Infineon Technologies S25FL128SAGBHVC10
- Part No.:
- S25FL128SAGBHVC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL128SAGBHVC10.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,707
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Product details
Overview
S25FL128SAGBHVC10 from Infineon is a 128 Mb (16 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability military applications requiring extended temperature operation (-55°C to +125°C), hardware ECC, and dual/quad/DDR read modes. It features 24-/32-bit addressing, hybrid or uniform sector erase options, and OTP security with advanced sector protection.
For engineers reviewing the S25FL128SAGBHVC10 datasheet, S25FL128SAGBHVC10 pinout, S25FL128SAGBHVC10 application, or S25FL128SAGBHVC10 equivalent, this device supports fast boot via AutoBoot, CFI configuration access, and voltage-flexible I/O (1.65 V–3.6 V) while maintaining full compatibility with S25FL-P family footprints and command sets.
Technical Context
This SPI flash implements Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling simultaneous read-while-write operation and deterministic latency across all read modes (Normal, Fast, Dual, Quad, DDR variants). Its dual-voltage design separates core (VCC: 2.7–3.6 V) and I/O (VIO: 1.65–3.6 V) supplies to support mixed-signal SoC interfacing.
The device supports two sector architectures: hybrid (thirty-two 4-KB sectors at top/bottom + remaining 64-KB sectors) and uniform (256-KB logical blocks), both with hardware/software block protection and programmable status register freeze. Internal ECC provides single-bit error correction without host intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mb (16 MB) – fixed capacity for deterministic BOM planning and firmware partitioning |
| Interface | SPI Multi-I/O with SDR/DDR support – enables up to 80 MHz DDR Quad Read (80 MBps) for boot-time performance |
| Operating Temperature | -55°C to +125°C – qualified for military-grade environmental stress and long-term field deployment |
| Erase Architecture | Hybrid or uniform sector option – hybrid preserves legacy compatibility; uniform ensures forward software scalability |
| Security Features | 1024-byte OTP array + ASP + status register-based block protection – enables secure boot key storage and firmware lockdown |
| Data Retention | >20 years – validated under accelerated aging at max operating temperature |
| Endurance | 100 program-erase cycles – specified per sector, supporting mission-critical update durability |
Pinout & Package
Package: 24-ball FBGA (FAB024, 5 × 5 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; supports daisy-chain or independent device selection |
| SCK | Serial Clock | Input clock for SDR/DDR modes; phase/polarity configurable for Mode 0/3 compliance |
| IO0 (SI) | Serial Input / Data Line 0 | Primary data input in single/dual/quad modes; functions as SI in standard SPI, IO0 in multi-I/O |
| IO1 (SO) | Serial Output / Data Line 1 | Primary data output in single/dual/quad modes; functions as SO in standard SPI, IO1 in multi-I/O |
| IO2 (WP#) | Write Protect / Data Line 2 | Hardware write lock when asserted low; doubles as quad-mode data line IO2 when WP# disabled |
| IO3 (HOLD#) | Hold / Data Line 3 | Pauses ongoing transfer without deselecting; doubles as quad-mode data line IO3 when HOLD# disabled |
| VCC | Core Supply | 2.7–3.6 V power for memory array and logic; decoupling required per Infineon layout guidelines |
| VIO | I/O Supply | 1.65–3.6 V supply for interface pins; enables direct connection to 1.8 V or 3.3 V host controllers |
| VSS | Ground | Dedicated signal ground; requires separate plane routing from power ground to minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at power-up/reset from preselected address-enables zero-latency boot without host initialization |
| Quad Input Page Programming (QPP) | Reduces programming time on low-frequency hosts by using four lines for address/data-critical for resource-constrained microcontrollers |
| Internal Hardware ECC | Single-bit error correction performed transparently during read-eliminates need for host-side error handling logic or software overhead |
| Common Flash Interface (CFI) | Standardized JEDEC JESD68 query structure-allows runtime detection of geometry, timing, and feature set without hardcoded assumptions |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking-supports hierarchical firmware update policies and secure bootloader isolation |
Applications
| Aerospace Flight Control | Military Radar Signal Processing |
|---|---|
|
Use Scenario: Storing FPGA configuration bitstreams and real-time DSP firmware in airborne radar transceivers operating at -55°C to +125°C. IC Role / Device Role / Timing Role: Nonvolatile code storage with deterministic Quad DDR read (80 MBps) to meet sub-100 ms boot deadline. Use Value: Hybrid sector architecture allows 4-KB boot loader + 64-KB algorithm partitions, while ECC ensures bitstream integrity after radiation exposure. |
Use Scenario: Holding calibrated RF lookup tables and adaptive beamforming coefficients in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: High-speed, secure parameter storage accessed via Dual Read (26 MBps) during pulse repetition intervals. Use Value: OTP array stores factory calibration keys; ASP prevents accidental overwrite of critical beamforming data during field updates. |
