My Inquiry
My Account
Infineon Technologies S25FL256LAGBHI030
- Part No.:
- S25FL256LAGBHI030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL256LAGBHI030.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,932
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL256LAGBHI030 from Infineon is a 256-Mbit serial NOR flash memory with Quad SPI interface, 133 MHz clock frequency, and 3.0 V supply voltage. It supports XIP (execute-in-place), dual/quad I/O protocols, and offers 100K program/erase cycles with 20-year data retention. Used in industrial PLC firmware storage and boot code execution for ARM Cortex-M7 microcontrollers.
For engineers reviewing the S25FL256LAGBHI030 datasheet, S25FL256LAGBHI030 pinout, S25FL256LAGBHI030 application, or S25FL256LAGBHI030 equivalent, key selection criteria include Quad SPI timing compliance, sector protection granularity, erase suspend/resume capability, and JEDEC JESD216 Rev C SFDP support for automatic configuration.
Technical Context
This device implements a standard Serial Peripheral Interface (SPI) with extended quad I/O mode compliant with JEDEC JESD216. It uses a 64-Mbit × 4 architecture organized into 512 uniform 64-KB sectors and supports both volatile and non-volatile status register configuration.
Command set includes fast read (0x0B), quad input/output fast read (0x6B/0xEB), program resume/suspend (0xD0/0xB0), and deep power-down (0xB9). Erase operations are supported at sector (64 KB), block (256 KB), and chip level with typical times of 0.5 s, 1.5 s, and 200 s respectively.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB), enabling full firmware image storage for mid-tier MCUs |
| Interface | Quad SPI with single/dual/quad I/O modes, reducing pin count vs parallel NOR |
| Max Clock Frequency | 133 MHz, supporting 532 MB/s effective throughput in quad mode |
| Supply Voltage | 2.7–3.6 V, compatible with 3.3 V industrial logic rails |
| Program/Erase Cycles | 100,000 cycles per sector, sufficient for field firmware updates over product lifetime |
| Data Retention | 20 years at 85°C, validated for extended operation in harsh environments |
| Erase Granularity | 64 KB uniform sectors with individual lock/unlock control via status registers |
Pinout & Package
Package: 8-pin SOIC (208 mil, 5.2 mm × 5.2 mm, 1.27 mm pitch).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SO | Serial Output | Master-in/slave-out data line for SPI read operations |
| SI | Serial Input | Master-out/slave-in data line for SPI write and command transmission |
| WP# | Write Protect | Hardware-enabled sector protection; low-active signal disables programming/erasing |
| HOLD# | Hold Control | Pauses ongoing SPI transfer without deselecting device, preserving bus state |
| CS# | Chip Select | Active-low enable for SPI communication; required to initiate any command sequence |
| SCLK | Serial Clock | Input clock synchronized to master; controls timing of all I/O transfers |
| VCC | Power Supply | Primary 3.3 V supply with bypass capacitor requirement (0.1 µF typical) |
| GND | Ground | Reference return path for all digital and internal charge-pump circuits |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI with 4-4-4 command protocol | Enables 4-bit-wide data transfers on each clock edge, doubling bandwidth vs dual I/O |
| Erase suspend/resume | Allows background interrupt handling during long erase operations without data loss |
| JESD216 Rev C SFDP support | Permits automatic configuration of read commands and timing parameters by host bootloader |
| Individual sector protection | Locks specific 64-KB sectors against accidental overwrite while leaving others writable |
| Deep power-down mode | Reduces standby current to 2 µA, critical for battery-backed industrial controllers |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing and executing real-time control firmware in programmable logic controllers operating at 85°C ambient. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped directly to MCU address space via XIP, eliminating external RAM copy overhead. Use Value: 20-year data retention ensures firmware integrity across 15+ year product lifecycles without refresh. | Use Scenario: Holding safety-critical boot code for vision processing SoCs in lane-departure warning systems. IC Role / Device Role / Timing Role: Primary boot device accessed during cold start; supports secure hash verification before execution. Use Value: Sector protection prevents unauthorized modification of boot loader region during OTA updates. |
| Medical Imaging System Configuration | Smart Grid Communication Module |
Use Scenario: Storing calibration tables and FPGA bitstreams in portable ultrasound devices requiring FDA-compliant traceability. IC Role / Device Role / Timing Role: Configuration store accessed during power-on initialization; supports rapid reconfiguration between imaging modes. Use Value: 100K endurance allows daily recalibration logging without wear-out risk over 10-year service life. | Use Scenario: Hosting protocol stack firmware and encryption keys in IEEE 1901.2 PLC modems deployed in utility substations. IC Role / Device Role / Timing Role: Secure non-volatile storage with hardware write protection for cryptographic keys and firmware signatures. Use Value: Deep power-down mode extends battery backup runtime to >72 hours during grid outages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256SAGMFI000 | Same density and package but with 1.8 V core supply and dual-power rail (1.8/3.3 V I/O) | Required for mixed-voltage SoC designs with 1.8 V core and 3.3 V peripherals | Select when interfacing with low-power application processors needing reduced active current |
| MX25L25645GMI-13G | 256 Mbit, 133 MHz max, but lacks erase suspend/resume and SFDP v1.7 support | Suitable for cost-sensitive consumer applications where firmware update reliability is secondary | Choose only if deep power-down and sector-level suspend are not required in the BOM |
Compared with S25FL256SAGMFI000, the S25FL256LAGBHI030 avoids dual-rail complexity and simplifies power design; versus MX25L25645GMI-13G, it delivers higher field-update robustness through suspend/resume and standardized configuration.
Availability
S25FL256LAGBHI030 is available at Aetrix Electronics and suitable for industrial automation, automotive ADAS, and medical imaging systems requiring stable component supply and long-term lifecycle assurance.
Supply support for S25FL256LAGBHI030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The S25FL family targets high-reliability embedded systems requiring deterministic boot performance, secure firmware storage, and extended temperature operation up to 105°C.
FAQ
Is S25FL256LAGBHI030 compatible with legacy SPI controllers?
Yes - it supports standard SPI modes 0 and 3 at up to 80 MHz in single I/O mode. Command opcodes for read, write, and erase are fully backward-compatible with earlier Spansion/Infineon serial flash devices, allowing drop-in replacement in existing designs using basic SPI peripherals.
Does this part support execute-in-place (XIP) operation?
Yes - the device supports true XIP from reset, with configurable latency and dummy cycle settings. The 133 MHz Quad SPI interface enables zero-wait-state execution for ARM Cortex-M and RISC-V cores when mapped to linear memory space via appropriate MMU or cache configuration.
What is the minimum erase block size supported?
The smallest erasable unit is a 64 KB sector. There is no sub-sector (4 KB) erase capability. Each of the 512 uniform sectors can be individually locked/unlocked via the volatile and non-volatile status registers, enabling fine-grained firmware partitioning.
How is hardware write protection implemented?
Hardware write protection is controlled by the WP# pin and status register bits SRWD, TB, and BP[2:0]. When WP# is asserted low, all program and erase commands are blocked unless corresponding sector lock bits are cleared. This provides dual-layer protection against accidental writes during power transitions or software faults.
S25FL256LAGBHI030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL256LAGBHI030 FAQ
1.How can I place an order for S25FL256LAGBHI030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256LAGBHI030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256LAGBHI030 reliable?
The price and inventory of S25FL256LAGBHI030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LAGBHI030 is usually 5 days.
3.What payment methods are accepted for S25FL256LAGBHI030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256LAGBHI030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL256LAGBHI030?
S25FL256LAGBHI030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL256LAGBHI030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256LAGBHI030?
For technical support, including S25FL256LAGBHI030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LAGBHI030 requirements.
6.How does Aetrix verify that S25FL256LAGBHI030 is sourced from the original manufacturer or authorized distributors?
All S25FL256LAGBHI030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LAGBHI030 meets industry standards.
7.What is the process for return or replacement of S25FL256LAGBHI030?
All S25FL256LAGBHI030 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LAGBHI030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256LAGBHI030 part is unused and in its original packaging.
Return procedure for S25FL256LAGBHI030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL256LAGBHI030 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
