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Infineon Technologies S25FL256SAGBHMC13
- Part No.:
- S25FL256SAGBHMC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL256SAGBHMC13.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,050
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Product details
Overview
S25FL256SAGBHMC13 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability military applications requiring extended temperature operation and secure firmware storage. It features 65-nm MIRRORBIT™ Eclipse architecture, hybrid or uniform sector erase options (4 KB/64 KB/256 KB), hardware ECC, and AutoBoot functionality at power-up. Its dual- and quad-mode DDR read rates reach up to 80 MBps, supporting boot code execution in avionics and ruggedized embedded systems.
For engineers reviewing the S25FL256SAGBHMC13 datasheet, S25FL256SAGBHMC13 pinout, S25FL256SAGBHMC13 application, or S25FL256SAGBHMC13 equivalent, key selection criteria include military-grade (-55°C to +125°C) operation, 24-/32-bit addressing support, OTP-based security configuration, and compatibility with legacy S25FL-A/K/P families via shared command set and footprint.
Technical Context
This device implements a serial peripheral interface with configurable SPI clock polarity/phase (modes 0 and 3), supporting SDR and DDR protocols across VIO = 1.65–3.6 V and VCC = 2.7–3.6 V. Its internal architecture integrates dedicated logic for Quad Input Page Programming (QPP), AutoBoot address preselection, and Common Flash Interface (CFI) metadata access.
The flash supports two physical erase configurations: hybrid (thirty-two 4-KB sectors + remaining 64-KB sectors) for backward compatibility with prior S25FL devices, and uniform (256-KB blocks only) for software portability across higher-density generations. Sector protection is enforced via Status Register bits and Advanced Sector Protection (ASP) with password or boot-code control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - provides sufficient space for full firmware images and secure boot partitions in mission-critical systems. |
| Interface Protocol | SPI Multi-I/O with DDR support - enables 80 MBps Quad DDR read throughput at 80 MHz, reducing boot latency in real-time platforms. |
| Erase Architecture | Hybrid or uniform sector option - hybrid mode ensures drop-in replacement for legacy S25FL designs; uniform mode simplifies driver porting across densities. |
| Data Retention | >20 years - validated under military temperature cycling, ensuring long-term reliability without refresh in sealed avionics modules. |
| Endurance | 100 program-erase cycles - specified for critical configuration or calibration data storage where write frequency is low but integrity is essential. |
| Security Features | 1024-byte OTP array + ASP + hardware/software block protection - enables immutable root-of-trust keys and field-upgradeable protected sectors. |
| Operating Temperature | -55°C to +125°C - qualified per MIL-STD-883, enabling deployment in engine-mounted ECUs and space-constrained radar subsystems. |
Pinout & Package
Package: 24-ball FBGA (FAB024), 5 mm × 5 mm, Pb-free, compatible with standard reflow profiles for high-reliability assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command sequence initiation; supports daisy-chaining in multi-device configurations. |
| SCK | Serial Clock | Provides timing reference for all SPI transfers; supports modes 0 and 3 for polarity/phase flexibility with host controllers. |
| IO0 (SI) | Serial Input / Data Line 0 | Primary data input during commands; functions as bidirectional I/O in multi-I/O modes for quad/dual reads/writes. |
| IO1 (SO) | Serial Output / Data Line 1 | Primary data output during reads; shares pin function with IO0/IO2/IO3 in quad mode for parallel data transfer. |
| IO2 (WP#) | Write Protect / Data Line 2 | Hardware-enabled sector lock; doubles as quad I/O line when WP# functionality is disabled via status register. |
| IO3 (HOLD#) | Hold / Data Line 3 | Pauses ongoing transfers without deselecting chip; repurposed as fourth I/O line in quad mode for maximum bandwidth. |
| VCC | Core Supply | 2.7–3.6 V core voltage domain powering memory array and logic; decoupling required per MIL-PRF-38535. |
| VIO | I/O Supply | 1.65–3.6 V independent I/O rail - allows interfacing with 1.8 V or 3.3 V host processors without level shifters. |
| VSS | Ground | Dedicated supply and signal ground pins ensure noise immunity in EMI-prone military environments. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Executes Normal or Quad Read automatically at power-up/reset from user-defined address - eliminates external boot controller dependency in minimal-footprint systems. |
| Internal Hardware ECC | Single-bit error correction with automatic generation - removes need for software ECC overhead and improves system-level MTBF in radiation-prone deployments. |
| Quad Input Page Programming (QPP) | Enables efficient programming on low-clock-rate hosts by accepting 4-bit-wide data per cycle - reduces write time by up to 4× vs standard SPI writes. |
| Common Flash Interface (CFI) | Standardized parameter table accessible via SPI - allows runtime detection of density, timing, and protection settings without hard-coded assumptions. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - supports hierarchical firmware update schemes with verified rollback prevention. |
Applications
| Avionics Boot Memory | Tactical Radio Firmware Storage |
|---|---|
|
Use Scenario: Stores boot loader and FPGA configuration bitstreams in airborne mission computers operating at altitude and extreme thermal gradients. IC Role / Device Role / Timing Role: Primary nonvolatile boot source with AutoBoot and CFI interrogation - initiates execution within 100 µs of power stabilization. Use Value: Eliminates external boot ROM and reduces BOM count while meeting DO-254 design assurance Level A timing constraints. |
