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Infineon Technologies S25FL256SAGMFB013

Part No.:
S25FL256SAGMFB013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixS25FL256SAGMFB013.pdf
Description:
IC FLASH 256MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,643

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Product details

Overview

S25FL256SAGMFB013 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability military applications requiring extended temperature operation (-55°C to +125°C), hardware ECC, and dual/quad/DDR read modes. It features 65-nm MIRRORBIT™ Eclipse architecture, hybrid or uniform sector erase options (4 KB / 64 KB / 256 KB), and supports AutoBoot at power-up from preselected address.

For engineers reviewing the S25FL256SAGMFB013 datasheet, S25FL256SAGMFB013 pinout, S25FL256SAGMFB013 application, or S25FL256SAGMFB013 equivalent, key selection criteria include military-grade temperature range, Quad DDR read throughput up to 80 MBps, OTP security array (1024 bytes), programmable block protection, and compatibility with S25FL-P family footprints.

Technical Context

This device implements a SPI-MIO interface supporting standard SPI clock modes 0 and 3, plus DDR command execution with dedicated latency cycles. It integrates on-die ECC logic that automatically corrects single-bit errors during read and verifies integrity during program/erase.

The memory array uses hybrid sector architecture-32 physical 4-KB sectors at top/bottom of address space and remaining 64-KB sectors-or uniform 256-KB logical blocks, enabling software migration from legacy S25FL devices while maintaining backward compatibility in boot code and sector protection schemes.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mb (32 MB) serial NOR flash with 32-bit addressing support
Read Throughput Up to 80 MBps via Quad DDR mode at 80 MHz (VIO = VCC = 3.0–3.6 V)
Erase Architecture Hybrid: thirty-two 4-KB sectors + remainder 64-KB sectors; or uniform 256-KB blocks
Endurance & Retention 100 program-erase cycles; >20 years data retention at max operating temperature
Supply Voltages VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - enables mixed-voltage system interfacing
Temperature Grade Military: -55°C to +125°C ambient, qualified per MIL-STD-883
Security Features 1024-byte OTP array; hardware/software block protection; Advanced Sector Protection (ASP)

Pinout & Package

Package: 24-ball FBGA (FAB024), 5 mm × 5 mm, 0.8 mm pitch, Pb-free.

Pin/Terminal Circuit Role Design Meaning
CS# Chip Select Active-low enable for command/address/data transfer; supports daisy-chain configuration
SCK Serial Clock Input clock for SDR/DDR modes; phase/polarity configurable per SPI mode 0/3
IO0 (SI) Serial Input / Data Line 0 Primary input for commands/addresses; also functions as QPP/QOR data line in quad mode
IO1 (SO) Serial Output / Data Line 1 Primary output for read data; bidirectional in DDR/dual/quad protocols
IO2 (WP#) Write Protect / Data Line 2 Hardware write-protection enable; also serves as third I/O in multi-I/O commands
IO3 (HOLD#) Hold / Data Line 3 Pauses ongoing serial transfer without deselecting device; fourth I/O in quad mode
VCC Core Supply 2.7–3.6 V core voltage for memory array and logic; independent of I/O supply
VIO I/O Supply 1.65–3.6 V flexible I/O voltage allows interfacing with 1.8 V or 3.3 V controllers
VSS Ground Dedicated supply and signal ground; decoupling required per layout guidelines

Key Features

Feature Design Value
AutoBoot Execution Executes Normal or Quad Read automatically at power-up/reset from user-configurable address - eliminates external boot controller dependency
Hardware ECC Engine On-the-fly single-bit error correction with no software overhead; ECC metadata stored internally and transparent to host
Quad Input Page Programming (QPP) Enables full 512-byte page writes using all four I/O lines simultaneously - reduces programming time by ~4× vs. single-line mode
Common Flash Interface (CFI) Standardized JEDEC-compliant query table provides runtime identification of geometry, timing, and feature set - simplifies driver portability
Advanced Sector Protection (ASP) Password- or boot-code-controlled individual sector locking - prevents unauthorized firmware overwrite in field-deployed systems

Applications

Aerospace Avionics Boot Storage Military Radar Signal Processing

Use Scenario: Storing FPGA configuration bitstreams and real-time DSP firmware in airborne radar subsystems subject to extreme thermal cycling.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AutoBoot and CFI support for deterministic initialization sequence.

Use Value: Hybrid sector architecture preserves legacy 4-KB boot loader compatibility while enabling faster 256-KB updates for algorithm patches.

Use Scenario: Holding calibrated lookup tables and adaptive filtering coefficients in active electronically scanned array (AESA) radar front-ends.

IC Role / Device Role / Timing Role: High-speed read-access memory supporting DDR Quad reads at 80 MBps for low-latency coefficient streaming.

