Infineon Technologies S25FL129P0XBHI200
- Part No.:
- S25FL129P0XBHI200
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL129P0XBHI200.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,191
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Product details
Overview
S25FL129P0XBHI200 from Cypress Semiconductor is a 128-Mbit (16 MB), 3.0 V serial NOR Flash memory with uniform 64 KB sectors and dual/quad I/O support, operating across 2.7–3.6 V. It delivers up to 40 MB/s effective read throughput via Quad I/O FAST_READ, supports 100,000 program/erase cycles per sector, and includes 128-bit factory-programmable OTP for secure device identification - used in industrial control firmware storage and boot code retention.
For engineers reviewing the S25FL129P0XBHI200 datasheet, S25FL129P0XBHI200 pinout, S25FL129P0XBHI200 application, or S25FL129P0XBHI200 equivalent, key selection criteria include SPI interface timing compliance (104 MHz max FAST_READ), sub-sector erase granularity (4 KB), W#/ACC-accelerated programming, and BGA/WSON/SO package compatibility with legacy Spansion-based embedded platforms.
Technical Context
The S25FL129P0XBHI200 implements a quad-SPI-compatible serial interface with five extended command sets: DOR, QOR, DIOR, QIOR, and QPP - enabling simultaneous bidirectional data transfer on SI, SO, W#/ACC, and HOLD# pins. Its architecture integrates a 0.09 µm MirrorBit® process, CFI-compliant register mapping, and configurable status/configuration registers for flexible memory protection.
It supports three erase granularities: 4 KB sub-sectors (via P4E/P8E), 64 KB sectors (SE), and full-chip bulk erase (BE), all managed through dedicated SPI opcodes. The device uses internally regulated high-voltage generation for write operations, eliminating external charge pumps while requiring only a single 3.0 V supply for both read and program functions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (16 MB) - sufficient for full bootloader + FPGA configuration bitstream in space-constrained embedded systems |
| Supply Voltage | 2.7–3.6 V - compatible with standard 3.3 V logic rails without level-shifting |
| Read Throughput | 40 MB/s (Quad I/O FAST_READ @ 80 MHz) - enables fast application code execution from XIP mode |
| Erase Endurance | 100,000 cycles per sector - supports frequent firmware updates in field-deployed industrial gateways |
| Data Retention | 20 years typical - ensures long-term reliability in unattended infrastructure equipment |
| OTP Capacity | 128-bit factory-lockable area + 490-byte user-programmable OTP - provides tamper-resistant device identity and calibration data storage |
| Package | 24-ball BGA (6 × 8 mm, 6 × 4 pin configuration) - optimized for high-density PCB layouts with thermal pad grounding option |
Pinout & Package
Package: 24-ball BGA (6 × 8 mm, 6 × 4 pin configuration), RoHS-compliant, with exposed thermal pad (not electrically connected unless tied to GND with 0 mV potential difference).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command initiation; required falling edge after power-up before first instruction |
| SCK | Serial Clock | Master-generated clock; rising edge latches input (SI/IO0), falling edge triggers output (SO/IO1) |
| SI/IO0 | Serial Input / I/O0 | Primary data input in standard mode; bidirectional in Dual/Quad I/O modes for parallelized transfers |
| SO/IO1 | Serial Output / I/O1 | Primary data output in standard mode; bidirectional in Dual/Quad I/O modes for full-duplex operation |
| HOLD#/IO3 | Hold Control / I/O3 | Pauses ongoing SPI transaction without deselecting chip; serves as third I/O line in Quad modes |
| W#/ACC/IO2 | Write Protect / Acceleration / I/O2 | Enables accelerated programming when driven to 9 V; acts as fourth I/O line in Quad modes and BP register control |
| VCC | Power Supply | Single 2.7–3.6 V supply powers all read/write/erase operations and internal voltage regulation |
| GND | Ground | Reference for all I/O and internal circuitry; must be low-impedance connection to thermal pad if grounded |
Key Features
| Feature | Design Value |
|---|---|
| Dual/Quad I/O Read Modes | Enables 2× or 4× bandwidth over standard SPI - reduces boot time by up to 75% in XIP applications |
| Sub-sector Erase (4 KB) | Allows fine-grained firmware patching without disturbing adjacent configuration or calibration data |
| Accelerated Programming (9 V W#/ACC) | Cuts page program time to ≤1.5 ms (typical), critical for over-the-air update latency in remote devices |
| CFI Compliance | Permits automatic flash detection and parameter loading in generic bootloader frameworks (e.g., U-Boot) |
| OTP Locking Capability | Prevents reprogramming of security-critical fields (e.g., MAC address, cryptographic keys) after factory provisioning |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code Retention |
|---|---|
|
Use Scenario: Storing firmware images and runtime configuration for programmable logic controllers deployed in factory automation environments with ambient temperatures up to 85°C. IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP-capable Quad I/O interface for deterministic boot execution and field-upgradable logic programs. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity across 15+ year product lifecycles without replacement. |
Use Scenario: Holding certified bootloaders and safety-critical diagnostic routines in portable ultrasound and infusion pump systems requiring IEC 62304 compliance. IC Role / Device Role / Timing Role: Secure, tamper-evident storage for signed firmware images using OTP-locked cryptographic keys and CFI-verified memory layout. Use Value: Factory-programmed 128-bit OTP prevents unauthorized firmware modification, satisfying regulatory traceability requirements. |
