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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S25FL129P0XBHIZ10

Name: S25FL129P0XBHIZ10
Brand: Infineon Technologies
SKU: S25FL129P0XBHIZ10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S25FL129P0XBHIZ10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 24-TBGA

Datasheet:: S25FL129P0XBHIZ10.pdf

Description:: IC FLASH 128MBIT SPI/QUAD 24BGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S25FL129P0XBHIZ10 from Cypress Semiconductor is a 128-Mbit (16 MB), 3.0 V serial NOR Flash memory with uniform 64 KB sectors and dual/quad I/O support, designed for embedded firmware storage in microcontroller-based systems. It operates across 2.7–3.6 V, delivers up to 40 MB/s effective read throughput via Quad I/O FAST_READ, supports 100,000 program/erase cycles per sector, and includes 128-bit OTP for secure device identification.

For engineers reviewing the S25FL129P0XBHIZ10 datasheet, S25FL129P0XBHIZ10 pinout, S25FL129P0XBHIZ10 application, or S25FL129P0XBHIZ10 equivalent, key selection criteria include SPI interface timing compliance (104 MHz max FAST_READ), sub-sector erase capability (4 KB), OTP programmability, and WSON-8 (6 × 8 mm) package compatibility with space-constrained PCB layouts.

Technical Context

The S25FL129P0XBHIZ10 implements a SPI-compatible serial interface with five extended command sets-including QIOR, DIOR, QPP, DOR, and QOR-to enable high-speed dual/quad I/O data transfers. Its memory array is partitioned into 256 uniform 64 KB sectors, with the top/bottom two sectors subdivided into thirty-two 4 KB sub-sectors for granular firmware update control.

It integrates on-die voltage regulation for internal programming/erase operations, uses MirrorBit® 0.09 µm process technology, and supports accelerated programming via 9 V applied to the W#/ACC pin. Memory protection is enforced through Status Register BP2–BP0 bits and hardware W#/ACC pin assertion.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	128 Mbit (16 MB) - sufficient for full MCU boot code + configuration + OTA update image in resource-constrained edge devices.
Supply Voltage Range	2.7 V to 3.6 V - compatible with standard 3.3 V logic rails and tolerant of brown-out conditions down to 2.7 V.
Read Throughput	40 MB/s (Quad I/O FAST_READ) - enables sub-400 ms firmware load time for 16 MB images at system startup.
Program/Erase Endurance	100,000 cycles per sector - supports frequent field firmware updates over 10+ years in industrial controllers.
Data Retention	20 years typical - ensures long-term reliability of stored calibration data and security keys without refresh.
OTP Capacity	128-bit factory-lockable area + 490-byte user-programmable space - provides immutable device identity and flexible secure provisioning.
Erase Granularity	4 KB sub-sector, 64 KB sector, 256 KB sector, bulk - allows precise partial firmware patching without full image reflash.

Pinout & Package

Package: 8-contact WSON (6 × 8 mm), RoHS-compliant, with exposed thermal pad (not electrically connected).

Pin/Terminal	Circuit Role	Design Meaning
CS#	Chip Select	Active-low enable for SPI transaction initiation; required falling edge after power-up before command acceptance.
SCK	Serial Clock	Master-generated clock (up to 104 MHz); rising edge latches SI input, falling edge triggers SO output.
SI/IO0	Serial Input / I/O0	Primary data input in standard mode; bidirectional I/O in Dual/Quad I/O modes for command/address/data transfer.
SO/IO1	Serial Output / I/O1	Primary data output in standard mode; bidirectional I/O in Dual/Quad I/O modes for high-speed readback.
W#/ACC/IO2	Write Protect / Acceleration / I/O2	Hardware write lock when low; enables accelerated programming when 9 V applied; serves as I/O2 in Quad modes.
HOLD#/IO3	Hold / I/O3	Pauses ongoing SPI transfer without chip deselect; functions as I/O3 in Quad I/O and Quad Page Program modes.
VCC	Power Supply	Single 2.7–3.6 V supply powers all read/write/erase operations; internal charge pumps generate required high voltages.
GND	Ground	Reference return path; must be low-impedance and isolated from noisy digital ground planes per layout guidelines.

Key Features

Feature	Design Value
Dual/Quad I/O Read Modes	Enables 20 MB/s (DUAL) or 40 MB/s (QUAD) effective read rates-reducing boot latency by >60% vs. standard SPI.
Sub-Sector Erase (4 KB)	Allows firmware differential updates without erasing adjacent functional code blocks-critical for fail-safe OTA deployment.
Accelerated Programming	Reduces page program time to 1.5 ms (typical) using 9 V on W#/ACC-cutting full 16 MB flash programming time by ~35%.
CFI Compliance	Permits automatic host detection and runtime configuration of memory geometry, eliminating hard-coded address map dependencies.
OTP Security Area	128-bit factory-lockable region prevents post-deployment reprogramming-meets basic secure boot root-of-trust requirements.

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Image

Use Scenario: Storing firmware, configuration tables, and calibration data in programmable logic controllers operating in harsh temperature environments (-40°C to +85°C).

IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic 104 MHz SPI access during cold start and runtime firmware validation.

Use Value: 20-year data retention and 100K-cycle endurance ensure reliable operation over 15+ year product lifecycles without field replacement.

Use Scenario: Holding safety-critical boot code and sensor fusion algorithms for camera/radar processing units in autonomous driving systems.

IC Role / Device Role / Timing Role: Secure, fast-read NOR Flash supporting ASIL-B compliant boot integrity checks via OTP-verified signature verification.

