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Infineon Technologies S25FL129P0XBHV213
- Part No.:
- S25FL129P0XBHV213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL129P0XBHV213.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,929
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Product details
Overview
S25FL129P0XBHV213 from Cypress Semiconductor is a 128-Mbit (16 MB), 3.0 V serial NOR Flash memory with uniform 64 KB sectors and dual/quad I/O support, designed for embedded boot code storage and firmware updates in microcontroller-based systems. It operates across 2.7–3.6 V, supports FAST_READ up to 104 MHz, Quad Page Programming, and includes 128-bit OTP for secure device identification.
For engineers reviewing the S25FL129P0XBHV213 datasheet, S25FL129P0XBHV213 pinout, S25FL129P0XBHV213 application, or S25FL129P0XBHV213 equivalent, key selection criteria include sector architecture (64 KB with 4 KB sub-sectors), SPI interface timing compliance (Mode 0/3), deep power-down current (3 µA), and factory-recommended migration path to S25FL128S.
Technical Context
The S25FL129P0XBHV213 implements a SPI-compatible serial interface with five extended instructions enabling Dual Output Read (DOR), Quad Output Read (QOR), Dual I/O Read (DIOR), Quad I/O Read (QIOR), and Quad Page Program (QPP). It uses Cypress's MirrorBit® charge-trapping technology on a 0.09 µm process, delivering 100,000 program/erase cycles and 20-year data retention.
Memory organization includes two configurable layouts: 256 × 64 KB sectors (with top/bottom 64 KB sectors subdivided into thirty-two 4 KB sub-sectors) or 64 × 256 KB sectors. Protection is enforced via Status Register BP2–BP0 bits and W#/ACC pin control, while CFI compliance enables host-system auto-configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (16 MB) - sufficient for full MCU boot image + application firmware in space-constrained designs |
| Supply Voltage | 2.7–3.6 V - single-supply operation compatible with 3.3 V system rails without level-shifting |
| Read Speed | 104 MHz FAST_READ - enables <100 ns effective access time for critical boot code fetch |
| Page Program Time | 1.5 ms typical (256-byte page) - balances speed and write endurance in field-upgrade scenarios |
| Erase Granularity | 4 KB sub-sector, 64 KB sector, 256 KB sector, bulk - allows fine-grained firmware patching without full-image reflash |
| OTP Capacity | 128-bit factory-programmable + 490-byte user-programmable - supports unique device ID and secure key storage |
| Power Consumption | 3 µA deep power-down - extends battery life in always-on IoT edge nodes during idle periods |
Pinout & Package
Package: 24-ball BGA (6 × 8 mm), 6 × 4 pin configuration (FAC024 footprint), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command initiation; required falling edge after power-up before first instruction |
| SCK | Serial Clock | Master-generated clock (up to 104 MHz); rising edge latches input (SI/IO0), falling edge triggers output (SO/IO1) |
| SI/IO0 | Serial Input / I/O0 | Primary data input in standard mode; bidirectional in Dual/Quad I/O modes for high-throughput reads/writes |
| SO/IO1 | Serial Output / I/O1 | Primary data output in standard mode; bidirectional in Dual/Quad I/O modes; high-impedance when HOLD# active |
| HOLD#/IO3 | Hold Control / I/O3 | Pauses ongoing SPI transaction without deselecting chip; functions as I/O3 in Quad I/O mode |
| W#/ACC/IO2 | Write Protect / Acceleration / I/O2 | Enables hardware write protection (low = protected); supplies 9 V for accelerated programming; acts as I/O2 in Quad modes |
| VCC | Supply Voltage | 2.7–3.6 V main power; internally regulates voltages for erase/program operations |
| GND | Ground | Reference for all I/O and internal logic; exposed thermal pad in WSON variant must be tied to GND at 0 mV potential |
Key Features
| Feature | Design Value |
|---|---|
| Dual/Quad I/O High-Performance Read | Up to 40 MB/s effective throughput (QIOR at 80 MHz) - reduces firmware load latency in real-time boot sequences |
| Flexible Sector Architecture | Configurable 64 KB sectors with 4 KB sub-sectors or 256 KB uniform sectors - supports both granular OTA updates and legacy compatibility |
| Accelerated Programming Mode | 9 V applied to W#/ACC pin cuts page program time by ~40% - improves manufacturing flash programming throughput |
| CFI Compliance | JEDEC-standard query table enables automatic detection and parameter loading by host bootloader - eliminates hard-coded memory geometry |
| Secure OTP Area | 128-bit factory-lockable region + 490-byte user area - meets requirements for device authentication and cryptographic key binding |
Applications
| Industrial PLC Firmware Storage | Automotive Infotainment Boot Memory |
|---|---|
|
Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers operating in extended temperature ranges (−40°C to +85°C). IC Role / Device Role / Timing Role: Primary non-volatile boot memory interfaced via SPI to ARM Cortex-M7 MCU; provides deterministic read latency under EMC stress. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity over 15+ year product lifecycles without refresh. |
Use Scenario: Holding U-Boot, Linux kernel, and HMI assets in head-unit systems requiring fast cold-boot (<500 ms) and AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: SPI NOR Flash providing quad-I/O read capability to feed DDR3 controller initialization code before DRAM training begins. Use Value: 104 MHz FAST_READ and 4 KB sub-sector erase allow rapid partial updates of navigation map data without disrupting core OS partitions. |
| Medical Imaging Device Configuration | Smart Energy Meter Secure Boot |
|
Use Scenario: Storing calibration tables, sensor compensation coefficients, and regulatory-compliant boot images in portable ultrasound equipment. IC Role / Device Role / Timing Role: Trusted firmware store accessed during power-on self-test; OTP region holds cryptographic root-of-trust keys. Use Value: Factory-programmed 128-bit OTP prevents cloning and ensures traceability per IEC 62304 software lifecycle requirements. |
