Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors S25FL128SAGBHV300

Part No.:
S25FL128SAGBHV300
Manufacturer:
NXP Semiconductors
Category:
Memory
Package:
-
Datasheet:
AetrixS25FL128SAGBHV300.pdf
Description:
S25FL128S - (16-MB), 3.0 V FL-L
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:797

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S25FL128SAGBHV300 from Cypress Semiconductor is a 128 Mbit (16 MB) 3.0V SPI flash memory IC with Quad I/O and DDR read support, integrated AutoBoot functionality, hardware-based sector protection, and on-die ECC for single-bit error correction. It operates across industrial temperature range (−40°C to +85°C), supports 256-byte and 512-byte page programming, and delivers up to 80 MB/s quad DDR read throughput at 80 MHz.

For engineers reviewing the S25FL128SAGBHV300 datasheet, S25FL128SAGBHV300 pinout, S25FL128SAGBHV300 application, or S25FL128SAGBHV300 equivalent, key selection criteria include hybrid/uniform sector erase configuration, VIO voltage flexibility (1.65–3.6 V), OTP array size (1024 bytes), AEC-Q100 Grade 3 compliance eligibility, and compatibility with legacy S25FL-A/K/P command sets and footprints.

Technical Context

The S25FL128SAGBHV300 implements Cypress's 65 nm MirrorBit Eclipse architecture, enabling faster program/erase cycles via dual-page buffer options (256 B or 512 B) and hybrid sector layout (thirty-two 4 kB parameter sectors + remaining 64 kB sectors) or uniform 256 kB block erase mode. Its SPI Multi-I/O interface supports SIO, DIO, QIO, and DDR variants across clock polarity modes 0 and 3.

It integrates dedicated registers for Advanced Sector Protection (ASP), configurable Block Protection bits (BP2–BP0), TBPROT, and freeze control (CR1[0]) that locks protection state and OTP configuration. The device lacks Deep Power Down but repurposes legacy DPD command (B9h) as bank address register access for 32-bit addressing in 256 Mb variants - though S25FL128SAGBHV300 uses only 24-bit addressing per its density.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 Mbit (16 MB) - fixed capacity for boot code storage and firmware image retention in resource-constrained embedded systems.
Interface Protocol SPI Multi-I/O with SIO/DIO/QIO and DDR support - enables scalable bandwidth from 6.25 MB/s (SDR Read) to 80 MB/s (Quad DDR Read) without increasing pin count.
Supply Voltage VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - allows independent I/O rail scaling for mixed-voltage host MCU interfaces while maintaining core stability.
Erase Architecture Hybrid sector option (32 × 4 kB top/bottom + 64 kB main) or uniform 256 kB blocks - ensures backward compatibility with prior S25FL devices and forward software alignment with higher-density families.
Program Endurance 100,000 program-erase cycles - validated minimum endurance for field-updatable firmware partitions requiring frequent reprogramming.
Data Retention 20 years minimum - guarantees long-term integrity of stored boot images and calibration data in unpowered industrial deployments.
OTP Array 1024 bytes one-time programmable memory - provides secure storage for cryptographic keys, device identifiers, or factory-trimmed parameters not modifiable post-deployment.
Temperature Grade Industrial (−40°C to +85°C) - qualified for operation in extended ambient environments typical of networking equipment, motor drives, and industrial HMIs.

Pinout & Package

Package: 24-ball FBGA (6 × 8 mm, FAB024 footprint, Pb-free). Pin assignments are defined per the SOIC-16, WSON, and BGA package drawings in Document 001-98283 Rev. *O, Section 6.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enable signal; must transition low before any command sequence; controls device activation and output tristate behavior.
SCK Serial Clock Master-generated clock; rising edge latches input (SI/IO0–IO3); falling edge (SDR) or both edges (DDR) drive output timing.
SI / IO0 Serial Input / Quad I/O 0 Primary input for SIO commands; becomes bidirectional I/O0 in DIO/QIO modes for address/data transfer and read response.
SO / IO1 Serial Output / Quad I/O 1 Primary output for SIO reads; becomes bidirectional I/O1 in DIO/QIO modes for parallel data return during fast read operations.
WP# / IO2 Write Protect / Quad I/O 2 Hardware lock for Status/Configuration Registers when low and SRWD=1; repurposed as IO2 in Quad mode for expanded I/O width.
HOLD# / IO3 Hold / Quad I/O 3 Pauses ongoing serial transfer without resetting internal state; repurposed as IO3 in Quad mode to complete 4-bit I/O bus.
RESET# Hardware Reset Asynchronous active-low reset; forces standby state, clears volatile registers, reloads config, and resets Bank Address Register to zero.
VCC Core Supply 2.7–3.6 V power for logic and array; decoupling required near package for stable high-speed operation.
VIO I/O Supply 1.65–3.6 V supply for all I/O pins; enables level-shifting interoperability with 1.8 V or 3.3 V host controllers without external translators.
VSS Ground Common reference for VCC and VIO; requires low-inductance connection to minimize noise coupling into sensitive SPI timing paths.

