Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S25FL256LAGMFN000

Part No.:
S25FL256LAGMFN000
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixS25FL256LAGMFN000.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,187

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S25FL256LAGMFN000 from Cypress Semiconductor is a 256 Mbit (32 Mbyte) 3.0 V serial NOR flash memory with SPI Multi-I/O interface, supporting SDR/DDR Quad I/O and QPI modes up to 133 MHz clock rate, 66 MB/s read bandwidth, 4 KB uniform sector erase, and industrial temperature range (–40°C to +85°C), deployed in embedded boot code storage and firmware update applications.

For engineers reviewing the S25FL256LAGMFN000 datasheet, S25FL256LAGMFN000 pinout, S25FL256LAGMFN000 application, or S25FL256LAGMFN000 equivalent, key selection criteria include quad-mode command compatibility, SFDP support for auto-configuration, security region protection granularity, DDR timing compliance, and WSON-8 package footprint alignment with space-constrained PCB layouts.

Technical Context

The S25FL256LAGMFN000 implements a 65 nm floating gate architecture with a 256-byte page programming buffer and hierarchical erase hierarchy (4 KB sector / 32 KB half-block / 64 KB block / chip). It supports JEDEC JESD216B Serial Flash Discoverable Parameters for runtime configuration discovery and enables XIP (execute-in-place) via continuous read mode.

Its SPI-MIO interface dynamically reassigns IO0–IO3 pins based on configuration register settings: SI/SO/WP#/RESET# in standard SPI mode, and IO0–IO3 in Quad I/O or QPI mode. The device includes dual protection mechanisms-volatile individual sector lock and non-volatile pointer region-with power supply lock-down and password options for Security Regions 2 and 3.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density256 Mbit (32 Mbyte) - sufficient for full MCU boot image + application firmware + parameter storage in single-chip solution
Interface ModeQuad Peripheral Interface (QPI) and DDR Quad I/O - enables 66 MB/s sustained read throughput matching parallel NOR performance
Erase GranularityUniform 4 KB sectors - allows fine-grained firmware partitioning and OTA update without disturbing adjacent code sections
Data Retention20 years typical - meets long-life industrial equipment requirements without refresh cycles
Endurance100,000 program-erase cycles - supports frequent field firmware updates over product lifetime
Supply Voltage2.7 V to 3.6 V - compatible with standard 3.3 V logic rails and brown-out tolerant operation
Temperature Range–40°C to +85°C (Industrial) - validated for operation in uncontrolled ambient environments including factory automation

Pinout & Package

Package: 8-pin WSON (6 mm × 8 mm, 0.5 mm pitch), Pb-free, moisture sensitivity level 3 (MSL3).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for command latching; must be deasserted between commands to terminate transaction
SCKSerial Clock InputEdge-triggered clock for all SPI transfers; supports up to 133 MHz SDR or 66 MHz DDR operation
IO0 (SI)Serial Input / IO0Single-bit data input in SPI mode; bidirectional data line 0 in Dual/Quad modes; internal pull-up enabled by default
IO1 (SO)Serial Output / IO1Single-bit data output in SPI mode; bidirectional data line 1 in Dual/Quad modes; supports fast-read burst wrap
WP# / IO2Write Protect Input / IO2Hardware write protection when CR1V[1]=0; becomes IO2 in Quad mode; internal pull-up allows NC if unused
RESET# / IO3Reset Input / IO3Hardware reset assertion resets internal state; functions as IO3 in Quad/QPI modes; internal pull-up permits NC usage
VDDPower SupplyCore and I/O supply (2.7–3.6 V); decoupling capacitor required within 10 mm of pin per layout guidelines
VSSGroundDigital ground reference; must be connected to low-impedance system ground plane

Key Features

FeatureDesign Value
Quad Peripheral Interface (QPI)Reduces instruction overhead by encoding multi-byte commands into single-cycle opcodes, cutting command latency by ~40% vs standard SPI
Serial Flash Discoverable Parameters (SFDP)Enables host bootloader to auto-detect memory geometry, timing parameters, and feature set without hard-coded initialization sequences
Program/Erase Suspend & ResumeAllows background firmware update while maintaining real-time response to host interrupts-critical for safety-critical boot loaders
Four 256-byte Security RegionsIsolates cryptographic keys, calibration data, and device identity outside main array, preventing accidental overwrite during field updates
Deep Power Down ModeDraws only 2 µA - extends battery life in always-on IoT edge nodes during extended idle periods

Applications

Boot Code StorageFirmware Over-the-Air (OTA) Update

Use Scenario: Storing primary bootloader and initial firmware image for microcontrollers in industrial gateways.

IC Role / Device Role / Timing Role: Non-volatile boot source accessed at power-on reset; supports XIP execution to minimize RAM footprint.

Use Value: Eliminates external parallel NOR requirement, reducing BOM count and PCB area by 30% while maintaining <100 ms boot time.

Use Scenario: Securely receiving and validating new firmware images in connected medical devices.

IC Role / Device Role / Timing Role: Dual-bank update storage with atomic sector swap; leverages erase suspend to maintain responsiveness during download.

Use Value: Enables zero-downtime firmware upgrades with rollback capability, meeting IEC 62304 Class C software lifecycle requirements.

Configuration Parameter StorageSecure Key Vault

Use Scenario: Holding calibrated sensor offsets, network credentials, and user preferences in smart energy meters.