Use Value: Quad I/O 40 MB/s throughput reduces boot time to <300 ms, meeting automotive functional safety startup timing budgets.

Medical Infusion Pump Calibration

Smart Home Gateway OTA Updates

Use Scenario: Storing calibrated dosing parameters and usage logs in Class II medical devices requiring FDA 21 CFR Part 11 compliance.

IC Role / Device Role / Timing Role: Tamper-resistant non-volatile memory with locked OTP region for immutable device serialization and audit trail anchoring.

Use Value: 128-bit OTP lock prevents unauthorized parameter modification-supporting regulatory traceability and anti-counterfeiting requirements.

Use Scenario: Hosting primary firmware and delta update patches in cloud-connected residential gateways with constrained bandwidth and power budgets.

IC Role / Device Role / Timing Role: Field-upgradable storage enabling atomic sub-sector (4 KB) firmware patching without full image download or device reboot.

Use Value: Sub-sector erase minimizes wireless data transfer volume by >92% vs. full 16 MB reflash-extending battery life and reducing network congestion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S25FL128SAGMFV010	Successor device with identical 128 Mbit density, enhanced 133 MHz FAST_READ, and improved deep power-down current (1 µA vs. 3 µA).	Designed for new designs requiring longer battery life and faster boot; lacks P4E/P8E sub-sector erase commands.	Select when migrating to Cypress's current-generation SPI Flash platform with tighter power specs and higher speed.
MX25L12833FZNI-10G	128 Mbit Macronix device with 104 MHz max clock, same WSON-8 package, but no OTP area and only 64 KB sector erase granularity.	Lower-cost option where secure device ID and sub-sector updates are not required; supports JEDEC-standard SFDP only.	Choose for cost-sensitive consumer applications where firmware update flexibility and cryptographic binding are unnecessary.

Compared with S25FL129P0XBHIZ10, the S25FL128S offers higher performance and lower standby current but removes sub-sector erase-making it unsuitable for incremental OTA patching-while the MX25L12833F lacks OTP and fine-grained erase, limiting its use in secure or field-upgradable systems.

Availability

S25FL129P0XBHIZ10 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical infusion pumps, and smart home gateways requiring stable component supply and long-term obsolescence management.

Supply support for S25FL129P0XBHIZ10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor, founded in 1982 and now part of Infineon Technologies, delivers high-performance embedded solutions including microcontrollers, connectivity ICs, and non-volatile memories for automotive, industrial, and consumer applications.

The S25FL129P belongs to Cypress's Spansion-branded serial NOR Flash product line, engineered specifically for deterministic firmware storage in safety-critical and field-upgradable embedded systems requiring robust data retention and secure provisioning.

FAQ

Is S25FL129P0XBHIZ10 pin-compatible with S25FL128P?

Yes, S25FL129P0XBHIZ10 is backward compatible with S25FL128P in uniform 256 KB sector configuration, sharing identical pinout, command set, and timing specifications. However, S25FL129P adds sub-sector erase (P4E/P8E) and quad I/O instructions not present in S25FL128P-requiring firmware validation before drop-in replacement.

What is the function of the exposed pad on the WSON-8 package?

The exposed central pad on the WSON-8 package is a thermal pad with no electrical connection. It may be tied to PCB ground plane for thermal dissipation, provided zero voltage difference is maintained between the pad and GND pin-no solder mask opening or vias are required unless thermal simulation confirms necessity.

Can the OTP area be reprogrammed after locking?

No. Once the 128-bit OTP region is locked via the OTP Lock command (0x4B), it becomes permanently read-only. The lock is irreversible and enforced by on-die fuse circuitry. Unlocked OTP space can be programmed multiple times, but each bit can only transition from '1' to '0', not vice versa.

Does S25FL129P0XBHIZ10 support Quad SPI mode without external pull-ups?

Yes. All I/O pins (SI/IO0, SO/IO1, W#/ACC/IO2, HOLD#/IO3) have internal weak pull-ups enabled during reset and after Deep Power-Down exit. External pull-ups are optional but recommended for noise immunity in high-speed (>50 MHz) Quad I/O operation on long traces or noisy boards.

S25FL129P0XBHIZ10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FL-P

Package/Case:: 24-TBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 128Mbit

Memory Organization:: 16M x 8

Memory Interface:: SPI - Quad I/O

Clock Frequency:: 104 MHz

Write Cycle Time - Word, Page:: 5µs, 3ms

Access Time:: -

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 24-BGA (8x6)

S25FL129P0XBHIZ10 FAQ

1.How can I place an order for S25FL129P0XBHIZ10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL129P0XBHIZ10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL129P0XBHIZ10 reliable?

The price and inventory of S25FL129P0XBHIZ10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL129P0XBHIZ10 is usually 5 days.

3.What payment methods are accepted for S25FL129P0XBHIZ10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL129P0XBHIZ10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL129P0XBHIZ10?

S25FL129P0XBHIZ10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL129P0XBHIZ10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL129P0XBHIZ10?

For technical support, including S25FL129P0XBHIZ10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL129P0XBHIZ10 requirements.

6.How does Aetrix verify that S25FL129P0XBHIZ10 is sourced from the original manufacturer or authorized distributors?

All S25FL129P0XBHIZ10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL129P0XBHIZ10 meets industry standards.

7.What is the process for return or replacement of S25FL129P0XBHIZ10?

All S25FL129P0XBHIZ10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL129P0XBHIZ10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL129P0XBHIZ10 part is unused and in its original packaging.

Return procedure for S25FL129P0XBHIZ10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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