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Infineon Technologies S25FL256LAGMFB001
- Part No.:
- S25FL256LAGMFB001
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL256LAGMFB001.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,828
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Product details
Overview
S25FL256LAGMFB001 from Infineon is a 256-Mbit serial NOR flash memory with Quad SPI interface, 133 MHz clock frequency, uniform 256-byte programmable sectors, and 100,000 program/erase cycles endurance. It operates across industrial temperature range (–40°C to +85°C) and supports XIP mode for direct code execution in embedded microcontroller boot applications.
For engineers reviewing the S25FL256LAGMFB001 datasheet, S25FL256LAGMFB001 pinout, S25FL256LAGMFB001 application, or S25FL256LAGMFB001 equivalent, key selection criteria include Quad SPI timing compliance, sector protection granularity, write suspend/resume capability, and VCC supply tolerance (2.7–3.6 V) in resource-constrained MCU systems.
Technical Context
This device implements a standard Serial Peripheral Interface (SPI) with extended Quad I/O (QPI) mode enabling four-bit data transfers per clock cycle. It integrates an internal address counter for sequential read operations and supports both volatile and non-volatile status register configuration.
Command set compatibility follows JEDEC JESD216B for SFDP (Serial Flash Discoverable Parameters), allowing automatic configuration by host boot ROM. Erase granularity includes 4-KB sectors, 32-KB blocks, and 64-KB blocks, with hardware write protection via WP# pin and software-controlled block locking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) - sufficient for full firmware image storage in Cortex-M7/M4-based edge controllers |
| Interface | Quad SPI (QPI) - enables 532 MB/s peak throughput at 133 MHz, reducing boot time vs. standard SPI |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic rails without level-shifting in industrial MCU designs |
| Program/Erase Endurance | 100,000 cycles - supports field firmware updates over 10+ years in remote sensor gateways |
| Operating Temperature | –40°C to +85°C - qualified for deployment in uncontrolled industrial cabinet environments |
| Package | 16-pin SOIC (300 mil) - surface-mount compatible with standard reflow profiles and automated assembly |
| Write Protection | Hardware (WP#) + software (status register bits) - prevents accidental overwrite during power brownout events |
Pinout & Package
Package: 16-pin Small Outline Integrated Circuit (SOIC), 300-mil body width, gull-wing leads, RoHS-compliant matte tin finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (VIO) | I/O Supply Voltage | Separate 1.65–3.6 V rail for I/O buffer voltage setting; decoupling required for signal integrity |
| Pin 2 (SIO0) | Serial Data I/O 0 | Bi-directional data line for standard SPI and QPI modes; functions as DO in single I/O reads |
| Pin 3 (SIO1) | Serial Data I/O 1 | Second bi-directional data line; active in dual/quad I/O modes for parallel data transfer |
| Pin 4 (SIO2) | Serial Data I/O 2 | Third bi-directional data line; used in quad mode for 4-bit wide data path |
| Pin 5 (SIO3) | Serial Data I/O 3 | Fourth bi-directional data line; enables full quad-speed operation with 4-bit parallel access |
| Pin 6 (GND) | Ground Reference | Primary return path for VCC and VIO; must be connected to system ground plane with low-inductance routing |
| Pin 7 (WP#) | Write Protect Input | Active-low hardware lock; asserts permanent write inhibition when pulled low during power-up |
| Pin 8 (HOLD#) | Hold Input | Pauses ongoing serial transfer without resetting internal state; used for bus arbitration in multi-master systems |
| Pin 9 (VCC) | Core Supply Voltage | 2.7–3.6 V main power; requires local 100 nF ceramic decoupling adjacent to pin |
| Pin 10 (NC) | No Connect | Internally unused; must remain floating or tied to GND per layout guidelines |
| Pin 11 (CLK) | Serial Clock Input | Master-generated clock up to 133 MHz; phase-locked to SIOx transitions for setup/hold timing |
| Pin 12 (CS#) | Chip Select Input | Active-low enable; initiates command sequence on falling edge and terminates on rising edge |
| Pin 13 (NC) | No Connect | Internally unused; must remain floating or tied to GND per layout guidelines |
| Pin 14 (NC) | No Connect | Internally unused; must remain floating or tied to GND per layout guidelines |
| Pin 15 (NC) | No Connect | Internally unused; must remain floating or tied to GND per layout guidelines |
| Pin 16 (NC) | No Connect | Internally unused; must remain floating or tied to GND per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI (QPI) Mode | Enables 4-bit parallel data transfer per clock cycle, doubling bandwidth over dual I/O and quadrupling over standard SPI |
| Uniform 256-Byte Programming | Allows fine-grained firmware patching without erasing entire sectors, minimizing update latency in OTA deployments |
| Write Suspend/Resume | Permits interrupting erase operations to service high-priority writes, critical for real-time logging in PLCs |
| Software Write Protection | Configurable via status register bits to lock specific memory regions, preventing corruption during partial reprogramming |
| Power-On Reset Detection | Ensures consistent initial state after cold start or brownout recovery, eliminating boot failures in harsh environments |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing ladder logic firmware and configuration data in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped to ARM Cortex-M7's external memory interface for cold-start execution. Use Value: 100,000 erase cycles support 5+ years of field firmware upgrades without replacement; 256-byte programming enables delta updates. | Use Scenario: Holding boot code and safety-critical calibration tables for radar processing units in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: Primary XIP-capable flash providing deterministic <100 µs instruction fetch latency to TI TDA4VM SoC. Use Value: Quad SPI interface delivers 532 MB/s throughput, meeting ISO 26262 ASIL-B boot timing requirements. |