Use Scenario: Holds encrypted radio stack firmware and cryptographic keys in manpack and vehicular radios deployed in desert or arctic conditions. IC Role / Device Role / Timing Role: Secure firmware repository with OTP key storage and ASP-enforced sector lockdown - prevents unauthorized firmware modification during field maintenance. Use Value: Meets NSA Type 1 encryption module requirements via hardware-enforced write protection and >20-year data retention without battery backup. |
| Missile Guidance System Code Storage | Ruggedized Industrial PLC Configuration |
|
Use Scenario: Retains flight control algorithms and sensor calibration tables in guided munitions subjected to high-G launch and vibration. IC Role / Device Role / Timing Role: Radiation-tolerant code storage with hybrid erase architecture - preserves critical 4-KB calibration sectors while allowing bulk updates to main logic. Use Value: Enables field recalibration without full firmware reload, reducing maintenance downtime and preserving mission-critical parameters. |
Use Scenario: Stores programmable logic controller firmware and I/O mapping tables in oilfield SCADA systems exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: High-endurance configuration memory with uniform 256-KB erase blocks - simplifies firmware update routines across product generations. Use Value: Guarantees 100-cycle endurance for daily configuration changes while maintaining data integrity over 15+ years of unattended operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256SAGBHMA10 | Commercial grade (-40°C to +85°C); same package, density, and feature set except temperature rating and screening. | Lacks military qualification testing (MIL-STD-883); not approved for flight-critical or defense prime contracts. | Select when cost sensitivity outweighs environmental robustness requirements and no formal military certification is mandated. |
| MX25L25645GMI-10G | 256 Mb SPI NOR with 104 MHz Quad Read (52 MBps), no DDR support, no AutoBoot, no ASP, commercial temp only. | No hardware ECC, no OTP, limited security model - suitable for consumer IoT but insufficient for DoD or FAA traceability mandates. | Consider only for prototyping or non-certified subsystems where full military feature set is unnecessary and lower cost is prioritized. |
Compared with S25FL256SAGBHMC13, the S25FL256SAGBHMA10 sacrifices military temperature range and screening for cost reduction, while the MX25L25645GMI-10G omits AutoBoot, DDR, ECC, and security features entirely - making neither suitable as a drop-in replacement in certified defense or aerospace applications.
Availability
S25FL256SAGBHMC13 is available at Aetrix Electronics and suitable for avionics boot memory, tactical radio firmware storage, and missile guidance system code storage requiring stable component supply across extended lifecycle programs.
Supply support for S25FL256SAGBHMC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions for industrial and defense markets.
The FL-S family targets military and aerospace applications demanding extended temperature operation, secure firmware storage, and long-term obsolescence mitigation through architecture-consistent migration paths.
FAQ
What is the maximum Quad DDR read speed supported by S25FL256SAGBHMC13?
The device achieves up to 80 MBps Quad DDR read throughput at 80 MHz clock rate with VIO = VCC = 3.0–3.6 V, as confirmed in Table 3 of the official datasheet (002-19099 Rev. *D). This performance assumes optimal PCB layout, proper termination, and host controller support for DDR command sequences.
Does S25FL256SAGBHMC13 support both 24-bit and 32-bit addressing modes?
Yes - it supports extended addressing with selectable 24-bit or 32-bit address space, enabling full utilization of its 256 Mb capacity and compatibility with legacy 24-bit systems via address truncation or aliasing, as documented in Section 3.5 of the datasheet.
How is hardware write protection implemented on this device?
Hardware write protection uses dedicated WP# and HOLD# pins, with additional software-controlled sector locking via Status Register bits and Advanced Sector Protection (ASP) using OTP-stored passwords or boot code validation - providing layered protection against accidental or malicious reprogramming.
Is S25FL256SAGBHMC13 pin-compatible with earlier S25FL-P series devices?
Yes - it maintains identical FAB024 24-ball BGA pinout and SPI command set compatibility with S25FL-P devices, including shared instruction opcodes and timing parameters, enabling direct PCB-level replacement in existing designs with firmware minor updates for new features like DDR or ASP.
S25FL256SAGBHMC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 750µs
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL256SAGBHMC13 FAQ
1.How can I place an order for S25FL256SAGBHMC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256SAGBHMC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256SAGBHMC13 reliable?
The price and inventory of S25FL256SAGBHMC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256SAGBHMC13 is usually 5 days.
3.What payment methods are accepted for S25FL256SAGBHMC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256SAGBHMC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL256SAGBHMC13?
S25FL256SAGBHMC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL256SAGBHMC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256SAGBHMC13?
For technical support, including S25FL256SAGBHMC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256SAGBHMC13 requirements.
6.How does Aetrix verify that S25FL256SAGBHMC13 is sourced from the original manufacturer or authorized distributors?
All S25FL256SAGBHMC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256SAGBHMC13 meets industry standards.
7.What is the process for return or replacement of S25FL256SAGBHMC13?
All S25FL256SAGBHMC13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256SAGBHMC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256SAGBHMC13 part is unused and in its original packaging.
Return procedure for S25FL256SAGBHMC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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