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Infineon Technologies S25FL129P0XBHV310

Part No.:
S25FL129P0XBHV310
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL129P0XBHV310.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,456

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Product details

Overview

S25FL129P0XBHV310 from Cypress Semiconductor is a 128-Mbit (16 MB), single-supply 2.7–3.6 V serial NOR Flash memory with uniform 64 KB sectors and dual/quad I/O support, delivering up to 40 MB/s effective read throughput via Quad I/O FAST_READ. It features 100,000 program/erase cycles per sector, 20-year data retention, and integrated OTP (16-byte secure ID + 490-byte user space). Used in boot code storage for industrial microcontrollers and FPGA configuration in space-constrained embedded systems.

For engineers reviewing the S25FL129P0XBHV310 datasheet, S25FL129P0XBHV310 pinout, S25FL129P0XBHV310 application, or S25FL129P0XBHV310 equivalent, key selection criteria include SPI interface mode compatibility (standard/dual/quad), sector protection granularity (4 KB sub-sectors), W#/ACC-accelerated programming, and BGA/WSON package footprint constraints for PCB layout.

Technical Context

The S25FL129P0XBHV310 implements a SPI-compatible serial interface with five extended command sets enabling Dual Output Read (DOR), Quad Output Read (QOR), Dual I/O Read (DIOR), Quad I/O Read (QIOR), and Quad Page Program (QPP). It supports both standard SPI clocking (up to 40 MHz) and high-speed modes (up to 80 MHz clock rate, 40 MB/s effective).

Internally, it uses Cypress's 0.09 µm MirrorBit® process and integrates CFI-compliant identification registers, status/configuration registers with BP2–BP0 block protection bits, and dedicated OTP memory mapped at fixed addresses. The device requires no external high-voltage supply-accelerated programming is enabled by applying 9 V to the W#/ACC pin.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 Mbit (16 MB), organized as 256 × 64 KB sectors with top/bottom 64 KB parameter blocks split into thirty-two 4 KB sub-sectors
Supply Voltage 2.7–3.6 V single supply; internally regulated voltages enable program/erase without external HV
Read Throughput Up to 40 MB/s effective (Quad I/O FAST_READ at 80 MHz clock)
Program/Erase Endurance 100,000 cycles per sector (typical), enabling reliable firmware update logging in field-deployed devices
Data Retention 20 years (typical) at 55 °C, suitable for long-lifecycle industrial control and medical equipment
OTP Capacity 16 bytes (128-bit secure ID) + 490 bytes user-programmable OTP space, locked permanently after programming
Power Modes Standby: 80 µA typical; Deep Power-Down: 3 µA typical-critical for battery-backed IoT edge nodes

Pinout & Package

Package: 24-ball BGA (6 × 8 mm), 6 × 4 pin configuration (FAC024), RoHS-compliant, lead-free, with exposed thermal pad (not electrically connected).

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enable; must fall before any command; places device in active power mode when low
SCK Serial Clock Drives timing for all SPI operations; latches input on rising edge, outputs data on falling edge
SI/IO0 Serial Input / I/O0 Primary data input in standard mode; bidirectional I/O in dual/quad modes; used for commands, addresses, and program data
SO/IO1 Serial Output / I/O1 Primary data output in standard mode; bidirectional I/O in dual/quad modes; enables parallel data transfer in QIOR/QPP
HOLD#/IO3 Hold / I/O3 Pauses ongoing SPI transaction without deselecting chip; functions as I/O3 in quad modes
W#/ACC/IO2 Write Protect / Acceleration / I/O2 Enables hardware write protection (low = protect); accepts 9 V for accelerated programming; serves as I/O2 in quad modes
VCC Supply Voltage 2.7–3.6 V main power; powers internal charge pumps for erase/program operations
GND Ground Reference for all I/O and internal logic; must be low-impedance connection to minimize noise during high-speed reads

Key Features

Feature Design Value
Dual/Quad I/O High-Performance Read Enables 2× or 4× data bandwidth over standard SPI-reduces boot time for MCUs loading 1+ MB firmware images
Uniform 4 KB Sub-Sector Erase Allows fine-grained firmware patching without disturbing adjacent code or configuration data in parameter blocks
W#/ACC Pin Accelerated Programming Reduces page program time to ≤1.5 ms (typical) using externally applied 9 V-critical for field OTA updates with tight time budgets
CFI Compliance Enables automatic flash detection and configuration in bootloader software-eliminates hard-coded timing or sector map assumptions
Secure OTP Memory Provides tamper-resistant storage for cryptographic keys or unique device IDs-supports secure boot chain integrity verification

Applications

Industrial PLC Firmware Storage FPGA Configuration Memory

Use Scenario: Storing bitstream and firmware for programmable logic controllers operating in harsh factory environments with wide temperature swings and EMI exposure.

IC Role / Device Role / Timing Role: Nonvolatile boot memory providing deterministic, fast-access configuration data to Xilinx/Intel FPGAs and ARM Cortex-M7-based control processors.

Use Value: 20-year data retention and 100K-cycle endurance ensure reliable operation across 15+ year product lifecycles without field replacement.

Use Scenario: Holding compressed partial reconfiguration bitstreams for adaptive computing in edge AI accelerators deployed in telecom base stations.

