Infineon Technologies S25FL128SAGBHIC10
- Part No.:
- S25FL128SAGBHIC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL128SAGBHIC10.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,732
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Product details
Overview
S25FL128SAGBHIC10 from Infineon is a 128 Mb (16 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability military applications requiring extended temperature operation (-55°C to +125°C). It features 3.0 V core supply (2.7–3.6 V), dual- and quad-I/O read modes up to 80 MBps (Quad DDR at 80 MHz), 256-byte or 512-byte page programming, and hardware ECC for single-bit error correction.
For engineers reviewing the S25FL128SAGBHIC10 datasheet, S25FL128SAGBHIC10 pinout, S25FL128SAGBHIC10 application, or S25FL128SAGBHIC10 equivalent, this device supports AutoBoot execution, Common Flash Interface (CFI) configuration, hybrid/uniform sector erase options, and advanced security via 1024-byte OTP array and individual sector protection.
Technical Context
This SPI Multi-I/O flash implements Eclipse architecture with 65-nm MIRRORBIT™ technology, supporting SPI clock polarity/phase modes 0 and 3, DDR read capability, and extended addressing (24- or 32-bit). Its command set maintains footprint and software compatibility with prior S25FL-A/K/P families while introducing Quad Input Page Programming (QPP) for low-clock systems.
The device integrates dual power domains: core supply (VCC = 2.7–3.6 V) and versatile I/O supply (VIO = 1.65–3.6 V), enabling interoperability with mixed-voltage host controllers. Sector protection is implemented via status register bits and Advanced Sector Protection (ASP), controllable by boot code or password.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB) - fixed capacity for firmware storage in space-constrained military platforms. |
| Interface | SPI Multi-I/O (Quad/Dual/Fast/Normal/DDR) - enables scalable bandwidth from 6.25 MBps to 80 MBps depending on mode and voltage. |
| Operating Temperature | -55°C to +125°C - qualified for military-grade environmental stress without derating. |
| Erase Architecture | Hybrid sector option (32 × 4-KB + remainder 64-KB) or uniform 256-KB blocks - ensures backward compatibility and future software portability. |
| Reliability | 100 program-erase cycles, >20-year data retention - validated for long-life embedded deployments with infrequent updates. |
| Security | 1024-byte OTP array + hardware/software block protection + ASP - supports secure boot and firmware integrity enforcement. |
| Power Supply | VCC = 2.7–3.6 V, VIO = 1.65–3.6 V - allows direct interfacing with 1.8 V or 3.3 V host logic without level shifters. |
Pinout & Package
Package: 24-ball FBGA (FAB024, 5 × 5 mm, 0.5 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command sequence initiation; supports daisy-chaining in multi-device systems. |
| SCK | Serial Clock | Provides timing reference for all SPI transfers; supports SDR (modes 0/3) and DDR protocols up to 80 MHz. |
| IO0 / SI | Serial Input / Data Line 0 | Primary input for commands, addresses, and data during single/dual/quad write operations. |
| IO1 / SO | Serial Output / Data Line 1 | Primary output for read data; functions as bidirectional I/O in multi-I/O modes. |
| IO2 / WP# | Write Protect / Data Line 2 | Hardware-enabled sector protection control; active-low signal prevents accidental program/erase when asserted. |
| IO3 / HOLD# | Hold / Data Line 3 | Pauses ongoing read/write transfers without deselecting device; essential for interrupt handling in real-time systems. |
| VCC | Core Supply | Supplies 2.7–3.6 V to internal logic and memory array; decoupling required per datasheet layout guidelines. |
| VIO | I/O Supply | Independent 1.65–3.6 V rail for interface pins; enables voltage translation between host and flash without external circuitry. |
| VSS | Ground | Dedicated signal ground for noise isolation; separate from power ground in high-integrity designs. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at power-up/reset from preselected address - eliminates boot loader dependency for critical firmware fetch. |
| Hardware ECC | On-the-fly single-bit error correction with no software overhead - ensures data integrity in radiation-prone or thermally stressed environments. |
| Quad Input Page Programming (QPP) | Reduces programming time in low-clock-rate hosts by using four I/O lines for address/data input - improves update efficiency in resource-limited controllers. |
| Common Flash Interface (CFI) | Standardized query table accessible via SPI - enables automatic driver detection and configuration in OS-agnostic boot stages. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enforces hierarchical firmware partitioning (e.g., bootloader vs. application image). |
Applications
| Avionics Flight Control Systems | Tactical Radio Firmware Storage |
|---|---|
|
Use Scenario: Storing certified flight control firmware and configuration tables in FPGAs or microcontrollers onboard UAVs and manned aircraft. IC Role / Device Role / Timing Role: Nonvolatile firmware repository with deterministic read latency and AutoBoot-triggered initialization at power-on. Use Value: Meets DO-254/DO-178C traceability requirements via CFI metadata and >20-year data retention under thermal cycling. |
Use Scenario: Holding encrypted radio stack binaries and cryptographic keys in handheld/manpack radios operating across desert and arctic conditions. IC Role / Device Role / Timing Role: Secure, temperature-hardened code storage with OTP-based key sealing and ASP-enforced partitioning. Use Value: Enables field-upgradable encryption modules without exposing sensitive sectors during OTA updates. |
