My Inquiry
My Account
Infineon Technologies S25FL256LAGMFB003
- Part No.:
- S25FL256LAGMFB003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL256LAGMFB003.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,933
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL256LAGMFB003 from Infineon is a 256-Mbit serial NOR flash memory with quad SPI interface, 3.0 V supply voltage, 133 MHz read clock frequency, and uniform 256-byte programmable pages. It serves as non-volatile code storage in microcontroller boot systems for industrial PLCs.
For engineers reviewing the S25FL256LAGMFB003 datasheet, S25FL256LAGMFB003 pinout, S25FL256LAGMFB003 application, or S25FL256LAGMFB003 equivalent, key selection criteria include read latency, sector erase granularity, write endurance, and WSON-8 package compatibility with PCB layout constraints.
Technical Context
This device implements a standard Serial Peripheral Interface (SPI) with Quad I/O (QPI) mode support, enabling up to 532 MB/s effective throughput. It uses stacked-die architecture to achieve 256 Mbit density in a single WSON-8 package while maintaining JEDEC JESD216-compliant SFDP register mapping.
It supports 4-KB and 64-KB erase blocks, configurable reset recovery time (tRST), and hardware write protection via WP# pin. The device includes volatile status register bits for program/erase suspend and busy detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) - supports full firmware image storage for mid-tier MCUs |
| Interface | Quad SPI (QPI) - enables 4-bit data transfer per clock cycle for high-speed boot loading |
| Read Clock Frequency | 133 MHz - achieves 532 MB/s peak read bandwidth in QPI mode |
| Supply Voltage | 2.7–3.6 V - compatible with 3.3 V industrial power rails and brown-out tolerant |
| Page Program Time | Typ. 800 µs - determines minimum write latency for firmware patching operations |
| Erase Block Size | 4 KB and 64 KB - allows fine-grained updates and bulk reprogramming flexibility |
| Endurance | 100,000 program/erase cycles - ensures field reliability over 10+ years of OTA update cycles |
| Data Retention | 20 years at 85°C - meets extended lifecycle requirements for industrial control hardware |
Pinout & Package
Package: 8-pin WSON (5 mm × 6 mm, 0.65 mm pitch), moisture sensitivity level 3, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| NC | No-connect | Unused internal bond pad; must be left floating or tied to GND per layout guidelines |
| IO0–IO3 | Quad I/O bidirectional data lines | Support standard SPI, dual I/O, and quad I/O modes; require controlled impedance routing |
| CLK | Serial clock input | Edge-triggered timing reference; max 133 MHz; requires clean clock source with <100 ps jitter |
| CS# | Chip select input | Active-low enable; controls device entry into command decode state; must be stable before CLK edge |
| WP# | Write protect input | Hardware lock for status register and sector protection; active-low, pulled high internally |
| HOLD# | Hold input | Pauses ongoing serial transfer without resetting internal address counter; used in multi-master arbitration |
| VCC | Power supply | 3.3 V nominal; requires local 100 nF + 4.7 µF decoupling within 5 mm of pin |
| GND | Ground reference | Signal and power return path; must connect to solid ground plane with multiple vias |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI (QPI) Mode | Enables 4-bit parallel data transfer per clock cycle, doubling throughput vs. standard SPI |
| Uniform 256-Byte Programming Pages | Allows precise firmware patching without erasing entire sectors, reducing update overhead |
| Configurable Reset Recovery Time (tRST) | Supports fast or slow reset timing based on host MCU boot sequence requirements |
| Hardware Write Protection (WP#) | Prevents accidental writes during power-up/down transients or ESD events |
| JEDEC JESD216 SFDP Support | Enables automatic configuration by host bootloader without hard-coded parameter tables |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot code and configuration parameters for programmable logic controllers operating in factory-floor environments with wide temperature swings. IC Role / Device Role / Timing Role: Non-volatile code execution memory mapped to MCU's XIP (execute-in-place) address space during cold start. Use Value: 20-year data retention at 85°C ensures firmware integrity across extended maintenance cycles without refresh. | Use Scenario: Holding safety-critical boot firmware for radar processing units in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: Primary boot device providing deterministic read latency (<10 µs) for real-time initialization sequences. Use Value: 133 MHz QPI read speed enables sub-100 ms boot time compliance with ISO 26262 ASIL-B timing budgets. |
