Infineon Technologies S25FL256LDPBHN030
- Part No.:
- S25FL256LDPBHN030
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL256LDPBHN030.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,409
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Product details
Overview
S25FL256LDPBHN030 from Cypress Semiconductor is a 256 Mbit (32 Mbyte) serial NOR flash memory with SPI Multi-I/O interface, supporting SDR/DDR Quad I/O and QPI modes up to 133 MHz clock rate, 66 MB/s read bandwidth, 4 KB uniform sector erase, and 100,000 program-erase cycles. It operates from 2.7 V to 3.6 V across –40°C to +105°C and is used in boot code storage for industrial microcontrollers and FPGA configuration.
For engineers reviewing the S25FL256LDPBHN030 datasheet, S25FL256LDPBHN030 pinout, S25FL256LDPBHN030 application, or S25FL256LDPBHN030 equivalent, key selection criteria include quad-mode timing compliance, security region protection granularity, SFDP v1.5 support, and WSON-8 package thermal performance under continuous XIP operation.
Technical Context
This device implements a floating-gate 65 nm process with a 256-byte page programming buffer and supports burst wrap, continuous XIP, and DDR Quad I/O read modes. Its command set includes JEDEC JESD216B-compliant SFDP for automatic configuration discovery and legacy block protection with volatile/non-volatile individual sector lock.
The memory architecture enables simultaneous suspend/resume of program and erase operations, and integrates four 256-byte non-volatile security regions outside the main array-each independently protected via power supply lock-down, password, or permanent write disable. Reset behavior is configurable via CR2V[7].
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 Mbyte) - supports full firmware images for mid-tier MCUs and FPGA bitstreams. |
| Interface Modes | SDR SPI, Dual I/O, Quad I/O, QPI, DDR Quad I/O - enables scalable bandwidth from 6.25 MB/s to 66 MB/s. |
| Erase Granularity | Uniform 4 KB sectors, 32 KB half-blocks, 64 KB blocks - allows fine-grained firmware update partitioning. |
| Endurance & Retention | 100,000 program-erase cycles min / 20-year data retention typical - suitable for field-upgradable embedded systems. |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V industrial logic rails without level shifting. |
| Temperature Range | –40°C to +105°C (Industrial Plus) - validated for extended thermal operation in motor control and gateway applications. |
| Security Regions | Four 256-byte non-volatile regions with password/power-lock protection - isolates bootloader keys and calibration data. |
Pinout & Package
Package: 8-pin WSON (6 mm × 8 mm, 0.5 mm pitch), Pb-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for command latching; must be held low during entire multi-byte transaction. |
| SCK | Serial Clock Input | Edge-triggered clock for all SPI modes; supports up to 133 MHz SDR or 66 MHz DDR operation. |
| IO0 (SI) | Serial Data I/O 0 | Single-bit input in SPI mode; IO0 in Dual/Quad modes; bidirectional with internal pull-up. |
| IO1 (SO) | Serial Data I/O 1 | Single-bit output in SPI mode; IO1 in Dual/Quad modes; bidirectional with internal pull-up. |
| IO2 (WP#) | Write Protect / I/O 2 | Hardware write protect when CR1V[1]=0; IO2 in Quad mode; internal pull-up enabled. |
| IO3 (RESET#) | Reset / I/O 3 | Hardware reset when CR2V[7]=1 and not in Quad/QPI; IO3 in active Quad/QPI mode; internal pull-up. |
| VDD | Power Supply | 2.7–3.6 V core and I/O supply; decoupling capacitor required per datasheet layout guidelines. |
| VSS | Ground | Signal and power ground reference; must be connected to low-impedance PCB plane. |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC JESD216B SFDP Support | Enables automatic host detection of read/write/erase parameters and configuration registers without hard-coded driver logic. |
| Program/Erase Suspend & Resume | Allows interruption of long-duration operations (e.g., 64 KB block erase) to service higher-priority commands like status reads. |
| Configurable Quad Mode | CR1V[1] bit selects between WP#/IO2 and RESET#/IO3 dual-role functionality - eliminates need for external mode strapping. |
| Individual Block Lock | Volatile or non-volatile locking of specific 4 KB sectors prevents accidental overwrite of bootloader or calibration tables. |
| Deep Power Down Mode | 2 µA standby current - extends battery life in always-on edge nodes while preserving memory contents. |
Applications
| Industrial PLC Firmware Storage | FPGA Configuration Memory |
|---|---|
Use Scenario: Storing firmware images and runtime parameter tables in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped via SPI-XIP; delivers deterministic 133 MHz Quad Read access for fast startup and hot-swappable module updates. Use Value: 4 KB uniform erase enables atomic firmware patching without erasing full image; 105°C rating ensures reliability near motor drives and power supplies. | Use Scenario: Holding compressed configuration bitstreams for Xilinx Artix-7 and Intel Cyclone V FPGAs in industrial gateways and vision systems. IC Role / Device Role / Timing Role: Serial configuration master; supports QPI mode for single-cycle address/command decoding and DDR Quad Read for high-throughput bitstream loading. Use Value: 66 MB/s read bandwidth reduces FPGA configuration time by >40% vs. legacy SPI flash; SFDP auto-negotiation simplifies driver porting across FPGA families. |
| Automotive ADAS Camera Module | Medical Imaging Device Boot Storage |
