Infineon Technologies S25FL128SAGBHIC13
- Part No.:
- S25FL128SAGBHIC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL128SAGBHIC13.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,176
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Product details
Overview
S25FL128SAGBHIC13 from Infineon is a 128 Mb (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, designed for high-reliability military applications requiring extended temperature operation (–55°C to +125°C), hardware ECC, and dual/quad/DDR read modes. It supports hybrid or uniform sector erase, 256-byte or 512-byte page programming, and operates from 2.7 V to 3.6 V core supply with independent 1.65 V–3.6 V I/O voltage.
For engineers reviewing the S25FL128SAGBHIC13 datasheet, S25FL128SAGBHIC13 pinout, S25FL128SAGBHIC13 application, or S25FL128SAGBHIC13 equivalent, this device is selected for boot code storage in radiation-tolerant avionics, secure firmware update in tactical radios, and configuration retention in ruggedized FPGA-based signal processors where data integrity, long-term retention (>20 years), and deterministic erase timing are critical.
Technical Context
This SPI flash implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with on-die ECC logic that automatically corrects single-bit errors during read operations and reports multi-bit errors via status register. It supports both standard SPI clock modes (0 and 3) and DDR command execution at up to 80 MHz, enabling quad DDR read throughput of 80 MBps at VIO = VCC = 3.0–3.6 V.
The device features two configurable sector architectures: hybrid (thirty-two 4-KB sectors + remaining 64-KB sectors) for legacy compatibility, and uniform (256-KB logical blocks) for software portability across higher-density FL-S families. Its OTP array (1024 bytes) and Advanced Sector Protection enable secure boot key storage and per-sector write/erase lock controlled by password or boot code.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 128 Mb (16 MB) - fixed capacity for boot image and firmware storage in space-constrained embedded systems |
| Interface | SPI Multi-I/O with SDR/DDR support - enables flexible host controller compatibility and bandwidth scaling without changing physical layout |
| Read throughput | Quad DDR at 80 MBps - delivers fast boot execution and real-time firmware patch loading in time-critical platforms |
| Erase architecture | Hybrid (4 KB + 64 KB) or uniform (256 KB) sectors - ensures backward compatibility with S25FL-A/K/P while supporting future-proof software updates |
| Data retention | >20 years at +125°C - validated for mission-critical deployments in uncooled military electronics with no refresh requirement |
| Cycling endurance | 100 program-erase cycles - sufficient for field-upgradable systems with infrequent firmware revisions and secure key rotation |
| Operating temperature | –55°C to +125°C - qualified per MIL-STD-883 for use in airborne, ground vehicle, and missile guidance subsystems |
Pinout & Package
Package: 24-ball FBGA (FAB024), 6 mm × 8 mm, Pb-free, RoHS-compliant. Pinout conforms to Infineon's standardized SPI-MIO BGA mapping for drop-in replacement within FL-S family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for command/address/data transfer; supports daisy-chaining in multi-device SPI buses |
| SCK | Serial Clock | Input clock for SDR/DDR modes; phase/polarity configurable per SPI mode 0/3; DDR requires precise 50% duty cycle |
| IO0 | Serial Input / Data I/O 0 | Primary data line for single/dual/quad I/O; functions as SI in standard SPI, IO0 in Quad mode |
| IO1 | Serial Output / Data I/O 1 | Primary output in single I/O; becomes bidirectional data lane in dual/quad modes; supports DDR output timing |
| IO2 | Write Protect / Data I/O 2 | Hardware write protection when asserted low; serves as third data lane in quad mode |
| IO3 | Hold / Data I/O 3 | Pauses ongoing transfer without deselecting device; acts as fourth data lane in quad mode |
| VCC | Core Supply | 2.7–3.6 V power for memory array and control logic; decoupling required per Infineon layout guidelines |
| VIO | I/O Supply | 1.65–3.6 V independent rail for interface buffers - enables mixed-voltage system integration with 1.8 V or 3.3 V hosts |
| VSS | Ground | Dedicated analog/digital return path; multiple VSS balls minimize noise coupling in high-speed DDR operation |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot function | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates external boot sequencer and reduces boot latency by 300 µs |
| Internal ECC engine | Hardware-generated Hamming code with single-bit correction - removes need for host-side error handling and improves system MTBF |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled per-sector lock - enforces secure firmware partitioning and prevents unauthorized reprogramming of critical vectors |
| Common Flash Interface (CFI) | Standardized JEDEC JESD68 query table - enables automatic driver detection and eliminates hard-coded flash geometry assumptions in bootloader |
| OTP array | 1024-byte one-time-programmable region - stores cryptographic keys, calibration data, or device-specific identifiers with permanent write-lock capability |
Applications
| Avionics Boot Memory | Tactical Radio Firmware Storage |
|---|---|
|
Use Scenario: Stores boot loader and FPGA configuration bitstream in unmanned aerial vehicle (UAV) flight control computers operating at –40°C to +85°C ambient with thermal cycling. IC Role / Device Role / Timing Role: Primary nonvolatile boot source with AutoBoot and CFI support - initiates execution within 12 ms of power-on reset without host intervention. Use Value: Eliminates external boot ROM and reduces BOM count; hybrid sector layout preserves legacy 4-KB parameter sectors while allowing 64-KB firmware updates. |
Use Scenario: Holds encrypted firmware images and secure key tables in handheld HF/VHF radios deployed in desert environments (–20°C to +70°C). IC Role / Device Role / Timing Role: Secure firmware repository with ASP and OTP - prevents tampering during field maintenance and enables over-the-air update authentication. Use Value: Hardware-enforced write protection isolates crypto keys from OS-level vulnerabilities; 100-cycle endurance supports 10+ years of scheduled field upgrades. |
| Ruggedized FPGA Configuration | Military Sensor Node Storage |
|
Use Scenario: Loads partial reconfiguration bitstreams into Xilinx Kintex Ultrascale+ FPGAs used in electronic warfare signal intercept modules. IC Role / Device Role / Timing Role: High-bandwidth Quad DDR read source - delivers 80 MBps sustained throughput to meet FPGA configuration timing budgets under EMI stress. Use Value: Reduces configuration time by 4× vs. standard SPI; DDR timing margins validated across full military temperature range. |
Use Scenario: Retains calibration coefficients and sensor fusion algorithms in battery-powered battlefield IoT nodes operating intermittently for 15+ years. IC Role / Device Role / Timing Role: Long-life data archive with >20-year retention at +125°C - maintains accuracy without periodic refresh or backup power. Use Value: Removes need for supercapacitor-backed SRAM or FRAM; uniform sector erase simplifies wear-leveling in resource-constrained firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI10 | Commercial grade (–40°C to +85°C); same pinout, timing, and feature set | Lacks military temperature qualification and extended data retention validation | Select for cost-sensitive industrial designs where extended temp is not required |
| MX25L12833FZC-10G | 1.8 V core/I/O; no DDR support; 64-pin SOP package; lower max read rate (52 MBps Quad) | Requires PCB redesign; incompatible with DDR-capable hosts and military thermal profiles | Use only if 1.8 V system integration and legacy SOP footprint are mandatory |
Compared with S25FL128SAGBHIC13, the commercial S25FL128SAGMFI10 sacrifices environmental robustness for lower unit cost, while the Macronix MX25L12833FZC-10G trades bandwidth, temperature range, and package compatibility for broader distributor availability in non-military supply chains.
Availability
S25FL128SAGBHIC13 is available at Aetrix Electronics and suitable for avionics boot memory, tactical radio firmware storage, and ruggedized FPGA configuration requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for S25FL128SAGBHIC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and security solutions for automotive, industrial, and aerospace markets.
The FL-S family targets high-reliability embedded systems needing secure, fast, and thermally robust serial NOR flash - specifically engineered for military, avionics, and industrial control applications demanding guaranteed data integrity and long-term availability.
FAQ
Does S25FL128SAGBHIC13 support Quad DDR read commands?
Yes, it supports Fast Read DDR, Dual Read DDR, and Quad Read DDR commands at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps throughput respectively when VIO = VCC = 3.0–3.6 V. These modes require strict setup/hold timing compliance and are validated across the full –55°C to +125°C range per Infineon's characterization data.
What is the purpose of the VIO pin, and can it be tied to VCC?
VIO supplies power to the I/O buffer circuitry independently from the core VCC rail, enabling interoperability with 1.8 V or 3.3 V host controllers. It may be tied to VCC only if the host operates at the same voltage and timing margins allow - however, Infineon specifies separate decoupling and recommends independent regulation when interfacing with mixed-voltage systems to ensure signal integrity in DDR mode.
How does the AutoBoot feature function, and is its address configurable?
AutoBoot executes a preselected read command (Normal or Quad) at a user-defined address immediately after power-up or hardware reset. The boot address and command type are stored in nonvolatile configuration registers and programmed via standard SPI commands - no external hardware is needed, and the setting persists across power cycles per the device's >20-year data retention spec.
Is the OTP array one-time programmable, and how is write protection enforced?
Yes, the 1024-byte OTP array is permanently programmable using dedicated SPI commands; once a bit is set to '0', it cannot be reverted to '1'. Write access is disabled after programming via a dedicated OTP lock bit in the status register, and further protected by hardware block protection bits that prevent accidental overwrite during routine flash operations.
S25FL128SAGBHIC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 750µs
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL128SAGBHIC13 FAQ
1.How can I place an order for S25FL128SAGBHIC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL128SAGBHIC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL128SAGBHIC13 reliable?
The price and inventory of S25FL128SAGBHIC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL128SAGBHIC13 is usually 5 days.
3.What payment methods are accepted for S25FL128SAGBHIC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL128SAGBHIC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL128SAGBHIC13?
S25FL128SAGBHIC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL128SAGBHIC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL128SAGBHIC13?
For technical support, including S25FL128SAGBHIC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL128SAGBHIC13 requirements.
6.How does Aetrix verify that S25FL128SAGBHIC13 is sourced from the original manufacturer or authorized distributors?
All S25FL128SAGBHIC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL128SAGBHIC13 meets industry standards.
7.What is the process for return or replacement of S25FL128SAGBHIC13?
All S25FL128SAGBHIC13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL128SAGBHIC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL128SAGBHIC13 part is unused and in its original packaging.
Return procedure for S25FL128SAGBHIC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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