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Infineon Technologies S25FL256SAGBHMC10

Part No.:
S25FL256SAGBHMC10
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL256SAGBHMC10.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,260

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Product details

Overview

S25FL256SAGBHMC10 from Infineon Technologies is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability military applications requiring extended temperature operation and secure firmware storage. It supports Quad, Dual, and DDR read modes up to 80 MHz (80 MBps Quad DDR), features hardware ECC, 1024-byte OTP, and hybrid/uniform sector erase options in a 24-ball FBGA package.

For engineers reviewing the S25FL256SAGBHMC10 datasheet, S25FL256SAGBHMC10 pinout, S25FL256SAGBHMC10 application, or S25FL256SAGBHMC10 equivalent, key selection criteria include military-grade (-55°C to +125°C) operation, 2.7–3.6 V core voltage with independent 1.65–3.6 V I/O supply, AutoBoot capability, CFI compliance, and support for both legacy S25FL-A/K/P footprints and advanced security features like Advanced Sector Protection.

Technical Context

This device implements a 65-nm MIRRORBIT™ Eclipse architecture with dual-voltage domain design: separate VCC (core) and VIO (I/O) supplies enable interoperability across mixed-voltage systems. Its SPI-MIO interface supports all four clock polarity/phase modes (0 and 3), plus DDR command execution with dedicated latency cycles for deterministic timing.

The memory array is organized with configurable sectoring - either hybrid (thirty-two 4-KB sectors + remaining 64-KB sectors) or uniform (256-KB logical blocks) - enabling backward compatibility with prior S25FL generations while supporting future density scaling. Internal hardware ECC provides single-bit error correction without host intervention during read operations.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mb (32 MB) serial NOR flash with byte-addressable random access
Interface SPI Multi-I/O supporting Normal/Fast/Dual/Quad/DDR read and program commands
Max Read Speed 80 MBps via Quad DDR mode at 80 MHz clock (VIO = VCC = 3.0–3.6 V)
Erase Performance 500 KBps for 64-KB physical sector erase (hybrid option) or 256-KB logical block erase (uniform option)
Endurance & Retention 100 program-erase cycles minimum; >20 years data retention at +125°C
Operating Temperature Military grade: -55°C to +125°C ambient, qualified per MIL-STD-883
Security Features 1024-byte OTP array; hardware/software block protection; Advanced Sector Protection with password or boot-code control

Pinout & Package

Package: 24-ball FBGA (FAB024), 5 × 5 mm footprint, Pb-free, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enables serial command decoding; must be held low for entire instruction cycle
SCK Serial Clock Input clock for SDR/DDR modes; supports up to 133 MHz for Fast Read (SDR) and 80 MHz for DDR
IO0 Serial Input / Data Line 0 Primary input for commands/addresses; also functions as bidirectional data line in multi-I/O modes
IO1 Serial Output / Data Line 1 Primary output for read data; bidirectional in Dual/Quad modes; supports DDR output timing
IO2 Write Protect / Data Line 2 Hardware write protection enable; also serves as third I/O line in Quad mode
IO3 Hold / Data Line 3 Pauses ongoing transfer without deselecting device; fourth I/O line in Quad mode
VCC Core Supply Voltage 2.7–3.6 V CMOS core power; powers internal logic, ECC engine, and memory array
VIO I/O Supply Voltage 1.65–3.6 V independent I/O rail; decouples interface voltage from core for mixed-voltage systems
VSS Ground Common reference for VCC and VIO; requires low-inductance connection for signal integrity

Key Features

Feature Design Value
AutoBoot Execution Automatically initiates Normal or Quad Read at preselected address on power-up or reset, enabling zero-delay firmware fetch
Hardware ECC On-the-fly single-bit error correction during reads; eliminates need for host-level error management overhead
Hybrid Sector Architecture Thirty-two 4-KB sectors at top/bottom + 64-KB sectors elsewhere preserves compatibility with legacy S25FL-A/K/P boot code layouts
Advanced Sector Protection (ASP) Individual sector lock controlled by boot ROM code or user-defined password, preventing unauthorized firmware modification
CFI Compliance Standard Common Flash Interface data structure enables automatic configuration detection and driver portability across platforms

Applications

Aerospace Avionics Boot Memory Military Radar Signal Processing

Use Scenario: Storing boot firmware and FPGA configuration bitstreams in airborne mission computers operating at altitude with thermal cycling.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory providing deterministic AutoBoot execution and CFI-based initialization sequence.

Use Value: Military temperature rating (-55°C to +125°C) and >20-year data retention ensure reliability across decades of field deployment without refresh.

Use Scenario: Holding real-time DSP firmware and calibration tables in ground-based radar transceivers exposed to desert and arctic environments.

IC Role / Device Role / Timing Role: High-speed Quad DDR read interface delivers 80 MBps sustained throughput for rapid waveform loading during system wake-up.