Use Scenario: Storing camera calibration data, lens correction profiles, and firmware for automotive surround-view systems operating at ambient temperatures up to 105°C. IC Role / Device Role / Timing Role: Secure parameter storage with hardware write protection; uses IO2 (WP#) and security regions to isolate calibration constants from application writes. Use Value: Four 256-byte security regions allow independent protection of lens distortion maps, exposure tables, and safety-critical boot code - meeting ASIL-B traceability requirements. | Use Scenario: Hosting boot loader and diagnostic firmware for portable ultrasound and MRI subsystems requiring FDA-compliant data integrity and long-term retention. IC Role / Device Role / Timing Role: Trusted boot source with Deep Power Down mode; leverages 20-year data retention and program-erase suspend for safe field updates during maintenance windows. Use Value: Erase suspend capability allows interruption of 64 KB block erase to log diagnostic timestamps - ensuring zero missed critical events during firmware upgrade. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256SAGMFV000 | Same density and pinout; FL-S family, 90 nm node, no DDR support, lower max clock (104 MHz), 136 KB/s 4 KB erase rate. | Lacks DDR Quad I/O and SFDP v1.5; requires fixed driver configuration instead of auto-discovery. | Select only if DDR and SFDP are unnecessary and cost is primary constraint. |
| MX25L25645GMI-10G | Micron-compatible pinout; supports 133 MHz Quad I/O but no DDR; 100,000 cycles, same 4 KB erase, no security regions. | No hardware security regions or individual block lock; relies on software-based protection schemes. | Choose when security isolation is handled externally and footprint compatibility with Micron designs is required. |
Compared with S25FL256SAGMFV000 and MX25L25645GMI-10G, the S25FL256LDPBHN030 uniquely combines DDR Quad I/O bandwidth, JEDEC SFDP v1.5 auto-configuration, and four dedicated hardware-protected security regions - enabling secure, high-speed, self-describing boot memory for next-generation industrial and medical platforms.
Availability
S25FL256LDPBHN030 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, FPGA configuration memory, and automotive ADAS camera modules requiring stable component supply, long-lifecycle support, and guaranteed Pb-free WSON-8 packaging.
Supply support for S25FL256LDPBHN030 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power memory and microcontroller solutions for industrial, automotive, and IoT applications.
The FL-L family targets space-constrained embedded systems needing high-speed serial NOR flash with advanced security, suspend/resume flexibility, and seamless migration from parallel NOR or earlier SPI flash generations.
FAQ
What is the maximum clock frequency supported in DDR Quad I/O mode?
The S25FL256LDPBHN030 supports DDR Quad I/O at up to 66 MHz clock frequency, delivering 66 MB/s effective read bandwidth. This is confirmed in the Performance Summary table (page 2 of datasheet 002-00124 Rev. *A) and verified in AC Characteristics section 5.5, where tVH/tVL setup/hold times are specified for 66 MHz DDR operation.
Does this device support hardware reset via the IO3 pin?
Yes - IO3 functions as RESET# when Configuration Register-2 bit CR2V[7] = 1 and the device is not in Quad-I/O or QPI mode (CR1V[1] = 0). In Quad/QPI mode, IO3 serves as IO3; reset is then performed via command or by driving CS# high for >20 µs. This dual-role behavior is defined in Section 2.8 and Table 2.1 of the datasheet.
How many security regions does the S25FL256LDPBHN030 provide, and what is their size?
The device provides four non-volatile security regions, each exactly 256 bytes in size, located outside the main flash array. These regions support independent protection via power supply lock-down, password, or permanent disable. Their layout and protection mechanisms are detailed in Sections 7.5 and 8.1 of the datasheet.
Is SFDP (Serial Flash Discoverable Parameters) supported, and which version?
Yes - the device implements JEDEC JESD216B SFDP v1.5, enabling automatic host discovery of read/write/erase timing, address width, and configuration register layout. This is explicitly stated in Section 1.1 and fully documented in Section 11.1 of the datasheet, including SFDP parameter table structure and vendor-specific extensions.
S25FL256LDPBHN030 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-L
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL256LDPBHN030 FAQ
1.How can I place an order for S25FL256LDPBHN030 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256LDPBHN030 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256LDPBHN030 reliable?
The price and inventory of S25FL256LDPBHN030 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256LDPBHN030 is usually 5 days.
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Once your S25FL256LDPBHN030 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256LDPBHN030?
For technical support, including S25FL256LDPBHN030 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256LDPBHN030 requirements.
6.How does Aetrix verify that S25FL256LDPBHN030 is sourced from the original manufacturer or authorized distributors?
All S25FL256LDPBHN030 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256LDPBHN030 meets industry standards.
7.What is the process for return or replacement of S25FL256LDPBHN030?
All S25FL256LDPBHN030 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256LDPBHN030, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256LDPBHN030 part is unused and in its original packaging.
Return procedure for S25FL256LDPBHN030:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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