| Missile Guidance System Boot Memory | Military Vehicle Engine Control Unit |
|
Use Scenario: Hosting immutable boot code and sensor calibration data in inertial measurement units subjected to shock, vibration, and wide thermal swings. IC Role / Device Role / Timing Role: High-integrity startup memory with hardware write protection and ECC-corrected reads during cold-start sequences. Use Value: Guarantees first-instruction reliability after launch acceleration and thermal soak, eliminating boot failures. |
Use Scenario: Storing engine calibration maps and diagnostic logs in armored vehicle ECUs exposed to EMI and transient voltage events. IC Role / Device Role / Timing Role: Robust firmware archive with hybrid-sector erase for incremental map updates and VIO/VCC separation for EMC resilience. Use Value: Supports zero-downtime field recalibration via 4-KB sector granularity while maintaining ASIL-B compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L12833FZNI-10G | Commercial grade (-40°C to +85°C), no DDR support, max Quad Read = 40 MBps, no AutoBoot or ASP. | Lacks military temp range, ECC, and secure boot features - unsuitable for safety-critical or classified systems. | Select only for cost-sensitive non-military platforms where extended temperature and security are not required. |
| S25FL128SAGMFV010 | Same die, but in WSON-8 (6 × 8 mm) package; identical electrical specs and feature set. | Offers surface-mount compatibility with legacy PCB footprints; lower I/O count simplifies routing in space-constrained layouts. | Choose when board area or rework accessibility outweighs BGA density advantages. |
Compared with MX25L12833FZNI-10G, S25FL128SAGBHIC10 delivers military-grade reliability, DDR bandwidth, and hardware security - critical for mission-critical firmware. Against S25FL128SAGMFV010, it trades package form factor for higher interconnect density and thermal performance in stacked-module designs.
Availability
S25FL128SAGBHIC10 is available at Aetrix Electronics and suitable for avionics, tactical communications, missile guidance, and military vehicle electronics requiring stable component supply across extended lifecycle programs.
Supply support for S25FL128SAGBHIC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions for industrial and defense markets.
This part belongs to the FL-S family of SPI Multi-I/O NOR flash devices, engineered specifically for military and aerospace applications demanding extended temperature operation, deterministic boot behavior, and hardware-enforced security.
FAQ
Does S25FL128SAGBHIC10 support both 24-bit and 32-bit addressing?
Yes - it supports extended addressing modes: 24-bit for legacy compatibility (up to 16 MB) and 32-bit for full 128 Mb access. The addressing mode is selected via configuration register bit CR[3], and the device automatically handles address width negotiation during command execution.
What is the purpose of the VIO pin, and can it be tied to VCC?
VIO sets the I/O voltage level independently from VCC, enabling interoperability with 1.8 V or 3.3 V host controllers. It may be tied to VCC only if the host operates at the same voltage; otherwise, a dedicated 1.65–3.6 V supply must be provided to ensure signal integrity and timing compliance.
How does AutoBoot function, and can the boot address be modified?
AutoBoot executes a preconfigured read command (Normal or Quad) at power-up or hardware reset from a user-programmable address stored in the configuration register. The boot address is writable via standard SPI commands and persists across power cycles, allowing field-updatable boot targets.
Is the 1024-byte OTP array one-time programmable per byte or per block?
The OTP array is organized as 1024 individually addressable bytes, each programmable once via standard SPI write commands. Once programmed, bits cannot be reset; however, unused bytes remain available for later use, supporting phased key injection or version tagging in secure boot flows.
S25FL128SAGBHIC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 750µs
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL128SAGBHIC10 FAQ
1.How can I place an order for S25FL128SAGBHIC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL128SAGBHIC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL128SAGBHIC10 reliable?
The price and inventory of S25FL128SAGBHIC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL128SAGBHIC10 is usually 5 days.
3.What payment methods are accepted for S25FL128SAGBHIC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL128SAGBHIC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL128SAGBHIC10?
S25FL128SAGBHIC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL128SAGBHIC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL128SAGBHIC10?
For technical support, including S25FL128SAGBHIC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL128SAGBHIC10 requirements.
6.How does Aetrix verify that S25FL128SAGBHIC10 is sourced from the original manufacturer or authorized distributors?
All S25FL128SAGBHIC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL128SAGBHIC10 meets industry standards.
7.What is the process for return or replacement of S25FL128SAGBHIC10?
All S25FL128SAGBHIC10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL128SAGBHIC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL128SAGBHIC10 part is unused and in its original packaging.
Return procedure for S25FL128SAGBHIC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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