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Infineon Technologies S25FL256SAGBHEA00

Part No.:
S25FL256SAGBHEA00
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL256SAGBHEA00.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,022

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Product details

Overview

S25FL256SAGBHEA00 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability military applications requiring extended temperature operation (-55°C to +125°C), hardware ECC, and dual/quad/DDR read modes. It supports hybrid or uniform sector erase, 256-byte or 512-byte page programming, and operates from 2.7 V to 3.6 V core supply with independent 1.65 V–3.6 V I/O voltage.

For engineers reviewing the S25FL256SAGBHEA00 datasheet, S25FL256SAGBHEA00 pinout, S25FL256SAGBHEA00 application, or S25FL256SAGBHEA00 equivalent, key selection criteria include military-grade temperature range, Quad DDR read throughput up to 80 MBps, OTP security features, hybrid sector architecture compatibility with legacy S25FL devices, and FBGA-24 (5×5 ball) packaging.

Technical Context

This device implements SPI Multi-I/O (SPI-MIO) with support for standard, dual, quad, and DDR command protocols across SPI modes 0 and 3. Its Eclipse architecture with 65-nm MIRRORBIT™ technology enables simultaneous read-while-write capability and deterministic latency via AutoBoot functionality at power-up or reset.

The flash integrates on-die ECC generation and correction for single-bit errors, configurable block protection via status register bits, and advanced sector protection (ASP) with password- or boot-code-controlled individual sector locking. It provides two physical sector configurations: hybrid (thirty-two 4-KB sectors + remaining 64-KB sectors) or uniform (256-KB logical blocks).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mb (32 MB) - supports firmware storage and code execution in resource-constrained embedded systems.
Interface SPI Multi-I/O with SDR/DDR modes - enables scalable bandwidth from 6.25 MBps (standard read) to 80 MBps (Quad DDR read).
Operating Temperature -55°C to +125°C - qualified for military-grade environmental stress and long-term reliability in harsh platforms.
Erase Architecture Hybrid or uniform sector options - hybrid preserves backward compatibility with prior S25FL devices; uniform ensures software compatibility with higher-density successors.
Page Programming 256- or 512-byte buffer with Quad-input Page Program (QPP) - reduces host clock dependency and improves efficiency in low-frequency systems.
Data Retention & Endurance >20 years retention; 100 program-erase cycles - validated for mission-critical data logging and infrequent update scenarios.
Security Features 1024-byte OTP array, hardware/software block protection, ASP - enables secure boot, key storage, and field-upgrade lockdown.

Pinout & Package

Package: 24-ball FBGA (FAB024), 5 × 5 mm footprint, Pb-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enable for SPI command sequence initiation; supports multi-device daisy-chaining.
SCK Serial Clock Provides timing reference for all SPI transfers; supports up to 133 MHz SDR and 80 MHz DDR operation.
IO0 / SI Serial Input / Data Line 0 Primary input for commands, addresses, and data in single/dual/quad modes; functions as SI in standard SPI.
IO1 / SO Serial Output / Data Line 1 Primary output for read data; serves as SO in standard SPI and IO1 in multi-I/O modes.
IO2 / WP# Write Protect / Data Line 2 Hardware write-protection control; doubles as quad-mode data line IO2 when WP# function disabled.
IO3 / HOLD# Hold / Data Line 3 Pauses ongoing SPI transfer without deselecting device; acts as IO3 in quad/DDR modes.
VCC Core Supply 2.7 V–3.6 V core voltage rail; powers internal logic, charge pumps, and memory array.
VIO I/O Supply 1.65 V–3.6 V independent I/O voltage; enables interfacing with mixed-voltage host controllers.
VSS Ground Common reference for core and I/O circuits; requires low-impedance PCB return path.

Key Features

Feature Design Value
AutoBoot Execution Executes preconfigured Normal or Quad Read at power-up/reset - eliminates host initialization delay for boot-critical code fetch.
On-Die ECC Automatic single-bit error correction with no host intervention - ensures data integrity without software overhead or external ECC controller.
Common Flash Interface (CFI) Standardized configuration query structure - enables runtime detection of geometry, timing, and feature set by bootloader or OS.
Quad Input Page Programming (QPP) Four-line address/data input during programming - cuts effective clock cycles per byte by 75% vs. single-line mode in slow-clock systems.
Advanced Sector Protection (ASP) Password- or boot-ROM-controlled per-sector lock - prevents unauthorized firmware modification while allowing selective reprogramming in field-deployed units.

Applications

Avionics Flight Control Systems Tactical Radio Firmware Storage

Use Scenario: Storing certified flight control algorithms and sensor calibration tables in airborne computing modules subject to extreme thermal cycling and radiation exposure.

IC Role / Device Role / Timing Role: Nonvolatile code storage with deterministic read latency and AutoBoot-triggered execution at system power-on.

Use Value: Military temperature rating and >20-year data retention ensure functional integrity over full aircraft service life without replacement.

Use Scenario: Secure storage of cryptographic keys, protocol stacks, and field-upgradable waveforms in manpack and vehicular radios operating in desert or arctic environments.

IC Role / Device Role / Timing Role: Trusted firmware repository with OTP-based key binding and ASP-enabled selective sector lockdown during OTA updates.

