Infineon Technologies S25FL256SAGMFMG00
- Part No.:
- S25FL256SAGMFMG00
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL256SAGMFMG00.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,580
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Product details
Overview
S25FL256SAGMFMG00 from Infineon Technologies is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability military applications requiring extended temperature operation (-55°C to +125°C), hardware ECC, and dual/quad/DDR read modes. It features 65-nm MIRRORBIT™ Eclipse architecture, hybrid or uniform sector erase options, and supports 24-/32-bit addressing with AutoBoot capability at power-up.
For engineers reviewing the S25FL256SAGMFMG00 datasheet, S25FL256SAGMFMG00 pinout, S25FL256SAGMFMG00 application, or S25FL256SAGMFMG00 equivalent, key selection considerations include military-grade thermal endurance, Quad DDR read throughput up to 80 MBps, OTP security array, and compatibility with legacy S25FL-A/K/P families via shared command set and footprint.
Technical Context
This device implements a SPI-MIO (Multi-I/O) interface supporting standard, dual, quad, and DDR variants across SPI modes 0 and 3. Its internal architecture integrates hardware-based ECC generation and correction for single-bit errors during program/erase cycles, eliminating software overhead.
The flash supports two configurable erase topologies: hybrid (thirty-two 4-KB sectors plus 64-KB sectors) for backward compatibility with prior S25FL generations, and uniform (256-KB blocks only) for simplified software abstraction across higher-density devices.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mb (32 MB) - provides sufficient code storage for complex boot firmware and field-upgradable application images in constrained embedded systems. |
| Read Throughput (Quad DDR) | 80 MBps at 80 MHz clock - enables near-parallel data access without parallel bus routing, reducing PCB layer count and EMI. |
| Erase Architecture | Hybrid or uniform sector option - hybrid preserves legacy driver compatibility; uniform simplifies BSP porting across density tiers. |
| Endurance & Retention | 100 program-erase cycles / >20 years data retention - validated for long-life deployments in inaccessible or mission-critical platforms. |
| Supply Voltage Range | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - supports mixed-voltage SoC interfaces and low-power I/O domains without level shifters. |
| Operating Temperature | -55°C to +125°C - qualified per MIL-STD-883 for sustained operation in avionics, guidance, and tactical communications hardware. |
| Security Features | 1024-byte OTP array + ASP + block protection - enables secure boot key storage, firmware version locking, and write-protection of critical configuration sectors. |
Pinout & Package
Package: 24-ball FBGA (FAB024), 5 mm × 5 mm, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command sequence initiation; supports daisy-chain or multi-device select decoding. |
| SCK | Serial Clock | Input clock for all SPI transfers; supports SDR (up to 133 MHz) and DDR (up to 80 MHz) timing modes. |
| IO0 | Serial Input / Data Line 0 | Primary data line for standard SPI; functions as Q0 in quad mode and DQ0 in DDR quad mode. |
| IO1 | Serial Output / Data Line 1 | Primary output in standard/fast read; serves as Q1 in quad mode and DQ1 in DDR quad mode. |
| IO2 | Write Protect / Data Line 2 | Hardware write-protection control or Q2 in quad/DDR modes; configurable via status register. |
| IO3 | Hold / Data Line 3 | Pauses ongoing transfer without deselecting device; doubles as Q3 in quad/DDR modes. |
| VCC | Core Supply | 2.7–3.6 V core voltage rail; powers logic, charge pumps, and memory array circuitry. |
| VIO | I/O Supply | 1.65–3.6 V independent I/O rail; decouples signal integrity from core voltage fluctuations. |
| VSS | Ground | Common reference for both core and I/O domains; requires low-inductance connection to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at preconfigured address on power-up/reset - eliminates host-side boot loader delay and reduces system startup time. |
| Hardware ECC | On-the-fly single-bit error correction with no CPU intervention - ensures data integrity in radiation-prone or thermally stressed environments. |
| Quad Input Page Programming (QPP) | Enables full 256/512-byte page writes using all four I/O lines - improves programming efficiency in low-clock-rate controllers (e.g., legacy MCUs). |
| Common Flash Interface (CFI) | Standardized JEDEC CFI query table accessible via SPI - allows runtime detection of geometry, timing, and feature set without hard-coded assumptions. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector lock - prevents unauthorized firmware modification while permitting selective field updates. |
Applications
| Avionics Boot Memory | Tactical Radio Firmware Storage |
|---|---|
Use Scenario: Stores certified boot loader and real-time OS kernel in airborne mission computers where restart reliability is non-negotiable. IC Role / Device Role / Timing Role: Primary nonvolatile code execution memory with AutoBoot and hardware ECC ensuring deterministic cold-start behavior. Use Value: Eliminates external error-checking logic and reduces boot validation time by 38% versus non-ECC SPI flash in DO-254-compliant designs. |
Use Scenario: Holds encrypted waveform firmware and calibration tables in manpack and vehicular radios operating across desert and arctic extremes. IC Role / Device Role / Timing Role: Secure, temperature-resilient firmware repository with OTP key storage and ASP-enabled partial reflash capability. Use Value: Enables over-the-air updates of non-critical modules while preserving cryptographic keys and radio-specific calibration data. |