| Tactical Vehicle ECU | Secure Communications Module |
|
Use Scenario: Hosting encrypted boot firmware and vehicle-specific configuration profiles in armored vehicle engine control units exposed to wide thermal cycling. IC Role / Device Role / Timing Role: Reliable code execution source with AutoBoot and hardware write protection against EMI-induced corruption. Use Value: Uniform 256-KB erase blocks simplify OTA update partitioning; >20-year retention guarantees firmware validity over full vehicle lifecycle. |
Use Scenario: Storing cryptographic keys, secure boot images, and protocol stacks in NSA-certified Type 1 encryption modules. IC Role / Device Role / Timing Role: Tamper-resistant nonvolatile storage with 1024-byte OTP and password-locked ASP for key material isolation. Use Value: Block protection + status register freeze prevents unauthorized reprogramming; CFI enables dynamic feature validation during security audits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L12833FZC-10G | Commercial grade (-40°C to +85°C); no DDR support; 1.8 V only I/O supply | Lacks military temp range and DDR performance; suitable for cost-sensitive industrial designs without extreme environment requirements | Select only if operating temperature stays within commercial range and DDR bandwidth is unnecessary |
| S25FL128SAGNFM10 | Same die, but in WSON-8 (6 × 8 mm) package; identical electrical specs and feature set | Preferred for space-constrained PCBs where BGA assembly is impractical; same pinout mapping with different physical footprint | Choose for simplified assembly or thermal pad accessibility; no functional trade-offs |
Compared with MX25L12833FZC-10G, S25FL128SAGBHVC10 delivers military-grade reliability and DDR throughput; versus S25FL128SAGNFM10, it offers identical functionality in a smaller 5×5 mm FBGA-ideal for high-density avionics layouts where board area is premium.
Availability
S25FL128SAGBHVC10 is available at Aetrix Electronics and suitable for aerospace flight control, military radar signal processing, and tactical vehicle ECU applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S25FL128SAGBHVC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions for industrial and defense markets.
This part belongs to the FL-S family of SPI NOR flash devices engineered specifically for mission-critical systems demanding extended temperature operation, hardware security, and deterministic boot performance.
FAQ
What is the maximum Quad DDR read speed for S25FL128SAGBHVC10?
The device achieves 80 MBps Quad DDR read throughput at 80 MHz clock rate with VIO = VCC = 3.0–3.6 V, as verified in Table 3 of the official datasheet (002-19099 Rev. *D). This speed assumes optimal PCB layout, proper termination, and host controller capable of DDR timing compliance.
Does S25FL128SAGBHVC10 support 1.8 V I/O operation?
Yes-it supports I/O voltages from 1.65 V to 3.6 V, including 1.8 V. At 1.65–2.7 V VIO (with VCC = 2.7–3.6 V), Quad Read delivers 33 MBps (Table 2), making it compatible with low-voltage FPGAs and ASICs without level-shifting circuitry.
How does the hybrid sector erase option differ from uniform sector erase?
Hybrid mode provides thirty-two 4-KB sectors at the top or bottom of the address space plus 64-KB sectors elsewhere-ensuring backward compatibility with legacy S25FL-A/K/P firmware layouts. Uniform mode uses only 256-KB logical erase blocks, simplifying software for future-proof designs and higher-density migrations.
Is the OTP array one-time programmable or reprogrammable?
The 1024-byte OTP array is truly one-time programmable: bits can be changed from '1' to '0' only, and once written, cannot be reset. It is used for immutable keys, calibration data, or device identity-verified by Infineon's production test and documented in Section 1.2.2.2 of the datasheet.
S25FL128SAGBHVC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 750µs
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL128SAGBHVC10 FAQ
1.How can I place an order for S25FL128SAGBHVC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL128SAGBHVC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL128SAGBHVC10 reliable?
The price and inventory of S25FL128SAGBHVC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL128SAGBHVC10 is usually 5 days.
3.What payment methods are accepted for S25FL128SAGBHVC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL128SAGBHVC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL128SAGBHVC10?
S25FL128SAGBHVC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL128SAGBHVC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL128SAGBHVC10?
For technical support, including S25FL128SAGBHVC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL128SAGBHVC10 requirements.
6.How does Aetrix verify that S25FL128SAGBHVC10 is sourced from the original manufacturer or authorized distributors?
All S25FL128SAGBHVC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL128SAGBHVC10 meets industry standards.
7.What is the process for return or replacement of S25FL128SAGBHVC10?
All S25FL128SAGBHVC10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL128SAGBHVC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL128SAGBHVC10 part is unused and in its original packaging.
Return procedure for S25FL128SAGBHVC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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