Infineon Technologies S25FL256LAGMFI003
- Part No.:
- S25FL256LAGMFI003
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL256LAGMFI003.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,882
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL256LAGMFI003 from Infineon is a 256-Mbit (32-MB) serial NOR flash memory with Quad SPI interface, 133 MHz clock frequency, and 1.8 V core supply voltage. It supports XIP (execute-in-place), dual/quad I/O modes, and sector erase granularity down to 4 KB. Used in industrial PLC firmware storage and embedded boot code retention.
For engineers reviewing the S25FL256LAGMFI003 datasheet, S25FL256LAGMFI003 pinout, S25FL256LAGMFI003 application, or S25FL256LAGMFI003 equivalent, key selection criteria include quad-SPI timing compliance, 4-KB sector erase capability, 1.8 V VCC tolerance, and industrial temperature range (-40°C to +85°C) support.
Technical Context
This device implements a standard Serial Peripheral Interface (SPI) with extended quad-I/O command set compliant with JEDEC JESD216B. It uses stacked-die architecture for density scaling while maintaining single-die package footprint and pin compatibility with prior S25FL-L family members.
Internal architecture includes a 256-Mbit array organized as 512 uniform 64-KB sectors, with additional 4-KB parameter sectors for configuration and boot code. Erase suspend/resume and program suspend/resume functions are hardware-supported.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) - sufficient for full bootloader + FPGA bitstream + OS kernel image in compact embedded systems |
| Interface | Quad SPI - enables 532 MB/s effective throughput using 133 MHz clock and 4-bit data bus |
| VCC Supply | 1.7–2.0 V - matches low-voltage SoC I/O domains and reduces power during read operations |
| Operating Temp | -40°C to +85°C - qualified for industrial control and outdoor edge gateway deployments |
| Erase Granularity | 4 KB sectors - allows fine-grained firmware updates without disturbing adjacent configuration data |
| Write Cycle Endurance | 100,000 cycles per sector - supports field-upgradable firmware with frequent patching |
| Data Retention | 20 years at 85°C - ensures long-term reliability in unattended infrastructure equipment |
Pinout & Package
Supplied in 16-pin SOIC (300 mil) package with standard SPI pinout and dedicated HOLD# and WP# control terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SO, SI, WP#, HOLD#, SCLK, CS# | Standard SPI signals | Direct connection to MCU SPI peripheral without level-shifting or glue logic |
| VCC, VSS | Power and ground | Single 1.8 V supply simplifies PMIC design and eliminates need for dual-rail regulators |
| NC | No connect | Unused pins left unconnected per Infineon design - no internal bonding or pull-up/down |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI with wrap-around burst mode | Enables continuous 4-byte address wrap for efficient sequential instruction fetch in XIP applications |
| Dual/quad I/O command set (JESD216B) | Guarantees interoperability with ARM Cortex-M and RISC-V boot ROMs requiring standardized SFDP tables |
| Hardware write protection (WP#) | Prevents accidental firmware corruption during power transitions or ESD events on system reset lines |
| Program/Erase suspend-resume | Allows real-time interrupt handling during background flash operations without data loss or timeout failure |
Applications
| Industrial PLC Firmware Storage | Edge Gateway Boot Code Retention |
|---|---|
Use Scenario: Storing ladder logic runtime, configuration parameters, and firmware updates in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile code and data storage with deterministic read latency under RTOS scheduling constraints. Use Value: 4-KB sector erase enables over-the-air partial updates without halting machine control cycles. | Use Scenario: Holding secure boot loader, TLS certificate store, and lightweight Linux initramfs in cellular-connected edge gateways. IC Role / Device Role / Timing Role: Primary boot memory mapped directly into ARM Cortex-A7/A53 address space via QSPI controller. Use Value: 133 MHz quad-SPI bandwidth meets boot time targets (<500 ms) for carrier-grade failover requirements. |
| Medical Diagnostic Imaging UI | Rail Signaling Equipment |