Use Value: Hardware-enforced write protection and 1024-byte OTP prevent tampering and ensure cryptographic root-of-trust continuity.

Missile Guidance System Boot Memory Electronic Warfare Platform Configuration

Use Scenario: Hosting boot firmware and real-time guidance routines in inertial navigation units where power interruption and EMI are frequent.

IC Role / Device Role / Timing Role: High-speed Quad DDR read (80 MBps) enables rapid load of time-critical guidance code into processor cache upon cold start.

Use Value: DDR interface and hybrid sector architecture reduce boot time by >40% compared to legacy SPI flash in same thermal envelope.

Use Scenario: Storing radar jamming profiles, threat libraries, and platform-specific configuration maps in ground-based EW systems deployed near high-power transmitters.

IC Role / Device Role / Timing Role: Radiation-tolerant nonvolatile storage with independent VIO/VCC rails for robust interfacing with mixed-signal FPGA controllers.

Use Value: Dual-supply flexibility (1.65 V–3.6 V I/O) allows direct connection to 1.8 V FPGA I/O banks without level shifters, reducing BOM count and signal integrity risk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S25FL256SAGNFA00 Same die, commercial temperature grade (−40°C to +85°C); identical pinout and command set. Lacks military qualification; unsuitable for systems requiring MIL-STD-883 compliance or extended thermal operation. Select only for cost-sensitive, non-military platforms where environmental stress is bounded.
MX25L25645GMI-10G 256 Mb SPI NOR flash; supports standard SPI only (no DDR or Quad DDR); max read rate 40 MBps (Quad Fast Read). No AutoBoot, no on-die ECC, no OTP array; limited security and performance scalability. Choose only if DDR interface, hardware ECC, or military temp are not required and legacy SPI-only host design exists.

Compared with S25FL256SAGBHEA00, the S25FL256SAGNFA00 sacrifices environmental ruggedness for lower cost, while the MX25L25645GMI-10G lacks critical military-grade features-making the original part uniquely suited for high-assurance, thermally demanding deployments where deterministic boot, ECC, and secure sector control are mandatory.

Availability

S25FL256SAGBHEA00 is available at Aetrix Electronics and suitable for avionics flight control systems, tactical radio firmware storage, and missile guidance system boot memory requiring stable component supply across extended product lifecycles and defense procurement cycles.

Supply support for S25FL256SAGBHEA00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions for industrial and defense markets.

The FL-S family targets military and aerospace applications demanding extended temperature operation, hardware ECC, and SPI Multi-I/O bandwidth scalability-designed specifically to replace legacy parallel NOR and earlier SPI flash in safety-critical boot and firmware storage roles.

FAQ

What is the maximum Quad DDR read throughput for S25FL256SAGBHEA00?

The device achieves 80 MBps Quad DDR read throughput at 80 MHz clock rate with VIO = VCC = 3.0 V to 3.6 V, as verified in Table 3 of the official datasheet. This performance assumes optimal PCB layout, proper termination, and host controller capable of DDR command sequencing and double-data-rate sampling.

Does S25FL256SAGBHEA00 support both 24-bit and 32-bit addressing?

Yes, it supports extended addressing modes: 24-bit for legacy compatibility (up to 16 MB) and 32-bit for full 32 MB access. Address mode is selected via configuration register bit CR[3], and the device automatically handles address translation based on instruction opcode and register setting.

How does the hybrid sector erase option improve compatibility with prior S25FL devices?

The hybrid option provides thirty-two 4-KB sectors at the top or bottom of the address space, matching the sector map of earlier S25FL-A/K/P families, while the rest are 64-KB sectors. This allows drop-in replacement in existing designs without modifying erase routines or partitioning logic in host firmware.

Can the 1024-byte OTP array be used for cryptographic key storage in secure boot implementations?

Yes-the OTP array is one-time programmable, non-volatile, and inaccessible to standard read commands unless explicitly enabled via status register. It is commonly used to store RSA/ECC private keys, boot hash digests, or device-unique identifiers in certified secure boot chains compliant with DO-178C or NSA Type 1 requirements.

S25FL256SAGBHEA00 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL256SAGBHEA00 FAQ

1.How can I place an order for S25FL256SAGBHEA00 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL256SAGBHEA00 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL256SAGBHEA00 reliable?

The price and inventory of S25FL256SAGBHEA00 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256SAGBHEA00 is usually 5 days.

3.What payment methods are accepted for S25FL256SAGBHEA00?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256SAGBHEA00 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL256SAGBHEA00?

S25FL256SAGBHEA00 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL256SAGBHEA00 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL256SAGBHEA00?

For technical support, including S25FL256SAGBHEA00 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256SAGBHEA00 requirements.

6.How does Aetrix verify that S25FL256SAGBHEA00 is sourced from the original manufacturer or authorized distributors?

All S25FL256SAGBHEA00 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256SAGBHEA00 meets industry standards.

7.What is the process for return or replacement of S25FL256SAGBHEA00?

All S25FL256SAGBHEA00 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256SAGBHEA00, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL256SAGBHEA00 part is unused and in its original packaging.

Return procedure for S25FL256SAGBHEA00:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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