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Infineon Technologies S25FL129P0XBHIY10

Part No.:
S25FL129P0XBHIY10
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL129P0XBHIY10.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,473

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Product details

Overview

S25FL129P0XBHIY10 from Cypress Semiconductor is a 128-Mbit (16 MB), 3.0 V serial NOR Flash memory with uniform 64 KB sectors and dual/quad I/O support, operating across 2.7–3.6 V. It delivers up to 40 MB/s effective read bandwidth via Quad I/O FAST_READ, features 100,000 program/erase cycles per sector, 20-year data retention, and integrated OTP (128-bit secure ID + 490-byte user space). Used in boot code storage for industrial microcontrollers and FPGA configuration.

For engineers reviewing the S25FL129P0XBHIY10 datasheet, S25FL129P0XBHIY10 pinout, S25FL129P0XBHIY10 application, or S25FL129P0XBHIY10 equivalent, key selection criteria include SPI interface timing compliance (up to 104 MHz FAST_READ), sub-sector erase capability (4 KB), W#/ACC-accelerated programming, and BGA/WSON/SO package compatibility with legacy Spansion/Cypress designs.

Technical Context

The S25FL129P0XBHIY10 implements a SPI-compatible serial interface with five extended command sets: Dual Output Read (DOR), Quad Output Read (QOR), Dual I/O Read (DIOR), Quad I/O Read (QIOR), and Quad Page Program (QPP). It supports both uniform 64 KB sectors (with 32 × 4 KB sub-sectors) and uniform 256 KB sectors, enabling flexible firmware partitioning.

Internally, it uses Cypress's 0.09 µm MirrorBit® process and integrates CFI-compliant identification, status/configuration registers, and hardware-based memory protection via BP2–BP0 bits and W#/ACC pin control. The device requires no external high-voltage supply - accelerated programming is enabled by applying 9 V to W#/ACC.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 Mbit (16 MB) - sufficient for full MCU boot images and FPGA bitstreams in space-constrained embedded systems.
Supply Voltage Range 2.7 V to 3.6 V - single-supply operation compatible with 3.3 V system rails without level-shifting.
Read Speed (Quad I/O) 80 MHz clock / 40 MB/s effective - enables fast code execution directly from flash (XIP) in real-time applications.
Page Program Time 1.5 ms typical (256-byte page) - defines minimum write latency for firmware updates and parameter logging.
Erase Granularity 4 KB sub-sector, 64 KB sector, 256 KB sector, bulk - allows precise field-upgrade of bootloader sections without erasing entire image.
Data Retention 20 years typical - meets long-life requirements for industrial controllers and medical devices with infrequent reprogramming.
Cycling Endurance 100,000 cycles per sector - supports robust over-the-air (OTA) update mechanisms in connected edge devices.
OTP Capacity 128-bit secure ID + 490-byte user area - enables device authentication and calibration data storage without external EEPROM.

Pinout & Package

Package: 8-contact WSON (6 × 8 mm), RoHS-compliant, with exposed thermal pad (not electrically connected; may be tied to GND if potential difference is 0 mV).

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enable for SPI communication; required falling edge after power-up before command acceptance.
SCK Serial Clock Drives all timing: latches input on rising edge, outputs data on falling edge; supports up to 104 MHz.
SI/IO0 Serial Input / I/O0 Primary data input in standard mode; becomes bidirectional I/O0 in Dual/Quad I/O modes.
SO/IO1 Serial Output / I/O1 Primary data output in standard mode; becomes bidirectional I/O1 in Dual/Quad I/O modes.
W#/ACC/IO2 Write Protect / Acceleration / I/O2 Hardware write protection when low; enables accelerated programming at 9 V; serves as I/O2 in Quad modes.
HOLD#/IO3 Hold / I/O3 Pauses ongoing SPI transfer without deselecting chip; functions as I/O3 in Quad I/O and QPP modes.
VCC Power Supply Single 2.7–3.6 V supply powers all read/write/erase operations; internal charge pumps generate programming voltages.
GND Ground Reference for all signals and internal regulation; must be low-impedance connection for stable erase/write margins.

Key Features

Feature Design Value
Dual/Quad I/O High-Performance Read Enables 2×/4× throughput vs standard SPI - critical for XIP-capable MCUs requiring low-latency instruction fetch.
Sub-Sector Erase (4 KB) Allows selective firmware patching without disturbing adjacent boot or config data - reduces OTA update risk and time.
W#/ACC Pin Accelerated Programming Reduces page program time by ~40% when 9 V applied - improves production programming throughput and field update speed.
CFI Compliance Enables automatic flash detection and driver configuration in Linux/Bare-metal bootloaders - eliminates hard-coded timing assumptions.
One-Time Programmable Area Provides tamper-resistant storage for cryptographic keys or device-specific calibration - avoids external secure elements.

Applications

Industrial PLC Firmware Storage FPGA Configuration Memory

Use Scenario: Storing boot firmware and runtime logic for programmable logic controllers deployed in factory automation environments with ambient temperatures up to 85°C.

IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP-capable Quad I/O interface; provides deterministic 40 MB/s read access for real-time task scheduling.

Use Value: Eliminates external SRAM buffering and reduces BOM count by enabling direct execution from flash - lowering system cost and board area.

Use Scenario: Holding configuration bitstreams for Xilinx Artix-7 and Intel Cyclone V FPGAs in test equipment and protocol analyzers.

