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Infineon Technologies S25FL256LAGBHN023

Part No.:
S25FL256LAGBHN023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL256LAGBHN023.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,034

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Product details

Overview

S25FL256LAGBHN023 from Cypress Semiconductor is a 256 Mbit (32 Mbyte) serial NOR flash memory with SPI, Dual I/O, Quad I/O, QPI, and DDR read support. It operates from 2.7 V to 3.6 V, features uniform 4 KB/32 KB/64 KB erase blocks, 256-byte page programming, and supports XIP and code shadowing in industrial temperature range (–40°C to +85°C). Used in embedded boot storage for microcontrollers and FPGA configuration.

For engineers reviewing the S25FL256LAGBHN023 datasheet, S25FL256LAGBHN023 pinout, S25FL256LAGBHN023 application, or S25FL256LAGBHN023 equivalent, key selection criteria include quad-mode timing compliance, SFDP register support, security region protection granularity, and DDR read throughput at 66 MHz clock.

Technical Context

The device implements a 65 nm floating gate architecture with a 256-byte page programming buffer and supports suspend/resume for both program and erase operations. Its command set includes standard SPI, extended address modes (24-/32-bit), and JEDEC JESD216B-compliant SFDP for runtime configuration discovery.

It delivers up to 66 MB/s read bandwidth via DDR Quad I/O at 66 MHz, and supports four independent 256-byte security regions outside the main array with non-volatile pointer region locking, power supply lock-down, and password-based protection for Security Regions 2 and 3.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mbit (32 Mbyte) - sufficient for full MCU boot image + firmware + configuration data
Interface ModesSPI, Dual I/O, Quad I/O, QPI, DDR Quad I/O - enables scalable bandwidth from 6.25 MB/s to 66 MB/s
Erase GranularityUniform 4 KB sectors, 32 KB half-blocks, 64 KB blocks - supports fine-grained firmware updates without full chip erase
Endurance100,000 program-erase cycles - validated for field-upgradable systems requiring frequent reprogramming
Data Retention20 years typical - ensures long-term reliability in unpowered storage applications
Supply Voltage2.7 V to 3.6 V - compatible with 3.3 V logic domains and tolerant of rail droop in embedded power systems
Temperature Range–40°C to +85°C (Industrial) - qualified for deployment in automotive body control and industrial HMI systems

Pinout & Package

Package: 24-ball BGA (6 × 8 mm, FAB024 footprint, 5 × 5 ball array), Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for command latching; required assertion before all SPI/MIO transactions
SCKSerial Clock InputProvides timing reference for all data transfers; supports up to 133 MHz SDR or 66 MHz DDR
IO0 (SI)Serial Input / I/O0Single-bit input in SPI mode; least-significant data line in Dual/Quad modes
IO1 (SO)Serial Output / I/O1Single-bit output in SPI mode; second data line in Dual/Quad modes
IO2 (WP#)Write Protect / I/O2Hardware write protection when CR1V[1]=0; I/O2 in Quad mode per configuration register setting
IO3 (RESET#)I/O3 / Hardware ResetFunctions as IO3 in Quad/QPI modes; serves as active-low reset when enabled via CR2V[7]
VDDPower SupplyCore and I/O supply; decoupling required within 10 mm of package per layout guidelines
VSSGroundSignal and power return; must be connected to low-impedance ground plane

Key Features

FeatureDesign Value
Quad Peripheral Interface (QPI)Reduces instruction overhead by enabling 4-bit command/address/data transfers without mode switching
Serial Flash Discoverable Parameters (SFDP)Enables host auto-configuration of timing, density, and feature sets without hard-coded driver assumptions
Program/Erase Suspend & ResumeAllows interrupting background erase or program to service high-priority reads, critical for real-time systems
Four 256-byte Security RegionsIsolates sensitive keys or calibration data outside main array with independent lock-down and password protection
Deep Power Down ModeDraws only 2 µA - extends battery life in always-on IoT edge nodes during idle periods

Applications

MCU Boot StorageFPGA Configuration

Use Scenario: Stores boot loader and initial firmware for ARM Cortex-M or RISC-V microcontrollers in space-constrained industrial controllers.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and fast Quad Read access to minimize boot latency.

Use Value: Eliminates parallel NOR requirement; 66 MB/s Quad DDR read matches or exceeds legacy parallel interface performance with 6-pin interface.

Use Scenario: Holds bitstream for Xilinx Artix-7 or Intel Cyclone V FPGA during power-up configuration.

IC Role / Device Role / Timing Role: Serial configuration memory with deterministic timing and JEDEC SFDP support for automatic bitstream alignment.

Use Value: Supports 133 MHz Fast Read and 66 MHz DDR Quad Read to meet FPGA configuration time budgets under 100 ms.