Key Features

Feature Design Value
AutoBoot Execution Automatically initiates Normal or Quad Read at preselected address on power-up or RESET#, eliminating host-side boot initialization latency.
Integrated ECC Engine On-the-fly single-bit error correction with hidden syndrome generation per 16-byte group - improves reliability without software overhead or external error-handling logic.
Advanced Sector Protection (ASP) Individual sector lock controlled by boot code or password - enables fine-grained firmware partitioning (e.g., bootloader vs. application) with hardware-enforced write isolation.
Extended Addressing Support 24-bit native addressing (16 MB space fully accessible); optional 32-bit extension available via bank register - future-proofs design for migration to 256 Mb variants using same PCB footprint.
Command Set Compatibility Pin- and command-compatible with S25FL-A, S25FL-K, and S25FL-P families - simplifies drop-in replacement and reduces qualification effort in legacy designs.
Hybrid Sector Erase Option Preserves thirty-two 4 kB sectors at top/bottom address space for parameter storage while using 64 kB sectors elsewhere - maintains compatibility with existing S25FL-K/P firmware layouts.

Applications

Industrial Control Firmware Storage Automotive Instrument Cluster Boot Memory

Use Scenario: Storing boot loader and real-time OS kernel in PLCs and CNC controllers where firmware updates occur infrequently but must survive 20+ years of field operation.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with AutoBoot execution and hardware write protection against accidental corruption during brown-out events.

Use Value: Eliminates need for external ECC logic or redundant flash arrays; 100K endurance supports periodic field upgrades; 20-year retention avoids recalibration drift in sealed enclosures.

Use Scenario: Hosting boot code and graphics assets for digital instrument clusters requiring AEC-Q100-compliant memory with deterministic startup timing.

IC Role / Device Role / Timing Role: Primary boot flash with Quad DDR read mode delivering 80 MB/s throughput to feed GPU texture caches without parallel bus congestion.

Use Value: Reduces PCB layer count versus parallel NOR; OTP stores vehicle VIN and calibration offsets; ASP prevents unauthorized modification of safety-critical boot routines.

Network Router Configuration Storage Medical Imaging Device Parameter Memory

Use Scenario: Holding configuration profiles, crypto keys, and fail-safe recovery images in enterprise-grade routers deployed in temperature-variable data centers.

IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with 1024-byte OTP and hardware BP bits - isolates critical boot assets from runtime OS partitions.

Use Value: Prevents remote firmware rollback attacks; hybrid sector layout allows atomic update of config sectors without erasing full image; VIO flexibility supports 1.8 V PHY interfaces.

Use Scenario: Retaining calibration coefficients, sensor offset tables, and regulatory audit logs in FDA-cleared diagnostic imaging systems requiring long-term data integrity.

IC Role / Device Role / Timing Role: High-reliability non-volatile memory with built-in ECC and 20-year retention - ensures traceable calibration history remains intact across device lifecycle.

Use Value: Meets IEC 62304 software safety requirements for Class C devices; OTP stores cryptographic signatures for firmware validation; industrial temp grade covers lab-to-field thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPI flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S25FL128SAGMFI101 Same die, SOIC-16 package (300 mil), industrial grade, no RESET# pin - differs only in package and pin count. Lacks hardware RESET#; requires software-initiated reset sequences; suitable for space-constrained PCBs where BGA placement is impractical. Select when board layout prohibits BGA routing or when legacy SOIC footprint reuse is prioritized over reset autonomy.
MX25L12833FZCII00 Micron 128 Mbit SPI flash with 3.3 V only (no 1.65–3.6 V VIO), no DDR support, no AutoBoot, 64 kB uniform sectors only. Lower max read speed (40 MB/s Quad), no OTP, no ASP - limited to basic code storage without security or advanced boot features. Select only for cost-sensitive, non-security-critical applications where DDR, AutoBoot, and OTP are unnecessary and VIO flexibility is not required.

Compared with S25FL128SAGBHV300, the SOIC variant sacrifices RESET# autonomy and board-level miniaturization but retains identical functionality; the Micron alternative trades performance, security, and voltage flexibility for lower unit cost in undemanding use cases.