| Medical Imaging System BIOS | Smart Grid Communication Module |
Use Scenario: Storing diagnostic firmware and calibration tables in portable ultrasound devices requiring FDA-grade reliability. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for signed firmware images verified at power-on reset. Use Value: Hardware write protection (WP#) prevents unauthorized modification during field servicing or battery replacement. | Use Scenario: Hosting protocol stack firmware for IEEE 1901.2 PLC modems deployed in outdoor substations. IC Role / Device Role / Timing Role: Field-upgradable non-volatile memory supporting remote firmware updates over narrowband powerline channels. Use Value: 100,000 P/E cycles accommodate >500 field updates over 15-year deployment life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256SAGMFI000 | Same density and package but rated for industrial temperature range (−40°C to +105°C) vs. −40°C to +85°C | Required for extended-temperature deployments such as outdoor base stations or engine-bay ECUs | Select when ambient operating temperature exceeds 85°C |
| MX25L25645GMI-13G | 256 Mbit density, same WSON-8 package, but supports only dual I/O (not QPI); 104 MHz max clock | Limited to lower-bandwidth boot paths where QPI throughput is not required | Choose for cost-sensitive designs where 532 MB/s read bandwidth is unnecessary |
Compared with S25FL256SAGMFI000, this part trades extended temperature rating for lower cost and tighter supply chain availability; compared with MX25L25645GMI-13G, it delivers higher read throughput and QPI flexibility at marginally higher unit price.
Availability
S25FL256LAGMFB003 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, and medical imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for S25FL256LAGMFB003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
S25FL256LAGMFB003 belongs to the Semper™ family of high-reliability serial NOR flash memories, designed specifically for mission-critical boot and code storage in safety- and uptime-sensitive systems.
FAQ
Is S25FL256LAGMFB003 compatible with legacy SPI controllers?
Yes. It supports standard SPI mode (single I/O) at up to 80 MHz, in addition to dual and quad I/O modes. Command sets are backward-compatible with JEDEC-standard serial flash, allowing integration with existing SPI host drivers without firmware changes.
What is the minimum erase block size supported?
The device supports uniform 4 KB erase blocks, enabling targeted firmware updates without disturbing adjacent code or configuration data. This granularity reduces update time and wear leveling overhead compared to 64 KB-only architectures.
Does it support execute-in-place (XIP) operation?
Yes. With its low read latency (<10 µs) and QPI mode, the device supports true XIP execution directly from flash memory by compatible MCUs such as Infineon's XMC4000 or Cypress PSoC 6 families, eliminating need for RAM-based code copying.
How is hardware write protection implemented?
Hardware write protection is controlled by the WP# pin: when asserted low, it locks the status register and all protected sectors. Protection can be configured per 4 KB or 64 KB block using volatile or non-volatile status bits, and remains active during power cycling.
S25FL256LAGMFB003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL256LAGMFB003 FAQ
1.How can I place an order for S25FL256LAGMFB003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256LAGMFB003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256LAGMFB003 reliable?
The price and inventory of S25FL256LAGMFB003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LAGMFB003 is usually 5 days.
3.What payment methods are accepted for S25FL256LAGMFB003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256LAGMFB003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL256LAGMFB003?
S25FL256LAGMFB003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL256LAGMFB003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256LAGMFB003?
For technical support, including S25FL256LAGMFB003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LAGMFB003 requirements.
6.How does Aetrix verify that S25FL256LAGMFB003 is sourced from the original manufacturer or authorized distributors?
All S25FL256LAGMFB003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LAGMFB003 meets industry standards.
7.What is the process for return or replacement of S25FL256LAGMFB003?
All S25FL256LAGMFB003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LAGMFB003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256LAGMFB003 part is unused and in its original packaging.
Return procedure for S25FL256LAGMFB003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL256LAGMFB003 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
