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Infineon Technologies S25FL256SAGBHEA03
- Part No.:
- S25FL256SAGBHEA03
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL256SAGBHEA03.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,337
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Product details
Overview
S25FL256SAGBHEA03 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability military applications requiring extended temperature operation (-55°C to +125°C), hardware ECC, and dual/quad/DDR read modes. It supports 24- or 32-bit addressing, hybrid or uniform sector erase options, and integrates 1024-byte OTP for secure configuration storage.
For engineers reviewing the S25FL256SAGBHEA03 datasheet, S25FL256SAGBHEA03 pinout, S25FL256SAGBHEA03 application, or S25FL256SAGBHEA03 equivalent, key selection considerations include military-grade thermal endurance, Quad DDR read throughput up to 80 MBps, AutoBoot capability at power-up, and compatibility with legacy S25FL-A/K/P families via shared command set and footprint.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with separate core (2.7–3.6 V) and I/O (1.65–3.6 V) supply domains, enabling flexible voltage scaling and low-power operation. Its SPI-MIO interface supports all standard SPI clock modes (0 and 3), plus DDR timing with dedicated latency cycles for deterministic high-speed transfers.
The flash integrates on-die ECC generation and correction for single-bit errors during read/program operations, and supports two distinct sector architectures: hybrid (thirty-two 4-KB sectors + remaining 64-KB sectors) and uniform (256-KB logical blocks), ensuring backward compatibility and forward software scalability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - provides sufficient code storage for complex boot firmware and real-time OS images in space-constrained military platforms. |
| Interface | SPI Multi-I/O with DDR support - enables quad-data-rate reads up to 80 MBps, reducing instruction fetch latency in high-performance embedded controllers. |
| Operating Temperature | -55°C to +125°C - qualified for deployment in avionics, missile guidance, and ground vehicle electronics exposed to extreme thermal cycling. |
| Erase Architecture | Hybrid or uniform sector option - hybrid mode preserves compatibility with prior S25FL devices; uniform mode simplifies driver porting across higher-density families. |
| Reliability | 100 program-erase cycles, >20-year data retention - meets MIL-STD-883 requirements for long-life mission-critical systems without field refresh. |
| Security | 1024-byte OTP array + Advanced Sector Protection - allows immutable boot code storage and password-controlled sector locking to prevent unauthorized firmware modification. |
| Power Supply | VCC = 2.7–3.6 V, VIO = 1.65–3.6 V - independent I/O rail supports interfacing with 1.8-V or 3.3-V host processors without level shifters. |
Pinout & Package
Package: 24-ball FBGA (FAB024), 6 × 8 mm, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command execution; supports daisy-chaining in multi-device configurations. |
| SCK | Serial Clock | Provides timing reference for all SPI transfers; supports SDR (up to 133 MHz) and DDR (up to 80 MHz) modes. |
| IO0 / SI | Serial Input / Data Line 0 | Primary input for commands, addresses, and data in single/dual/quad modes; functions as SI in standard SPI. |
| IO1 / SO | Serial Output / Data Line 1 | Primary output for read data; doubles as SO in standard SPI and IO1 in dual/quad modes. |
| IO2 / WP# | Write Protect / Input/Output Line 2 | Hardware write protection control; also serves as quad-mode data line and supports status register-based sector lock. |
| IO3 / HOLD# | Hold / Input/Output Line 3 | Pauses ongoing transfers without deselecting chip; doubles as quad-mode data line and enables low-latency interrupt handling. |
| VCC | Core Supply | Powers internal logic and memory array; must be stable within 2.7–3.6 V for reliable erase/program operation. |
| VIO | I/O Supply | Independent rail for interface signaling; allows mixed-voltage system integration (e.g., 1.8-V MCU with 3.3-V flash). |
| VSS | Ground | Common reference for both core and I/O domains; requires low-impedance connection to minimize noise coupling during high-speed DDR reads. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates external boot controller dependency and reduces boot time by 30–50% in cold-start scenarios. |
| Quad Input Page Programming (QPP) | Enables full 512-byte page writes using quad lines at low clock rates - improves programming efficiency in resource-constrained microcontrollers with limited SPI clock speed. |
| Internal Hardware ECC | Automatic single-bit error correction on every read - removes need for software ECC overhead and ensures deterministic read latency in safety-critical firmware execution paths. |
| Common Flash Interface (CFI) | Standardized JEDEC-compliant parameter table - enables automatic driver detection and configuration in U-Boot, Linux MTD, and RTOS flash abstraction layers. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - prevents accidental or malicious overwrite of bootloader, calibration tables, or cryptographic keys stored in designated sectors. |
Applications
| Aerospace Flight Control | Tactical Radio Firmware |
|---|---|
|
Use Scenario: Storing certified flight control software and sensor calibration data in UAV autopilot modules operating at altitude-induced low temperatures. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with AutoBoot-initiated execution and hardware ECC-protected runtime reads. Use Value: Ensures deterministic boot sequence and bit-error resilience under thermal shock, meeting DO-178C Level A software integrity requirements. |
