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Infineon Technologies S25FL256LAGBHN030

Part No.:
S25FL256LAGBHN030
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL256LAGBHN030.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,723

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Product details

Overview

S25FL256LAGBHN030 from Cypress Semiconductor is a 256 Mbit (32 MB) serial NOR flash memory with SPI Multi-I/O interface, supporting SDR/DDR Quad I/O and QPI modes up to 133 MHz clock rate, 66 MB/s read bandwidth, 4 KB uniform sector erase, and industrial temperature range (–40°C to +85°C). It integrates 256-byte page programming buffer, program/erase suspend-resume, and four 256-byte security regions for firmware protection in embedded boot code storage.

For engineers reviewing the S25FL256LAGBHN030 datasheet, S25FL256LAGBHN030 pinout, S25FL256LAGBHN030 application, or S25FL256LAGBHN030 equivalent, key selection criteria include quad-mode timing compliance, SFDP v1.5 parameter discovery support, security region lock granularity, 2.7–3.6 V single-supply operation, and WSON-8 package compatibility with PCB layout constraints for space-constrained IoT edge nodes.

Technical Context

This device implements a floating-gate 65 nm process architecture with dual-bank read-while-write capability enabled via program/erase suspend-resume logic. Its command set fully supports JEDEC JESD216B SFDP v1.5 for automatic configuration register initialization and includes dedicated opcodes for individual block lock, pointer region management, and power supply lock-down of Security Regions 2 and 3.

The SPI-MIO interface dynamically reconfigures SI/SO/WP#/IO3 pins between standard SPI, Dual I/O, Quad I/O, and QPI protocols based on Configuration Register bits CR1V[1] and CR2V[3]. DDR read operations transfer address and data on both clock edges, achieving 66 MB/s at 66 MHz without increasing pin count or signal integrity burden.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mbit (32 Mbyte) - sufficient for full MCU boot image + OTA update partition in resource-constrained microcontrollers
Interface ModesSDR SPI, Dual I/O, Quad I/O, QPI, DDR Quad I/O - enables flexible host controller compatibility without hardware redesign
Max Read Bandwidth66 MB/s (Quad I/O @ 133 MHz SDR or DDR @ 66 MHz) - matches parallel NOR performance with 6-pin interface
Erase GranularityUniform 4 KB sectors, 32 KB half-blocks, 64 KB blocks - supports fine-grained firmware update without full chip erase
Endurance & Retention100,000 program-erase cycles / 20-year data retention - validated for industrial lifecycle requirements
Supply Voltage2.7 V to 3.6 V - compatible with 3.3 V system rails and tolerant of brown-out conditions down to 2.7 V
Operating Temp–40°C to +85°C (Industrial) - qualified for automotive body control and industrial HMI applications

Pinout & Package

Package: 8-pin WSON (6 mm × 8 mm, 0.5 mm pitch), Pb-free, moisture sensitivity level 3 (MSL3).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for command decoding; must be held low during entire command sequence including address/data transfer
SCKSerial Clock InputProvides timing reference for all SPI-MIO operations; supports modes 0 and 3; DDR uses both rising/falling edges
SI / IO0Serial Input / Quad I/O 0Input for SDR/Dual commands; bidirectional I/O0 in Quad/QPI modes; internal pull-up when unused
SO / IO1Serial Output / Quad I/O 1Output for SDR/Dual commands; bidirectional I/O1 in Quad/QPI modes; internal pull-up when unused
WP# / IO2Write Protect / Quad I/O 2Hardware write protect when CR1V[1]=0; becomes IO2 in Quad mode; internal pull-up allows NC if unused
IO3 / RESET#Quad I/O 3 / ResetIO3 in Quad/QPI modes; hardware reset input when CR2V[7]=1 and CS# high; internal pull-up supports NC usage
VDDPower SupplySingle 2.7–3.6 V supply; decoupling capacitor required within 5 mm of pin per layout guidelines
VSSGroundSignal ground reference; must be connected to PCB ground plane with low-inductance path

Key Features

FeatureDesign Value
Quad Peripheral Interface (QPI)Reduces instruction overhead by using 4-bit command/address/data transfers - cuts read latency by ~50% vs standard SPI
Serial Flash Discoverable Parameters (SFDP)JEDEC JESD216B-compliant parameter table enables automatic host driver configuration without hardcoded register settings
Security Region ProtectionFour independent 256-byte regions outside main array allow secure storage of keys, certificates, or bootloader configuration without risking main firmware corruption
Program/Erase Suspend-ResumeEnables background erase of one sector while programming another - critical for real-time firmware updates with zero downtime
Deep Power Down Mode2 µA standby current extends battery life in always-on sensor nodes; wake-up time < 35 µs ensures responsive recovery

Applications

Secure Boot StorageIoT Edge Node Firmware

Use Scenario: Storing immutable bootloader and root-of-trust keys in systems requiring secure firmware validation before execution.

IC Role / Device Role / Timing Role: Non-volatile code storage with hardware-enforced write protection of Security Regions 2 and 3 to prevent tampering during field updates.

Use Value: Prevents unauthorized firmware modification via power supply lock-down and password-protected region access - meets IEC 62443-3-3 SL2 requirements.

Use Scenario: Hosting OTA update images and runtime configuration data in battery-powered wireless sensors deployed in remote locations.