Use Value: Hardware ECC prevents silent data corruption in high-radiation environments where soft errors are statistically significant.

Tactical Radio Secure Firmware Storage Missile Guidance System Code Vault

Use Scenario: Securing cryptographic keys and over-the-air update images in handheld SATCOM radios subject to physical tampering.

IC Role / Device Role / Timing Role: OTP array and ASP-enabled sector locking enforce immutable root-of-trust for secure boot chain validation.

Use Value: 1024-byte OTP provides dedicated space for asymmetric key storage; ASP allows fine-grained protection of critical update partitions.

Use Scenario: Storing flight-critical guidance algorithms and sensor fusion parameters in inertial navigation units with zero tolerance for corruption.

IC Role / Device Role / Timing Role: Uniform 256-KB erase blocks simplify firmware update partitioning and reduce wear leveling complexity in safety-critical contexts.

Use Value: 100-cycle endurance meets MIL-HDBK-217F reliability models for mission-limited reprogramming; hybrid sector option supports legacy bootloader migration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S25FL256SAGMFM10 Same die, but in WSON-8 (6 × 8 mm) package; no FBGA ball grid; lower I/O voltage range (1.65–3.0 V vs. 1.65–3.6 V) Limited to space-constrained PCBs without BGA assembly capability; unsuitable for high-density routing or thermal spread requirements Select when board layout prohibits BGA or thermal dissipation is managed externally
MX25L25645GMI-10G 256 Mb SPI NOR from Macronix; supports only SDR modes (no DDR); lacks hardware ECC and ASP; 100 MBps max Quad Read (vs. 80 MBps DDR) Lower cost for commercial-temperature designs; insufficient for radiation-hardened or long-life military deployments Choose only for non-military applications where DDR performance and ECC are not required

Compared with S25FL256SAGBHMC10, the S25FL256SAGMFM10 offers identical functionality in a different package but sacrifices I/O voltage flexibility and thermal performance, while the MX25L25645GMI-10G omits critical military-grade features including DDR, hardware ECC, and Advanced Sector Protection - making it unsuitable for high-integrity firmware storage.

Availability

S25FL256SAGBHMC10 is available at Aetrix Electronics and suitable for aerospace avionics, military radar systems, and secure tactical radio platforms requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S25FL256SAGBHMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions for industrial and defense markets.

This part belongs to the FL-S family of SPI Multi-I/O NOR flash devices, engineered specifically for military and aerospace applications demanding extended temperature operation, hardware-based security, and seamless migration from legacy S25FL-A/K/P platforms.

FAQ

Does S25FL256SAGBHMC10 support both 24-bit and 32-bit addressing?

Yes. The device supports extended addressing modes: 24-bit addressing for compatibility with legacy 16 MB devices and 32-bit addressing to fully access the 32 MB memory space. Address mode is selected via configuration register bits and does not require external hardware changes.

What is the purpose of the VIO pin, and can it be tied to VCC?

VIO supplies power to the I/O buffer circuitry independently from the core VCC rail, enabling operation with I/O voltages as low as 1.65 V while maintaining full core functionality. It may be tied to VCC only if both rails operate within the overlapping 2.7–3.6 V range; otherwise, separate regulation is required to meet absolute maximum ratings.

How does AutoBoot function, and can the boot address be modified in-system?

AutoBoot executes a preconfigured Normal or Quad Read command at power-up or hardware reset using an address stored in a dedicated configuration register. That address is writable via standard SPI commands after device initialization, allowing field-upgradable boot locations without requiring mask ROM changes.

Is the 1024-byte OTP area one-time programmable in segments or only as a full block?

The OTP array consists of 32 individually lockable 32-byte sectors. Each sector can be permanently locked after programming, enabling incremental provisioning of keys, certificates, or calibration data without committing the entire 1024-byte space at once.

S25FL256SAGBHMC10 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
-
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
750µs
Access Time:
6.5 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL256SAGBHMC10 FAQ

1.How can I place an order for S25FL256SAGBHMC10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL256SAGBHMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL256SAGBHMC10 reliable?

The price and inventory of S25FL256SAGBHMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256SAGBHMC10 is usually 5 days.

3.What payment methods are accepted for S25FL256SAGBHMC10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256SAGBHMC10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL256SAGBHMC10?

S25FL256SAGBHMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL256SAGBHMC10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL256SAGBHMC10?

For technical support, including S25FL256SAGBHMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256SAGBHMC10 requirements.

6.How does Aetrix verify that S25FL256SAGBHMC10 is sourced from the original manufacturer or authorized distributors?

All S25FL256SAGBHMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256SAGBHMC10 meets industry standards.

7.What is the process for return or replacement of S25FL256SAGBHMC10?

All S25FL256SAGBHMC10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256SAGBHMC10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL256SAGBHMC10 part is unused and in its original packaging.

Return procedure for S25FL256SAGBHMC10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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