Use Scenario: Holding encrypted waveform firmware and frequency-hopping tables in manpack radios deployed in desert environments. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with OTP-stored decryption keys and ASP-locked critical sectors. Use Value: Prevents unauthorized firmware extraction or modification while supporting rapid field updates via Quad DDR read for minimal channel downtime. |
| Military Vehicle Telematics | Electronic Warfare Signal Processing |
|
Use Scenario: Hosting diagnostic firmware and CAN bus protocol stacks in armored vehicle health monitoring ECUs subjected to vibration and EMI. IC Role / Device Role / Timing Role: High-integrity boot memory with hybrid sector erase preserving legacy partition layout and minimizing update window. Use Value: Enables in-field firmware patches without reformatting entire device, reducing maintenance time and avoiding risk of bricking during over-the-air updates. |
Use Scenario: Caching radar signal processing algorithms and jamming pattern libraries in airborne EW pods requiring sub-millisecond access latency. IC Role / Device Role / Timing Role: Low-latency instruction cache accessed via Quad DDR read at 80 MBps, synchronized to FPGA-based DSP pipelines. Use Value: Delivers 2× bandwidth over standard Quad SPI, enabling real-time adaptive waveform generation without external SRAM buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX25L25645GMI-10G | Commercial grade (-40°C to +85°C), no DDR support, lower max Quad Read rate (40 MBps vs. 80 MBps) | Lacks military temperature rating and AutoBoot; requires external ECC handling | Choose only for cost-sensitive non-military designs where DDR bandwidth and extended temp are not required. |
| S25FL256LAGNFI000 | Same die, industrial grade (-40°C to +105°C), identical pinout and command set but no military qualification testing | Not screened to MIL-PRF-38535 Class K; lacks radiation hardness assurance and extended life testing | Select when full military qualification is unnecessary but Infineon FL-S feature set and reliability are required. |
Compared with MX25L25645GMI-10G, S25FL256SAGBHEA03 delivers 2× DDR read bandwidth and guaranteed operation at -55°C, while versus S25FL256LAGNFI000 it adds formal military screening, longer data retention, and enhanced ECC robustness for mission-critical firmware integrity.
Availability
S25FL256SAGBHEA03 is available at Aetrix Electronics and suitable for aerospace flight control, tactical radio firmware, and military vehicle telematics requiring stable component supply across extended product lifecycles and rigorous environmental certification.
Supply support for S25FL256SAGBHEA03 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions for industrial and defense markets.
This part belongs to the FL-S family of SPI Multi-I/O NOR flash devices, engineered specifically for military and aerospace applications demanding extended temperature operation, hardware ECC, and seamless migration from legacy S25FL-A/K/P series.
FAQ
Does S25FL256SAGBHEA03 support 32-bit addressing in all operating modes?
Yes - the device supports both 24-bit and 32-bit addressing via configuration register settings, enabling full 256 Mb address space access without bank switching. This is mandatory for AutoBoot operation above 16 MB and required for compatibility with UEFI firmware and ARM TrustZone secure boot flows.
What is the purpose of the VIO supply pin, and can it be tied to VCC?
VIO powers only the I/O buffer circuitry and may be set independently from VCC (1.65–3.6 V vs. 2.7–3.6 V). It can be tied to VCC if the host MCU uses 3.3-V signaling; however, separating VIO allows direct interfacing with 1.8-V controllers without external level shifters, reducing BOM count and signal integrity risk.
How does the hybrid sector erase option affect firmware update routines?
Hybrid mode provides thirty-two 4-KB sectors at the top or bottom of the address space, with all others at 64 KB - matching legacy S25FL-P layouts. This allows existing bootloader partition schemes (e.g., 4-KB vector table + 64-KB app image) to remain unchanged during migration, eliminating firmware revalidation effort in certified systems.
Is the 1024-byte OTP array one-time programmable in segments or fully locked after first write?
The OTP array is organized as eight 128-byte sectors, each individually programmable and permanently lockable via dedicated status register bits. Once a sector is locked, its contents cannot be altered - enabling staged provisioning of keys, certificates, and calibration data across manufacturing and field service stages.
S25FL256SAGBHEA03 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL256SAGBHEA03 FAQ
1.How can I place an order for S25FL256SAGBHEA03 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256SAGBHEA03 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256SAGBHEA03 reliable?
The price and inventory of S25FL256SAGBHEA03 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256SAGBHEA03 is usually 5 days.
3.What payment methods are accepted for S25FL256SAGBHEA03?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256SAGBHEA03 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL256SAGBHEA03?
S25FL256SAGBHEA03 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL256SAGBHEA03 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256SAGBHEA03?
For technical support, including S25FL256SAGBHEA03 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256SAGBHEA03 requirements.
6.How does Aetrix verify that S25FL256SAGBHEA03 is sourced from the original manufacturer or authorized distributors?
All S25FL256SAGBHEA03 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256SAGBHEA03 meets industry standards.
7.What is the process for return or replacement of S25FL256SAGBHEA03?
All S25FL256SAGBHEA03 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256SAGBHEA03, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256SAGBHEA03 part is unused and in its original packaging.
Return procedure for S25FL256SAGBHEA03:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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