IC Role / Device Role / Timing Role: High-reliability data logging and firmware staging memory with 100K-cycle endurance and 20-year retention at 85°C ambient.

Use Value: Enables field-upgradable functionality without hardware replacement - reduces maintenance cost by >70% over sealed-unit designs.

Industrial HMI DisplayAutomotive Body Control Module

Use Scenario: Caching GUI assets, font tables, and localized language strings for touch-enabled human-machine interfaces in factory automation panels.

IC Role / Device Role / Timing Role: XIP-capable flash delivering burst-wrap reads at 66 MB/s to feed display controller FIFOs without DRAM buffering.

Use Value: Eliminates external SDRAM, reducing BOM cost by $0.35/unit and PCB area by 120 mm² in 4-layer designs.

Use Scenario: Storing calibration data, diagnostic logs, and adaptive control parameters in door module ECUs operating under under-hood thermal stress.

IC Role / Device Role / Timing Role: Industrial-grade non-volatile memory qualified to –40°C to +85°C with 4 KB sector erase for incremental log writes.

Use Value: Supports ASAM MCD-2 MC-compliant logging with guaranteed 10-year data integrity at 85°C - exceeds ISO 16750-4 requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S25FL256SAGMFI00Same density and pinout but FL-S family; lacks DDR Quad I/O and SFDP v1.5; max read 52 MB/s @ 104 MHzNo DDR support limits high-speed XIP in real-time displays; no SFDP requires manual register setupSelect only if legacy FL-S ecosystem compatibility is mandatory and DDR/XIP not required
MX25L25645GMI-10GMicron-compatible pinout; supports octal DTR mode (not supported here); 100K cycles, same 4 KB eraseOctal DTR enables >133 MB/s reads but requires host controller with octal interface - incompatible with standard SPI-MIO hostsChoose only when migrating to higher-bandwidth octal interface and redesigning host controller firmware

Compared with S25FL256SAGMFI00 and MX25L25645GMI-10G, the S25FL256LAGBHN030 uniquely balances DDR-enabled bandwidth, JEDEC SFDP auto-configuration, and industrial temperature reliability - making it optimal for new designs requiring future-proof, drop-in firmware storage without host-side protocol extensions.

Availability

S25FL256LAGBHN030 is available at Aetrix Electronics and suitable for secure boot storage, IoT edge node firmware, and industrial HMI display applications requiring stable component supply across multi-year production cycles.

Supply support for S25FL256LAGBHN030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor, now part of Infineon Technologies, designs high-performance memory and programmable solutions for embedded systems, automotive, and industrial markets.

The FL-L family targets space-constrained, power-sensitive applications needing fast, secure, and reliable serial flash - specifically optimized for code shadowing, XIP execution, and firmware update resilience in connected devices.

FAQ

Does S25FL256LAGBHN030 support execute-in-place (XIP) operation?

Yes, it supports continuous read mode for XIP execution. The device delivers burst-wrap reads at up to 66 MB/s in Quad I/O mode, enabling direct CPU instruction fetch without intermediate RAM buffering. XIP is validated across all supported temperature ranges and requires host controller configuration of the Continuous Read Enable bit (CR1V[6]) and proper cache coherency handling.

What is the function of the IO3/RESET# pin in Quad I/O mode?

In Quad I/O mode (CR1V[1] = 1), IO3/RESET# functions exclusively as IO3 - the fourth bidirectional data line. RESET# functionality is disabled unless CR2V[7] = 1 and CS# is high. This dual-role design preserves pin count while enabling hardware reset fallback without adding external components.

How does the security region protection differ from standard status register write protection?

Standard SRP bits protect the entire flash array via volatile/non-volatile locks. Security Regions provide four isolated 256-byte zones outside the main array, each independently configurable for power supply lock-down, password access, or permanent protection - enabling secure key storage without affecting firmware partitioning or update workflows.

Can S25FL256LAGBHN030 be used in place of older S25FL256S devices?

Yes, it is footprint- and command-compatible with S25FL256S devices, but adds DDR Quad I/O, enhanced SFDP, and improved security features. Host firmware must be updated to leverage new capabilities; legacy SDR/Dual/Quad operation remains unchanged. Migration requires verifying timing margins for 133 MHz operation and updating security region initialization routines.

S25FL256LAGBHN030 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-L
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (6x8)

S25FL256LAGBHN030 FAQ

1.How can I place an order for S25FL256LAGBHN030 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL256LAGBHN030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL256LAGBHN030 reliable?

The price and inventory of S25FL256LAGBHN030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LAGBHN030 is usually 5 days.

3.What payment methods are accepted for S25FL256LAGBHN030?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256LAGBHN030 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL256LAGBHN030?

S25FL256LAGBHN030 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL256LAGBHN030 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL256LAGBHN030?

For technical support, including S25FL256LAGBHN030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LAGBHN030 requirements.

6.How does Aetrix verify that S25FL256LAGBHN030 is sourced from the original manufacturer or authorized distributors?

All S25FL256LAGBHN030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LAGBHN030 meets industry standards.

7.What is the process for return or replacement of S25FL256LAGBHN030?

All S25FL256LAGBHN030 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LAGBHN030, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL256LAGBHN030 part is unused and in its original packaging.

Return procedure for S25FL256LAGBHN030:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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