IC Role / Device Role / Timing Role: Quad I/O FAST_READ delivers 40 MB/s read speed-enabling <500 ms FPGA reconfiguration latency under real-time constraints.

Use Value: Uniform 4 KB sub-sector erase allows selective bitstream updates without full device reprogramming, reducing downtime during field upgrades.

Medical Imaging Boot Loader Automotive ADAS Camera Module

Use Scenario: Hosting certified boot loader and safety-critical diagnostic firmware in FDA-regulated ultrasound and MRI subsystems requiring traceable firmware versions.

IC Role / Device Role / Timing Role: Secure OTP region stores immutable device serial number and calibration hash-verified at every power-on reset per IEC 62304 requirements.

Use Value: JEDEC-standard two-byte electronic signature and CFI compliance simplify automated BOM validation and regulatory audit documentation.

Use Scenario: Storing camera ISP firmware and lens calibration tables in compact rear-view and surround-view modules subject to AEC-Q100 Grade 2 temperature stress.

IC Role / Device Role / Timing Role: 2.7–3.6 V operation and -40°C to +105°C qualified BGA package meet automotive voltage rail and thermal envelope requirements.

Use Value: Deep Power-Down mode (3 µA) minimizes standby current during vehicle sleep cycles-extending battery life in always-on vision systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S25FL128SAGMFI000 Successor device: same density (128 Mbit), 1.8 V compatible, enhanced security (AES-128 encryption), no W#/ACC acceleration pin Required for new designs per Cypress migration path; supports lower-voltage SoCs and encrypted firmware delivery Select when designing new products requiring long-term availability, crypto-enabled firmware protection, or 1.8 V interface compatibility
MX25L12835FZNI-10G 128 Mbit, 3 V only, no quad I/O read modes, no OTP, 50K endurance, SO8 package only Limited to cost-sensitive consumer applications where high-speed read or secure ID are not required Choose only for legacy board refreshes where pinout and footprint match existing SO8 layouts and performance demands are minimal

Compared with S25FL129P0XBHV310, the S25FL128S offers modern security and voltage flexibility but sacrifices W#/ACC acceleration and legacy OTP structure; MX25L12835F provides basic functionality at lower cost but lacks quad I/O, sub-sector erase, and industrial-grade endurance.

Availability

S25FL129P0XBHV310 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, FPGA configuration memory, medical imaging boot loaders, and automotive ADAS camera modules requiring stable component supply and long-term lifecycle support.

Supply support for S25FL129P0XBHV310 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies since 2020) is a leader in high-performance embedded memory and programmable solutions, founded in 1982 and headquartered in San Jose, CA.

The S25FL129P belongs to Cypress's Spansion-branded serial NOR Flash family, engineered for deterministic boot reliability, field-upgradable firmware, and robust operation in automotive, industrial, and medical systems demanding >10-year data integrity.

FAQ

Is S25FL129P0XBHV310 still recommended for new designs?

No. Cypress explicitly states this part is "not recommended for new and current designs." The factory-recommended migration path is S25FL128S, which adds 1.8 V support, AES-128 encryption, and updated security features while maintaining 128 Mbit density and BGA packaging compatibility.

What does the '0XBHV310' suffix indicate in the full part number?

The suffix encodes package and temperature grade: '0X' = standard commercial temp range (0°C to +70°C), 'B' = 24-ball BGA (6 × 8 mm), 'H' = lead-free/RoHS-compliant, 'V' = tape-and-reel packaging, '310' = revision level per Cypress's internal manufacturing coding system.

Can the W#/ACC pin be left unconnected if accelerated programming is not used?

No. The W#/ACC pin must be pulled to VCC through a 10 kΩ resistor or driven actively. Leaving it floating risks unintended write protection activation or erratic behavior during power-up; it is not a no-connect pin despite its dual function.

Does S25FL129P0XBHV310 support XIP (eXecute-In-Place) operation?

Yes-when used with host controllers supporting continuous read mode (e.g., via QIOR command), the device allows direct code execution from flash without copying to RAM, reducing system memory footprint and boot latency in resource-constrained microcontrollers.

S25FL129P0XBHV310 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-P
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
104 MHz
Write Cycle Time - Word, Page:
5µs, 3ms
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (6x8)

S25FL129P0XBHV310 FAQ

1.How can I place an order for S25FL129P0XBHV310 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL129P0XBHV310 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL129P0XBHV310 reliable?

The price and inventory of S25FL129P0XBHV310 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL129P0XBHV310 is usually 5 days.

3.What payment methods are accepted for S25FL129P0XBHV310?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL129P0XBHV310 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL129P0XBHV310?

S25FL129P0XBHV310 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL129P0XBHV310 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL129P0XBHV310?

For technical support, including S25FL129P0XBHV310 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL129P0XBHV310 requirements.

6.How does Aetrix verify that S25FL129P0XBHV310 is sourced from the original manufacturer or authorized distributors?

All S25FL129P0XBHV310 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL129P0XBHV310 meets industry standards.

7.What is the process for return or replacement of S25FL129P0XBHV310?

All S25FL129P0XBHV310 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL129P0XBHV310, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL129P0XBHV310 part is unused and in its original packaging.

Return procedure for S25FL129P0XBHV310:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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