| Automotive Infotainment Head Unit | Smart Energy Meter Firmware |
|
Use Scenario: Hosting Linux kernel, root filesystem, and UI assets in automotive-grade infotainment units operating across –40°C to +105°C junction temperature range. IC Role / Device Role / Timing Role: High-speed Quad I/O memory supporting eMMC-like sequential read performance for responsive GUI rendering and OTA update staging. Use Value: 40 MB/s read bandwidth eliminates bottlenecks during multimedia asset loading and system resume-from-suspend operations. |
Use Scenario: Storing AMI firmware, tariff tables, and encrypted metering logs in ANSI C12.22-compliant smart electricity meters deployed in utility substations. IC Role / Device Role / Timing Role: Radiation-tolerant, long-life nonvolatile memory with sub-sector erase for incremental firmware patches without disrupting billing data partitions. Use Value: 4 KB sub-sector erase minimizes write disturbance to revenue-grade metering registers during remote firmware upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI200 | Successor device with identical 128 Mbit density, enhanced 133 MHz Quad I/O speed, and improved 200K-cycle endurance; same 24-ball BGA (6×4) footprint | Supports faster boot sequences and higher-frequency MCU interfaces; requires updated timing parameters in driver stack | Select for new designs requiring extended lifecycle support and higher performance margins |
| MX25L12833FZC-10G | Micron-compatible 128 Mbit SPI Flash with 104 MHz Quad I/O, but lacks W#/ACC acceleration and OTP locking; uses different status register bit mapping | Lower cost alternative where accelerated programming and secure OTP are not required | Choose only if existing firmware already supports Macronix command set and no secure ID provisioning is needed |
Compared with S25FL129P0XBHI200, the S25FL128S offers measurable gains in speed and endurance while maintaining pin and command compatibility, whereas MX25L12833FZC-10G trades security and acceleration features for cost - making it suitable only in non-security-critical, cost-sensitive volume applications.
Availability
S25FL129P0XBHI200 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot code retention, and automotive infotainment head unit applications requiring stable component supply and long-term obsolescence management.
Supply support for S25FL129P0XBHI200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor, founded in 1982, delivers high-performance embedded solutions including programmable SoCs, analog ICs, connectivity products, and reliable nonvolatile memories for automotive, industrial, and consumer systems.
The S25FL129P belongs to Cypress's Spansion-branded serial NOR Flash product line, designed specifically for robust, high-reliability code storage in mission-critical embedded systems requiring long data retention and field-upgradable firmware.
FAQ
Is S25FL129P0XBHI200 still recommended for new designs?
No - Cypress explicitly states this part is not recommended for new or current designs. The factory-recommended migration path is S25FL128S, which offers higher performance, extended endurance, and active lifecycle support. S25FL129P0XBHI200 remains available for legacy design continuity and repair scenarios only.
What package variant does S25FL129P0XBHI200 use?
S25FL129P0XBHI200 uses the 24-ball BGA package with 6 × 4 pin configuration (FAC024), measuring 6 mm × 8 mm. It features an exposed thermal pad on the underside that may be connected to GND if PCB routing maintains 0 mV potential difference relative to the GND ball.
Does this device support Quad SPI mode with hardware write protection?
Yes - it supports Quad I/O High Performance Read (QIOR) and Quad Page Program (QPP) using SI, SO, W#/ACC, and HOLD# as bidirectional I/O lines. Hardware write protection is implemented via Status Register BP2–BP0 bits controlled by the W#/ACC pin state and software commands.
Can the OTP area be reprogrammed after initial programming?
No - the 128-bit factory OTP region can be permanently locked after programming, preventing further writes. The additional 490-byte user OTP area supports multiple reprogramming cycles until explicitly locked via the OTP lock command, after which it becomes read-only.
S25FL129P0XBHI200 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 5µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL129P0XBHI200 FAQ
1.How can I place an order for S25FL129P0XBHI200 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL129P0XBHI200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL129P0XBHI200 reliable?
The price and inventory of S25FL129P0XBHI200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL129P0XBHI200 is usually 5 days.
3.What payment methods are accepted for S25FL129P0XBHI200?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL129P0XBHI200 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL129P0XBHI200?
S25FL129P0XBHI200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL129P0XBHI200 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL129P0XBHI200?
For technical support, including S25FL129P0XBHI200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL129P0XBHI200 requirements.
6.How does Aetrix verify that S25FL129P0XBHI200 is sourced from the original manufacturer or authorized distributors?
All S25FL129P0XBHI200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL129P0XBHI200 meets industry standards.
7.What is the process for return or replacement of S25FL129P0XBHI200?
All S25FL129P0XBHI200 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL129P0XBHI200, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL129P0XBHI200 part is unused and in its original packaging.
Return procedure for S25FL129P0XBHI200:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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