Use Scenario: Caching GUI assets, calibration profiles, and DICOM metadata templates in portable ultrasound and MRI console interfaces. IC Role / Device Role / Timing Role: Read-optimized storage for high-resolution bitmap assets accessed via DMA-driven SPI controller. Use Value: 20-year data retention ensures consistent UI rendering across 10+ year device service life without recalibration. | Use Scenario: Storing interlocking logic tables and safety-critical firmware in EN 5012x-certified trackside signaling controllers. IC Role / Device Role / Timing Role: Fail-safe nonvolatile memory with hardware write protection enabled during train detection state changes. Use Value: Industrial temperature rating and 100K-cycle endurance support quarterly firmware validation cycles mandated by rail safety standards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256SAGMFI000 | Same density and package, but 3.0 V VCC supply and 104 MHz max clock | Requires separate 3.0 V rail; not suitable for 1.8 V SoC designs | Select only when legacy 3.3 V system architecture mandates backward compatibility |
| MX25L25645GMI-13G | 256 Mbit, 1.8 V, but supports only dual I/O and lacks JESD216B SFDP table | Bootloader compatibility limited to basic SPI controllers without quad-mode auto-negotiation | Choose only if quad-SPI features are unused and cost sensitivity outweighs future upgrade flexibility |
Compared with S25FL256SAGMFI000 and MX25L25645GMI-13G, the S25FL256LAGMFI003 uniquely delivers quad-SPI performance at 1.8 V with full JESD216B compliance-enabling seamless integration into modern low-power, high-throughput boot architectures without voltage translation or firmware abstraction layers.
Availability
S25FL256LAGMFI003 is available at Aetrix Electronics and suitable for industrial automation, medical imaging UI, and rail signaling equipment requiring stable component supply across multi-year production cycles.
Supply support for S25FL256LAGMFI003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure connectivity solutions.
The S25FL-L family targets high-reliability embedded systems needing robust, low-voltage serial flash for boot code and firmware storage in harsh environments.
FAQ
Is S25FL256LAGMFI003 compatible with standard SPI controllers?
Yes-it operates in standard SPI mode (single I/O) at up to 80 MHz, fully supporting legacy controllers. Quad-SPI functionality requires explicit enablement via status register bit and is optional for basic read/write use cases.
Does this part support execute-in-place (XIP) operation?
Yes-hardware XIP is supported with deterministic read latency of ≤8 ns for sequential accesses. The device includes cache line wrap and prefetch buffer to sustain CPU instruction fetch without stalling.
What is the minimum erase block size?
The smallest erasable unit is a 4-KB sector. There are 128 such sectors in the top and bottom parameter blocks, enabling granular firmware patching without affecting main application code regions.
How is hardware write protection implemented?
Write protection is controlled by the WP# pin and two status register bits (SRWD and BP[3:0]). When WP# is asserted low, all non-volatile register writes and program/erase commands are blocked regardless of register settings.
S25FL256LAGMFI003 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL256LAGMFI003 FAQ
1.How can I place an order for S25FL256LAGMFI003 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256LAGMFI003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256LAGMFI003 reliable?
The price and inventory of S25FL256LAGMFI003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LAGMFI003 is usually 5 days.
3.What payment methods are accepted for S25FL256LAGMFI003?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256LAGMFI003 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL256LAGMFI003?
S25FL256LAGMFI003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL256LAGMFI003 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256LAGMFI003?
For technical support, including S25FL256LAGMFI003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LAGMFI003 requirements.
6.How does Aetrix verify that S25FL256LAGMFI003 is sourced from the original manufacturer or authorized distributors?
All S25FL256LAGMFI003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LAGMFI003 meets industry standards.
7.What is the process for return or replacement of S25FL256LAGMFI003?
All S25FL256LAGMFI003 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LAGMFI003, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256LAGMFI003 part is unused and in its original packaging.
Return procedure for S25FL256LAGMFI003:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL256LAGMFI003 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