Availability

S25FL128SAGBHV300 is available at Aetrix Electronics and suitable for industrial control firmware storage, automotive instrument cluster boot memory, and medical imaging device parameter memory requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-aligned qualification.

Supply support for S25FL128SAGBHV300 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance non-volatile memory and microcontroller solutions for industrial, automotive, and communications markets, with emphasis on reliability, security, and system-level integration.

The S25FL-S family targets embedded systems requiring robust, high-speed serial flash with advanced data protection - specifically engineered for Execute-In-Place (XIP), secure boot, and field-upgradable firmware architectures.

FAQ

What is the maximum Quad DDR read throughput supported by the S25FL128SAGBHV300?

The S25FL128SAGBHV300 achieves up to 80 MB/s Quad DDR read throughput at 80 MHz clock rate with VIO = VCC = 3.0–3.6 V. This performance enables real-time streaming of boot code or graphics assets directly from flash without external buffering. The S25FL128SAGBHV300 sustains this rate across its full 16 MB address space under specified operating conditions.

Does the S25FL128SAGBHV300 support hardware reset, and how is it implemented?

Yes, the S25FL128SAGBHV300 includes an active-low RESET# pin that asynchronously forces the device into standby mode, clears volatile registers, resets the Bank Address Register to zero, and reloads internal configuration. The RESET# signal has an internal pull-up resistor and may be left unconnected if unused. This hardware reset is distinct from software reset commands and ensures deterministic recovery after power faults.

How does the AutoBoot feature function in the S25FL128SAGBHV300?

The S25FL128SAGBHV300 AutoBoot feature automatically executes a preconfigured Normal or Quad Read command at power-up or after RESET#, fetching data from a user-defined start address. This eliminates host CPU intervention during initial boot, reducing system startup time and simplifying firmware architecture. Configuration is stored in non-volatile registers and persists across power cycles.

What sector erase options are available on the S25FL128SAGBHV300, and how do they affect firmware layout?

The S25FL128SAGBHV300 offers two erase configurations: hybrid (thirty-two 4 kB sectors at top/bottom + 64 kB main sectors) and uniform (256 kB logical blocks). Hybrid mode preserves compatibility with legacy S25FL-K/P firmware maps, allowing parameter storage in protected 4 kB zones; uniform mode simplifies software management for large firmware images and aligns with future higher-density devices.

Is the S25FL128SAGBHV300 compatible with existing S25FL-P family PCB footprints?

Yes, the S25FL128SAGBHV300 uses the FAB024 24-ball BGA footprint (6 × 8 mm), which matches the physical layout of selected S25FL-P family BGA variants. It is command-set, pinout, and timing compatible with S25FL-P devices, enabling direct PCB-level replacement without redesign - provided the host controller supports DDR and AutoBoot features used in the new implementation.

S25FL128SAGBHV300 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Programmable:
-
Memory Type:
-
Memory Format:
-
Technology:
-
Memory Size:
-
Memory Organization:
-
Memory Interface:
-
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

S25FL128SAGBHV300 FAQ

1.How can I place an order for S25FL128SAGBHV300 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL128SAGBHV300 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL128SAGBHV300 reliable?

The price and inventory of S25FL128SAGBHV300 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL128SAGBHV300 is usually 5 days.

3.What payment methods are accepted for S25FL128SAGBHV300?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL128SAGBHV300 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL128SAGBHV300?

S25FL128SAGBHV300 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL128SAGBHV300 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL128SAGBHV300?

For technical support, including S25FL128SAGBHV300 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL128SAGBHV300 requirements.

6.How does Aetrix verify that S25FL128SAGBHV300 is sourced from the original manufacturer or authorized distributors?

All S25FL128SAGBHV300 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL128SAGBHV300 meets industry standards.

7.What is the process for return or replacement of S25FL128SAGBHV300?

All S25FL128SAGBHV300 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL128SAGBHV300, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL128SAGBHV300 part is unused and in its original packaging.

Return procedure for S25FL128SAGBHV300:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S25FL128SAGBHV300 Tags

  • S25FL128SAGBHV300
  • S25FL128SAGBHV300 PDF
  • S25FL128SAGBHV300 Datasheet
  • S25FL128SAGBHV300 Specifications
  • S25FL128SAGBHV300 Images
  • NXP Semiconductors
  • NXP Semiconductors S25FL128SAGBHV300
  • Buy S25FL128SAGBHV300
  • S25FL128SAGBHV300 Price
  • S25FL128SAGBHV300 Distributor
  • S25FL128SAGBHV300 Supplier
  • S25FL128SAGBHV300 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER