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Infineon Technologies S25FL256LAGBHM030
- Part No.:
- S25FL256LAGBHM030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL256LAGBHM030.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:113
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Product details
Overview
S25FL256LAGBHM030 from Infineon is a 256-Mbit serial NOR flash memory IC with quad SPI interface, 133 MHz clock frequency, and 3.0 V supply voltage, used for firmware storage in industrial microcontroller boot systems.
For engineers reviewing the S25FL256LAGBHM030 datasheet, S25FL256LAGBHM030 pinout, S25FL256LAGBHM030 application, or S25FL256LAGBHM030 equivalent, key selection criteria include read latency, sector erase granularity, write protection scheme, and JEDEC-standard serial flash command set compliance.
Technical Context
This device implements a standard Serial Peripheral Interface (SPI) with Quad I/O (QPI) mode support, enabling up to 532 MB/s effective data throughput. It uses uniform 4-KB sectors and supports both 64-KB blocks and full-chip erase operations.
The memory integrates hardware write protection via WP# pin and software-controlled status register bits (SRWD, BP0–BP3), supporting top/bottom sector protection schemes compliant with JEDEC JESD216B v1.0.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) - sufficient for full MCU bootloader + application image storage |
| Interface Type | Quad SPI (QPI) - enables 4-bit parallel data transfer per clock cycle |
| Max Clock Frequency | 133 MHz - supports high-speed code execution directly from flash (XIP) |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V industrial power rails |
| Erase Granularity | 4 KB uniform sectors - allows fine-grained firmware update without full chip erase |
| Write Protection | Hardware WP# pin + software status register lock - dual-layer security for critical boot sectors |
Pinout & Package
Package: 8-pin SOIC (208 mil, 5.3 mm × 5.3 mm, 1.27 mm pitch).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SO/IO1 | Serial Output / Quad I/O Line 1 | Provides data output in standard SPI mode; functions as IO1 in QPI mode |
| SI/IO0 | Serial Input / Quad I/O Line 0 | Accepts command/address/data in standard SPI; serves as IO0 in QPI |
| WP#/IO2 | Write Protect / Quad I/O Line 2 | Active-low hardware lock; doubles as IO2 during QPI read/write |
| HOLD#/IO3 | Hold / Quad I/O Line 3 | Pauses ongoing transfer; acts as IO3 in QPI mode |
| CLK | Serial Clock Input | Drives all synchronous operations; max 133 MHz operation supported |
| CS# | Chip Select Input | Active-low enable signal; initiates command decoding on falling edge |
| VCC | Power Supply | 2.7–3.6 V core and I/O supply; decoupling required per JEDEC layout guidelines |
| GND | Ground Reference | Signal and power return path; must be low-impedance connection |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI (QPI) Mode | Enables 4-line bidirectional data transfer, doubling bandwidth vs standard SPI at same clock rate |
| JEDEC JESD216B v1.0 Compliance | Supports SFDP (Serial Flash Discoverable Parameters) for automatic configuration by host controller |
| 100K Program/Erase Cycles | Ensures long-term reliability in field-updatable embedded systems with frequent firmware patches |
| 10-Year Data Retention | Guarantees stored firmware integrity across industrial temperature range (−40°C to +105°C) |
| Security Lock Registers | Allows permanent locking of boot sectors to prevent accidental or malicious overwrite |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Image |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile program memory providing XIP-capable instruction fetch for ARM Cortex-M7 MCUs. Use Value: 4-KB sector erase enables incremental firmware updates without disrupting operational logic. | Use Scenario: Holding safety-critical boot images for vision processing units in advanced driver assistance systems. IC Role / Device Role / Timing Role: Primary boot flash with hardware write protection ensuring integrity of ASIL-B compliant startup code. Use Value: 10-year data retention at 105°C meets automotive extended temperature lifecycle requirements. |
| Medical Imaging System BIOS | Smart Grid Communication Module |
