be soldered to a GND copper pour on the PCB only if the PCB routing guarantees 0 mV potential difference between the pad and the GND (VSS) lead - otherwise, it must remain floating to avoid latch-up or parametric shift.
Can the WP#/ACC pin be left unconnected?
No. WP#/ACC must be actively driven: pulled high (via resistor to VCC) for normal operation, pulled low for hardware write protection, or supplied with 8.5–9.5 V for accelerated programming. Leaving it floating risks undefined behavior, including unintended write protection or failure to enter accelerated mode.
Does S25FL128P0XNFI003 support Quad SPI (QSPI) mode?
No. This device supports only standard SPI (single I/O) and Fast Read (single I/O with dummy cycles). It does not implement Dual or Quad I/O commands (e.g., 3BH, 6BH), nor does it have dedicated IO2/IO3 pins - confirmed by pinout, command set, and datasheet functional description.
S25FL128P0XNFI003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (6x8)
S25FL128P0XNFI003 FAQ
1.How can I place an order for S25FL128P0XNFI003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL128P0XNFI003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL128P0XNFI003 reliable?
The price and inventory of S25FL128P0XNFI003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL128P0XNFI003 is usually 5 days.
3.What payment methods are accepted for S25FL128P0XNFI003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL128P0XNFI003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL128P0XNFI003?
S25FL128P0XNFI003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL128P0XNFI003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL128P0XNFI003?
For technical support, including S25FL128P0XNFI003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL128P0XNFI003 requirements.
6.How does Aetrix verify that S25FL128P0XNFI003 is sourced from the original manufacturer or authorized distributors?
All S25FL128P0XNFI003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL128P0XNFI003 meets industry standards.
7.What is the process for return or replacement of S25FL128P0XNFI003?
All S25FL128P0XNFI003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL128P0XNFI003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL128P0XNFI003 part is unused and in its original packaging.
Return procedure for S25FL128P0XNFI003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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