Use Scenario: Enabling secure boot verification in ANSI C12.22-compliant smart meters using public-key signature checking against stored firmware hash. IC Role / Device Role / Timing Role: SPI NOR Flash hosting signed bootloader and encrypted application image; deep power-down mode minimizes battery drain during meter sleep cycles. Use Value: 3 µA deep power-down current extends 10-year lithium-thionyl chloride battery life while maintaining tamper-resistant firmware storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL128SAGMFI000 | Successor device with same density (128 Mbit), 133 MHz max read speed, enhanced ECC, and updated 6 × 5 BGA (FAB024) package | Designed for new designs requiring longer product lifecycle support and improved bit-error resilience in high-radiation environments | Select for new designs; not pin-compatible with S25FL129P0XBHV213 due to different BGA pinout and voltage tolerance (1.8/3.0 V dual supply) |
| MX25L12835FMI-10G | 128 Mbit, 104 MHz max read, 3.3 V only, no OTP, no accelerated programming, standard SO8/WSON/BGA packages | Lacks sub-sector erase and hardware-accelerated programming; suitable for cost-sensitive consumer applications without security needs | Use where OTP, 4 KB erase granularity, or W#/ACC acceleration are not required; verify timing margins for QIOR compatibility |
Compared with S25FL129P0XBHV213, the S25FL128S offers higher performance and extended support but requires PCB redesign, while the MX25L12835F sacrifices security and flexibility for lower BOM cost-making the original part optimal for legacy industrial systems needing verified sub-sector control and OTP integrity.
Availability
S25FL129P0XBHV213 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive infotainment boot memory, and medical imaging device configuration requiring stable component supply and long-term obsolescence management.
Supply support for S25FL129P0XBHV213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies since 2020) is a leader in high-performance, reliable embedded memory and microcontroller solutions, founded in 1982 and headquartered in San Jose, CA.
The S25FL129P belongs to Cypress's Spansion-branded serial NOR Flash family, engineered specifically for robust, low-power, high-reliability code storage in automotive, industrial, and medical systems demanding long data retention and secure firmware update capabilities.
FAQ
Is S25FL129P0XBHV213 still recommended for new designs?
No. Cypress explicitly states this part is "not recommended for new and current designs." The factory-recommended migration path is S25FL128S, which offers higher read speed (133 MHz), enhanced ECC, and continued long-term support. S25FL129P0XBHV213 remains viable only for sustaining existing production with validated designs and controlled obsolescence planning.
What does the '0XBHV213' suffix indicate in the full part number?
The suffix encodes packaging and screening: '0X' denotes commercial temperature range (0°C to +70°C), 'B' indicates 24-ball BGA package (FAC024, 6×4 pin grid), 'H' specifies lead-free/RoHS compliance, 'V213' identifies the specific wafer lot and assembly revision per Cypress's internal traceability system-not a functional variant.
Can S25FL129P0XBHV213 operate in Quad I/O mode with standard 3.3 V IO levels?
Yes. All I/O pins (SI/IO0, SO/IO1, W#/ACC/IO2, HOLD#/IO3) are 3.3 V tolerant and fully functional in Quad I/O mode at up to 80 MHz clock rate. No external level shifters are needed when interfacing with 3.3 V microcontrollers, though setup/hold timing must comply with tSU and tH specifications in the AC Characteristics table (Section 18).
How is the OTP area protected from accidental overwrite?
The 128-bit factory OTP region can be permanently locked using the Write Lock-Bits (WLB) command (C0h), which sets status register bit SRWD and disables further writes to that region. Once locked, the OTP cannot be unlocked or rewritten-even with power cycling. User-programmable OTP (490 bytes) uses separate OTPP/OTPR commands and is protected by Status Register BP bits when configured for block protection.
S25FL129P0XBHV213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-P
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 104 MHz
- Write Cycle Time - Word, Page:
- 5µs, 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL129P0XBHV213 FAQ
1.How can I place an order for S25FL129P0XBHV213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL129P0XBHV213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL129P0XBHV213 reliable?
The price and inventory of S25FL129P0XBHV213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL129P0XBHV213 is usually 5 days.
3.What payment methods are accepted for S25FL129P0XBHV213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL129P0XBHV213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL129P0XBHV213?
S25FL129P0XBHV213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL129P0XBHV213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL129P0XBHV213?
For technical support, including S25FL129P0XBHV213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL129P0XBHV213 requirements.
6.How does Aetrix verify that S25FL129P0XBHV213 is sourced from the original manufacturer or authorized distributors?
All S25FL129P0XBHV213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL129P0XBHV213 meets industry standards.
7.What is the process for return or replacement of S25FL129P0XBHV213?
All S25FL129P0XBHV213 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL129P0XBHV213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL129P0XBHV213 part is unused and in its original packaging.
Return procedure for S25FL129P0XBHV213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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