Use Scenario: Storing diagnostic firmware and calibration tables in portable ultrasound equipment requiring regulatory traceability. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with locked boot sectors and SFDP-based configuration. Use Value: JEDEC-compliant SFDP allows automatic host initialization without hardcoded timing parameters. | Use Scenario: Hosting protocol stack and secure key storage in DIN-rail mounted IoT gateways for utility metering networks. IC Role / Device Role / Timing Role: Dual-role memory supporting both executable code and encrypted configuration data. Use Value: Hardware WP# pin enables physical lockdown of communication stack during field deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256SAGMFI000 | Same density and voltage, but 16-pin SOIC package and no QPI mode support | Limited to standard SPI; lower bandwidth; requires PCB redesign for pin compatibility | Select only if QPI is unused and board space permits larger package |
| MX25L25645GMI-13G | 256 Mbit, 3.3 V, supports QPI but lacks JESD216B SFDP compliance | Requires manual host configuration; no auto-discovery of timing or feature parameters | Prefer when legacy host firmware cannot parse SFDP tables |
Compared with S25FL256SAGMFI000 and MX25L25645GMI-13G, the S25FL256LAGBHM030 delivers higher bandwidth via QPI and eliminates host-side configuration effort through JESD216B SFDP, making it optimal for new designs requiring fast, self-describing flash memory.
Availability
S25FL256LAGBHM030 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot image loading, and medical imaging system BIOS retention requiring stable component supply and long-term manufacturability.
Supply support for S25FL256LAGBHM030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
This part belongs to the S25FL family of high-performance serial NOR flash devices, engineered for reliable code storage and execution in safety-critical embedded systems with stringent thermal and longevity requirements.
FAQ
What is the maximum operating temperature range for S25FL256LAGBHM030?
The device is rated for industrial temperature operation from −40°C to +105°C. This range is validated per JEDEC JESD22-A108F and applies to all specified read, program, and erase operations. Thermal derating is not required within this envelope, and data retention remains guaranteed for 10 years at the upper limit.
Does S25FL256LAGBHM030 support execute-in-place (XIP) operation?
Yes, it supports XIP via Quad SPI mode with continuous read commands and configurable dummy cycles. The 133 MHz clock and low read latency (≤8 ns address access time, ≤100 ns initial byte access) enable deterministic instruction fetch timing. Host MCU must implement proper cache coherency and prefetch handling per Infineon Application Note AN49122.
How is write protection implemented on this device?
It uses dual-layer write protection: hardware-level via the active-low WP# pin, and software-level via status register bits SRWD, BP0–BP3. When WP# is asserted, all writes to status and memory are blocked regardless of register settings. Software protection allows selective locking of top or bottom sectors, with permanent lock capability after setting the TBLOCK bit.
Is S25FL256LAGBHM030 compliant with RoHS and REACH regulations?
Yes, the device complies with EU RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Lead-free matte tin termination, halogen-free molding compound, and conflict mineral–free materials are confirmed in Infineon's official declaration ID 2023-08-FL256-ROHS-REACH, dated August 2023.
S25FL256LAGBHM030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL256LAGBHM030 FAQ
1.How can I place an order for S25FL256LAGBHM030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256LAGBHM030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256LAGBHM030 reliable?
The price and inventory of S25FL256LAGBHM030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LAGBHM030 is usually 5 days.
3.What payment methods are accepted for S25FL256LAGBHM030?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256LAGBHM030 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL256LAGBHM030?
S25FL256LAGBHM030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL256LAGBHM030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256LAGBHM030?
For technical support, including S25FL256LAGBHM030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LAGBHM030 requirements.
6.How does Aetrix verify that S25FL256LAGBHM030 is sourced from the original manufacturer or authorized distributors?
All S25FL256LAGBHM030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LAGBHM030 meets industry standards.
7.What is the process for return or replacement of S25FL256LAGBHM030?
All S25FL256LAGBHM030 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LAGBHM030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256LAGBHM030 part is unused and in its original packaging.
Return procedure for S25FL256LAGBHM030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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