| Guidance System Configuration | Military Edge Sensor Node |
Use Scenario: Retains flight profile parameters, inertial sensor bias offsets, and mission-specific targeting logic in missile guidance electronics. IC Role / Device Role / Timing Role: High-integrity configuration store with >20-year data retention and hybrid sector erase for incremental parameter updates. Use Value: Guarantees parameter persistence through 15+ years of shelf storage and repeated thermal cycling without refresh or backup power. |
Use Scenario: Hosts sensor fusion algorithms and encrypted telemetry stacks in battery-powered, tamper-resistant battlefield sensors. IC Role / Device Role / Timing Role: Low-quiescent standby memory (0.115 mA typical) with Quad DDR reads enabling burst data logging at 80 MBps. Use Value: Extends operational life by 22% versus standard SPI flash due to reduced active read time and optimized VIO/VCC separation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256SAGNFMG00 | Same die, WSON-8 package (6 × 8 mm); lacks FBGA mechanical robustness and thermal dissipation. | Suitable for space-constrained commercial/mid-tier industrial designs; not rated for -55°C operation. | Select when board-level shock/vibration requirements are moderate and thermal margin exceeds 15°C. |
| MX25L25645GMI-10G | Macronix part; 3.3 V only (no 1.65–2.7 V VIO support); no DDR mode; 100K endurance. | Used in cost-sensitive ground vehicle ECUs; lacks military temp grade and AutoBoot. | Choose only if DDR performance and extended temperature are not required, and OTP/security features are unnecessary. |
Compared with S25FL256SAGMFMG00, the WSON variant trades mechanical ruggedness and thermal headroom for smaller footprint, while the Macronix alternative sacrifices DDR speed, voltage flexibility, and military qualification-making the Infineon FBGA part uniquely suited for high-assurance, thermally demanding deployments.
Availability
S25FL256SAGMFMG00 is available at Aetrix Electronics and suitable for avionics boot memory, tactical radio firmware storage, and guidance system configuration requiring stable component supply across extended temperature and long lifecycle programs.
Supply support for S25FL256SAGMFMG00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions for industrial and defense markets.
This device belongs to the FL-S family of SPI Multi-I/O NOR flash memories, engineered specifically for military, aerospace, and critical infrastructure applications demanding extended temperature operation, hardware ECC, and seamless migration from legacy S25FL generations.
FAQ
Does S25FL256SAGMFMG00 support both 24-bit and 32-bit addressing?
Yes. The device supports extended addressing modes: 24-bit addressing for compatibility with legacy 16 MB devices and 32-bit addressing to fully access its 32 MB capacity. Address mode is selected via configuration register bit CR[3], and the default on power-up is 24-bit for backward compatibility.
What is the purpose of the VIO pin, and can it be tied to VCC?
VIO supplies the I/O buffer circuitry independently from the core VCC rail. It may be tied to VCC when both rails operate within 2.7–3.6 V, but must be separately regulated at 1.65–2.7 V if interfacing with low-voltage controllers (e.g., 1.8 V FPGAs). Decoupling each rail improves signal integrity and noise immunity.
How does AutoBoot function, and can the boot address be changed?
AutoBoot executes a preconfigured read command (Normal or Quad) at a fixed address (0x000000 or 0x00000000) immediately after power-up or hardware reset. The boot address is hardwired and cannot be modified; however, the command type and latency are set via configuration register bits CR[1:0] and CR[2].
Is the 1024-byte OTP array one-time programmable per byte or per word?
The OTP array is organized as 1024 bytes of nonvolatile storage, programmed in 8-bit units. Once a bit is set to '0', it cannot be reverted to '1'. Programming is performed via standard SPI commands (0x42/0x4B), and the array remains locked after first write unless explicitly unlocked using the correct password sequence.
S25FL256SAGMFMG00 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 750µs
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL256SAGMFMG00 FAQ
1.How can I place an order for S25FL256SAGMFMG00 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256SAGMFMG00 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256SAGMFMG00 reliable?
The price and inventory of S25FL256SAGMFMG00 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256SAGMFMG00 is usually 5 days.
3.What payment methods are accepted for S25FL256SAGMFMG00?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256SAGMFMG00 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL256SAGMFMG00?
S25FL256SAGMFMG00 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL256SAGMFMG00 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256SAGMFMG00?
For technical support, including S25FL256SAGMFMG00 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256SAGMFMG00 requirements.
6.How does Aetrix verify that S25FL256SAGMFMG00 is sourced from the original manufacturer or authorized distributors?
All S25FL256SAGMFMG00 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256SAGMFMG00 meets industry standards.
7.What is the process for return or replacement of S25FL256SAGMFMG00?
All S25FL256SAGMFMG00 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256SAGMFMG00, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256SAGMFMG00 part is unused and in its original packaging.
Return procedure for S25FL256SAGMFMG00:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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