| Medical Imaging Control Module | Smart Grid Communication Gateway |
Use Scenario: Hosting FPGA configuration bitstreams and real-time control firmware in ultrasound front-end modules. IC Role / Device Role / Timing Role: Configuration memory accessed via SPI during FPGA initialization; supports fast reconfiguration during diagnostic mode switches. Use Value: Hardware WP# pin prevents accidental overwrite during ESD events common in clinical environments. | Use Scenario: Storing protocol stack binaries (DLMS/COSEM, IEC 61850) and secure key partitions in utility substation gateways. IC Role / Device Role / Timing Role: Secure non-volatile storage with software-lockable sectors isolating cryptographic keys from application firmware. Use Value: Dual VCC/VIO supplies allow independent 3.3 V core and 1.8 V I/O interfacing with legacy metering ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL256SAGMFI001 | Same die, identical pinout and timing; differs only in marking and traceability documentation | No functional difference; accepted interchangeably in automotive AEC-Q100 Grade 2 designs | Select when requiring Cypress-branded traceability or legacy BOM alignment |
| Winbond W25Q256JWSIQ | 256 Mbit density, but uses standard SPI + DTR mode instead of QPI; max clock 133 MHz, no XIP support | Limited to non-XIP boot scenarios; lacks write suspend/resume and 256-byte uniform programming | Choose for cost-sensitive consumer applications where full QPI bandwidth and advanced features are unnecessary |
Compared with S25FL256LAGMFB001, the Cypress alternative offers identical functionality with branding and documentation variance, while the Winbond part trades QPI performance and advanced program/erase control for lower unit cost in non-critical applications.
Availability
S25FL256LAGMFB001 is available at Aetrix Electronics and suitable for industrial automation, automotive ADAS, and medical imaging systems requiring stable component supply and long-term lifecycle assurance.
Supply support for S25FL256LAGMFB001 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensing, and security solutions for industrial, automotive, and IoT markets.
The S25FL family targets high-reliability embedded systems needing deterministic boot performance, robust data retention, and seamless integration with ARM and RISC-V host processors.
FAQ
Does S25FL256LAGMFB001 support execute-in-place (XIP) mode?
Yes. The device supports true XIP operation via Quad SPI interface, allowing host processors to execute code directly from flash without copying to RAM. This reduces boot latency and SRAM usage in Cortex-M and RISC-V systems, and is enabled by hardware address translation and prefetch buffers inside the flash controller.
What is the minimum VCC voltage for reliable program operations?
The minimum VCC for guaranteed program and erase operations is 2.7 V. Below this threshold, the internal charge pump cannot generate sufficient voltage for Fowler-Nordheim tunneling, resulting in incomplete programming or erase failure. Operation at 2.7 V requires stable regulation and proper decoupling per the datasheet layout guidelines.
How does the HOLD# pin function during active read operations?
HOLD# pauses serial communication without resetting internal state or losing address context. When asserted low during a read, data output halts immediately, and the device retains the current address pointer. Upon deassertion, transmission resumes from the exact byte position, enabling bus sharing in multi-peripheral SPI systems without command reissuance.
Is S25FL256LAGMFB001 compliant with AEC-Q100 for automotive use?
No. This variant is qualified for industrial temperature range (–40°C to +85°C) and is not AEC-Q100 certified. For automotive applications, Infineon offers the S25FL256LxxxFxx01 series with Grade 2 (–40°C to +105°C) qualification and additional reliability testing per AEC-Q100 Rev G.
S25FL256LAGMFB001 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL256LAGMFB001 FAQ
1.How can I place an order for S25FL256LAGMFB001 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256LAGMFB001 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256LAGMFB001 reliable?
The price and inventory of S25FL256LAGMFB001 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LAGMFB001 is usually 5 days.
3.What payment methods are accepted for S25FL256LAGMFB001?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256LAGMFB001 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL256LAGMFB001?
S25FL256LAGMFB001 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL256LAGMFB001 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256LAGMFB001?
For technical support, including S25FL256LAGMFB001 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LAGMFB001 requirements.
6.How does Aetrix verify that S25FL256LAGMFB001 is sourced from the original manufacturer or authorized distributors?
All S25FL256LAGMFB001 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LAGMFB001 meets industry standards.
7.What is the process for return or replacement of S25FL256LAGMFB001?
All S25FL256LAGMFB001 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LAGMFB001, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256LAGMFB001 part is unused and in its original packaging.
Return procedure for S25FL256LAGMFB001:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL256LAGMFB001 Tags
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