Use Value: Uniform 256-KB erase blocks allow atomic update of entire calibration sets without partial-sector corruption risk.

Tactical Radio Secure Firmware Guided Munition Mission Logic

Use Scenario: Securing encrypted radio stack binaries and cryptographic keys in manpack and vehicular radios operating in contested EM environments.

IC Role / Device Role / Timing Role: Trusted storage with OTP-based root-of-trust and ASP-enforced sector lockdown.

Use Value: 1024-byte OTP stores immutable public keys; ASP prevents runtime tampering with secure boot partition.

Use Scenario: Storing mission-critical guidance algorithms and sensor fusion parameters in GPS-denied munitions with extended shelf life.

IC Role / Device Role / Timing Role: Long-retention, radiation-tolerant nonvolatile memory qualified for 20+ year storage at +125°C.

Use Value: >20-year data retention and -55°C to +125°C operation ensure firmware integrity across decades of stockpile storage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
MX25L25673EMI-10G 256 Mb, 104 MHz Quad SPI, commercial temp (-40°C to +85°C), no DDR or AutoBoot Lacks military temperature rating, ECC, and DDR read capability - unsuitable for avionics or radar Select only for cost-sensitive industrial control where extended temp and security are not required
S25FL256SAGNFB010 Same die, identical specs, but in WSON-8 (6 × 8 mm) package instead of FBGA-24 Same functionality and timing; differs only in mechanical footprint and thermal profile Choose based on PCB layout constraints and thermal management requirements - no electrical or functional trade-off

Compared with MX25L25673EMI-10G, S25FL256SAGMFB013 delivers military-grade reliability, hardware ECC, and DDR throughput - critical for safety-critical systems; versus S25FL256SAGNFB010, it offers identical functionality in a smaller-area FBGA package optimized for high-density embedded modules.

Availability

S25FL256SAGMFB013 is available at Aetrix Electronics and suitable for aerospace avionics boot storage, military radar signal processing, and tactical radio secure firmware requiring stable component supply across extended temperature and long lifecycle programs.

Supply support for S25FL256SAGMFB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions for industrial and defense markets.

This part belongs to the FL-S family of SPI Multi-I/O NOR flash devices, engineered specifically for military, aerospace, and critical infrastructure applications demanding extended temperature operation, data integrity, and secure firmware storage.

FAQ

Does S25FL256SAGMFB013 support both 24-bit and 32-bit addressing?

Yes. The device supports extended addressing modes: 24-bit addressing for legacy compatibility (up to 16 MB) and 32-bit addressing for full 32 MB access. Address mode is selected via Configuration Register bit CR3[1], and the default after reset is 32-bit mode when the device detects a 32-bit command sequence.

What is the purpose of the VIO pin, and can it be tied to VCC?

VIO sets the I/O buffer voltage level independently from VCC, enabling interoperability with 1.8 V or 3.3 V host controllers. It may be tied to VCC only if the host operates at the same voltage and timing margins permit - otherwise, separate regulation is required to meet AC timing specs, especially for DDR modes above 66 MHz.

How does AutoBoot function, and can the boot address be changed in-system?

AutoBoot executes a preconfigured Normal or Quad Read command at power-up or hardware reset from an address stored in the One-Time Programmable (OTP) register. This address is programmable once during manufacturing or initial provisioning using the Write Security Register command; it cannot be altered in the field without reprogramming OTP, which is irreversible.

Is the 1024-byte OTP array accessible after factory programming?

Yes - the OTP array remains readable throughout the device's lifetime and supports one-time programming of up to 1024 bytes. Once a bit is programmed from '1' to '0', it cannot be reverted. Reads are unrestricted; writes require issuing the proper Write Enable and Write Security Register commands, and are disabled after OTP lock bits are set.

S25FL256SAGMFB013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
256Mbit
Memory Organization:
32M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
750µs
Access Time:
6.5 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

S25FL256SAGMFB013 FAQ

1.How can I place an order for S25FL256SAGMFB013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL256SAGMFB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL256SAGMFB013 reliable?

The price and inventory of S25FL256SAGMFB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256SAGMFB013 is usually 5 days.

3.What payment methods are accepted for S25FL256SAGMFB013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256SAGMFB013 transactions.

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4.How is shipping managed for S25FL256SAGMFB013?

S25FL256SAGMFB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL256SAGMFB013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL256SAGMFB013?

For technical support, including S25FL256SAGMFB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256SAGMFB013 requirements.

6.How does Aetrix verify that S25FL256SAGMFB013 is sourced from the original manufacturer or authorized distributors?

All S25FL256SAGMFB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256SAGMFB013 meets industry standards.

7.What is the process for return or replacement of S25FL256SAGMFB013?

All S25FL256SAGMFB013 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256SAGMFB013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL256SAGMFB013 part is unused and in its original packaging.

Return procedure for S25FL256SAGMFB013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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