Secure Firmware UpdateTelematics Data Logging

Use Scenario: Hosts dual-bank firmware images and cryptographic keys for over-the-air (OTA) update rollback and signature verification.

IC Role / Device Role / Timing Role: Secure storage partition with individual sector lock and non-volatile pointer region for atomic bank switching.

Use Value: Four dedicated 256-byte security regions prevent tampering with keys while enabling field-upgradeable trusted execution environments.

Use Scenario: Logs vehicle CAN bus diagnostics, GPS coordinates, and sensor events in automotive telematics gateways.

IC Role / Device Role / Timing Role: High-endurance data logger with 100K cycle rating and 4 KB sector erase for wear-leveling across event buffers.

Use Value: 80 KB/s typical sector erase rate enables sub-50 ms log rotation intervals, supporting continuous 10 Hz event capture.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S25FL256SAGMFI000Same density and pinout; uses older 90 nm MirrorBit® technology; lacks DDR read mode and SFDP v1.5 supportLower max read bandwidth (40 MB/s vs. 66 MB/s); no program suspend/resumeSelect only if legacy design compatibility or cost sensitivity outweighs performance and feature requirements
MX25L25645GMI-08G256 Mbit Macronix part in same 24-ball BGA; supports QPI and 133 MHz Fast Read but no DDR mode; different security register mappingNo DDR capability; security region implementation differs - requires driver portingChoose when cross-supplier qualification is mandated and DDR read is not required in target system

Compared with S25FL256SAGMFI000 and MX25L25645GMI-08G, the S25FL256LAGBHN023 provides superior bandwidth via DDR Quad I/O, standardized SFDP-driven configuration, and finer-grained security region control - making it optimal for new designs prioritizing real-time responsiveness and secure firmware agility.

Availability

S25FL256LAGBHN023 is available at Aetrix Electronics and suitable for MCU boot storage, FPGA configuration, secure firmware update, and telematics data logging requiring stable component supply and long-term industrial lifecycle support.

Supply support for S25FL256LAGBHN023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor, now part of Infineon Technologies, designs high-performance memory and programmable solutions for embedded, automotive, and industrial systems.

The FL-L family targets high-density, low-pin-count serial flash applications demanding fast read speeds, robust security, and seamless migration from prior Cypress SPI flash generations.

FAQ

What is the maximum clock frequency supported in DDR Quad I/O mode?

The S25FL256LAGBHN023 supports DDR Quad I/O operation at up to 66 MHz clock frequency, delivering 66 MB/s effective read bandwidth. This mode transfers address and data on both rising and falling edges of SCK, doubling throughput versus SDR at same clock rate. Timing compliance requires strict setup/hold margins per AC specification section 5.5 of the datasheet.

Does this device support hardware write protection independent of software commands?

Yes - the WP# pin (IO2) provides hardware write protection when CR1V[1] = 0 and SR1NV[7] = 1. In this configuration, driving WP# low disables all write, program, and erase commands regardless of status register settings. The internal pull-up allows safe default operation when the pin is left unconnected.

How many security regions does the S25FL256LAGBHN023 provide, and where are they located?

The device provides four dedicated 256-byte security regions located outside the main 32 Mbyte flash array, starting at address 0x00000000. Regions 2 and 3 support non-volatile locking via power supply lock-down, password, or permanent protection. The pointer region enables non-volatile definition of protected sector/block ranges for flexible firmware partitioning.

Can the S25FL256LAGBHN023 be used in place of the S25FL256SAGMFI000 without hardware changes?

Yes - it shares identical 24-ball BGA (FAB024) packaging, pinout, and voltage specifications. However, firmware must be updated to enable DDR mode, configure SFDP parameters, and leverage program/erase suspend functionality. Migration is supported per Cypress Application Note AN98592, but timing and security register behavior differ.

S25FL256LAGBHN023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-L
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL256LAGBHN023 FAQ

1.How can I place an order for S25FL256LAGBHN023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL256LAGBHN023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL256LAGBHN023 reliable?

The price and inventory of S25FL256LAGBHN023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LAGBHN023 is usually 5 days.

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S25FL256LAGBHN023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL256LAGBHN023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL256LAGBHN023?

For technical support, including S25FL256LAGBHN023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LAGBHN023 requirements.

6.How does Aetrix verify that S25FL256LAGBHN023 is sourced from the original manufacturer or authorized distributors?

All S25FL256LAGBHN023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LAGBHN023 meets industry standards.

7.What is the process for return or replacement of S25FL256LAGBHN023?

All S25FL256LAGBHN023 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LAGBHN023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL256LAGBHN023 part is unused and in its original packaging.

Return procedure for S25FL256LAGBHN023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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