IC Role / Device Role / Timing Role: SPI-configurable serial NOR delivering verified CRC-checked bitstream loading at ≤100 ms startup time.

Use Value: Supports hot-swap reconfiguration via Quad I/O mode - enables field-upgradable FPGA functionality without power cycling.

Medical Imaging Bootloader Automotive ADAS Camera Module

Use Scenario: Hosting certified bootloader and diagnostic firmware in portable ultrasound and MRI console subsystems requiring 20-year data integrity.

IC Role / Device Role / Timing Role: Secure, long-retention storage with OTP-locked calibration constants and anti-rollback version counters.

Use Value: Meets IEC 62304 Class C software requirements through hardware-enforced write protection and sector-level erase isolation.

Use Scenario: Storing camera sensor initialization tables and ISP firmware in rear-view and surround-view modules operating at −40°C to +105°C.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified (per S25FL129P family) serial flash with sub-sector erase for incremental firmware patches.

Use Value: Enables ASIL-B compliant OTA updates by isolating safety-critical boot code from non-critical feature updates in separate 4 KB sectors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S25FL128SAGMFI10 Successor device: same density, 1.8 V/3.0 V dual-voltage support, enhanced 133 MHz Quad I/O, improved ECC, and updated CFI table. Supports mixed-voltage systems and higher-speed XIP; lacks W#/ACC acceleration but adds built-in error correction. Select for new designs requiring longer product lifecycle, automotive qualification, or tighter bit-error tolerance.
MX25L12833FZNI-10G 128 Mbit Macronix device: 104 MHz max clock, no W#/ACC pin, no sub-sector erase (only 4 KB sector erase), 100K cycles, 20-year retention. Compatible pinout in SO8/WSON; lacks Quad Page Program and accelerated programming - slower field updates. Select where cost sensitivity outweighs programming speed; verify hold-time compliance for existing S25FL129P layouts.

Compared with S25FL129P0XBHIY10, the S25FL128S offers higher performance and broader voltage support but removes W#/ACC acceleration, while the MX25L12833F provides drop-in layout compatibility at lower cost but sacrifices sub-sector flexibility and programming speed.

Availability

S25FL129P0XBHIY10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, FPGA configuration memory, medical imaging bootloader, and automotive ADAS camera module applications requiring stable component supply and legacy design continuity.

Supply support for S25FL129P0XBHIY10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies since 2020) is a leader in high-performance, reliable embedded memory and programmable solutions for automotive, industrial, and consumer systems.

The S25FL129P belongs to the FL-P family of serial NOR flash devices, designed specifically for code storage and execution in resource-constrained, high-reliability embedded systems requiring long-term data integrity and flexible erase granularity.

FAQ

Is S25FL129P0XBHIY10 still recommended for new designs?

No. Cypress explicitly states this part is not recommended for new or current designs. The factory-recommended migration path is S25FL128S, which offers dual-voltage support, higher Quad I/O speed (133 MHz), and enhanced reliability features. S25FL129P0XBHIY10 remains viable only for sustaining legacy production with documented qualification.

What package does S25FL129P0XBHIY10 use, and is the thermal pad electrically active?

S25FL129P0XBHIY10 uses the 8-contact WSON package (6 × 8 mm, part code "Y"). Its exposed central pad is not electrically connected to any internal circuitry. It may be soldered to a GND copper pour only if PCB routing ensures zero voltage difference between the pad and the GND pin - otherwise, it must remain floating.

Does S25FL129P0XBHIY10 support Quad SPI mode without external high voltage?

Yes. Standard Quad I/O read (QIOR) and Quad Page Program (QPP) operate at normal VCC (2.7–3.6 V); no external high voltage is needed for basic Quad functionality. The 9 V applied to W#/ACC is optional and used exclusively to activate accelerated programming - it does not affect Quad I/O timing or signal integrity.

How is memory protection implemented on S25FL129P0XBHIY10?

Protection is implemented via three Status Register bits (BP2–BP0) that configure block lock/unlock states for top/bottom sectors, combined with hardware control of the W#/ACC pin. When W#/ACC is low, protected sectors cannot be programmed or erased - even if software issues a valid command. This provides hardware-enforced security independent of firmware state.

S25FL129P0XBHIY10 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-P
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
5µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL129P0XBHIY10 FAQ

1.How can I place an order for S25FL129P0XBHIY10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL129P0XBHIY10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL129P0XBHIY10 reliable?

The price and inventory of S25FL129P0XBHIY10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL129P0XBHIY10 is usually 5 days.

3.What payment methods are accepted for S25FL129P0XBHIY10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL129P0XBHIY10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL129P0XBHIY10?

S25FL129P0XBHIY10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL129P0XBHIY10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL129P0XBHIY10?

For technical support, including S25FL129P0XBHIY10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL129P0XBHIY10 requirements.

6.How does Aetrix verify that S25FL129P0XBHIY10 is sourced from the original manufacturer or authorized distributors?

All S25FL129P0XBHIY10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL129P0XBHIY10 meets industry standards.

7.What is the process for return or replacement of S25FL129P0XBHIY10?

All S25FL129P0XBHIY10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL129P0XBHIY10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL129P0XBHIY10 part is unused and in its original packaging.

Return procedure for S25FL129P0XBHIY10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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