IC Role / Device Role / Timing Role: Low-frequency write storage with individual sector lock; accessed via fast read commands during initialization.

Use Value: Prevents corruption during brown-out events using volatile lock bits and supports 100K+ write cycles across 10-year field deployment.

Use Scenario: Isolating AES-256 keys and device certificates in automotive telematics control units.

IC Role / Device Role / Timing Role: Dedicated Security Region 2 with password-protected write access and permanent lock-down option.

Use Value: Meets ISO/SAE 21434 hardware security requirements by physically separating keys from application code space.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S25FL256SAGMFV000Same density and package, but FL-S family: 90 nm MirrorBit® process, no DDR support, lower max clock (104 MHz), no SFDP v1.6Lacks DDR read and SFDP auto-configuration; requires fixed timing initialization in bootloaderSelect only if legacy design reuse is required and DDR/XIP performance not needed
MX25L25645GMI-10GMacronix part: 256 Mbit, WSON8, 3.3 V, supports QPI and DTR but no DDR; 100K endurance, 20 yr retentionNo program/erase suspend/resume; fewer security regions (only 2 × 256B); no power supply lock-downChoose for cost-sensitive consumer applications where advanced security and interruptible updates are unnecessary

Compared with S25FL256SAGMFV000 and MX25L25645GMI-10G, the S25FL256LAGMFN000 delivers superior real-time update capability via suspend/resume, deterministic configuration via SFDP, and hardened security with four isolated regions and password enforcement-making it optimal for safety- and security-critical industrial deployments.

Availability

S25FL256LAGMFN000 is available at Aetrix Electronics and suitable for industrial gateways, medical diagnostics equipment, and automotive telematics modules requiring stable component supply, long-term lifecycle assurance, and qualified sourcing for production ramp.

Supply support for S25FL256LAGMFN000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability non-volatile memory and programmable system-on-chip solutions for industrial, automotive, and communications markets.

The FL-L family targets space-constrained embedded systems needing high-speed serial flash with robust security, XIP capability, and seamless migration from prior Cypress SPI families-optimized for boot code integrity and field-upgradable firmware architectures.

FAQ

What is the maximum clock frequency supported in DDR Quad I/O mode?

The S25FL256LAGMFN000 supports DDR Quad I/O operation at up to 66 MHz clock frequency, delivering 66 MB/s effective read bandwidth by transferring data on both rising and falling edges of the clock. This is confirmed in the Performance Summary table on page 2 of the official datasheet (Document Number 002-00124 Rev. *A), where DDR Quad Read is specified at 66 MHz with 66 MBps throughput.

Does this device support execute-in-place (XIP) operation?

Yes, the S25FL256LAGMFN000 supports XIP via Continuous Read mode, allowing the host processor to fetch instructions directly from flash without copying to RAM. This is explicitly enabled by the "Continuous (XIP)" read mode listed under Read Commands in the Features section (page 1), and further detailed in Section 3.3 (Interface States) and Section 9.4 (Read Memory Array Commands) of the datasheet.

How many security regions does the S25FL256LAGMFN000 provide, and what is their size?

The device provides four dedicated security regions, each 256 bytes in size, located outside the main flash array. These are documented in Sections 1.1 (General Description), 7.5 (Security Regions Address Space), and 8.1 (Security Regions) of the datasheet. Regions 2 and 3 support advanced protection including password, power supply lock-down, and permanent lock options.

Is the WSON-8 package of S25FL256LAGMFN000 pin-compatible with earlier Cypress S25FL series devices?

Yes, the WSON-8 package (WNH008) used by S25FL256LAGMFN000 maintains mechanical and signal pinout compatibility with prior Cypress FL-S, FL1-K, and FL-P family devices in the same footprint, as stated in Section 1.2.1 (Features Comparison) and Table 1.1 of the datasheet. This enables drop-in replacement in existing PCB layouts when migrating to FL-L performance and features.

S25FL256LAGMFN000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-L
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

S25FL256LAGMFN000 FAQ

1.How can I place an order for S25FL256LAGMFN000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL256LAGMFN000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL256LAGMFN000 reliable?

The price and inventory of S25FL256LAGMFN000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LAGMFN000 is usually 5 days.

3.What payment methods are accepted for S25FL256LAGMFN000?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256LAGMFN000 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL256LAGMFN000?

S25FL256LAGMFN000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL256LAGMFN000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL256LAGMFN000?

For technical support, including S25FL256LAGMFN000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LAGMFN000 requirements.

6.How does Aetrix verify that S25FL256LAGMFN000 is sourced from the original manufacturer or authorized distributors?

All S25FL256LAGMFN000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LAGMFN000 meets industry standards.

7.What is the process for return or replacement of S25FL256LAGMFN000?

All S25FL256LAGMFN000 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LAGMFN000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL256LAGMFN000 part is unused and in its original packaging.

Return procedure for S25FL256LAGMFN000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S25FL256LAGMFN000 Tags

  • S25FL256LAGMFN000
  • S25FL256LAGMFN000 PDF
  • S25FL256LAGMFN000 Datasheet
  • S25FL256LAGMFN000 Specifications
  • S25FL256LAGMFN000 Images
  • Infineon Technologies
  • Infineon Technologies S25FL256LAGMFN000
  • Buy S25FL256LAGMFN000
  • S25FL256LAGMFN000 Price
  • S25FL256LAGMFN000 Distributor
  • S25FL256LAGMFN000 Supplier
  • S25FL256LAGMFN000 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER