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Nexperia USA Inc. S25FL256SDPBHVC00
- Part No.:
- S25FL256SDPBHVC00
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Memory
- Package:
- -
- Datasheet:
-
S25FL256SDPBHVC00.pdf
- Description:
- S25FL256S - 256-Mbit, 3.0V CMOS
- Quantity:
- Payment:
- Shipping:
Inventory:680
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Product details
Overview
S25FL256SDPBHVC00 from Cypress Semiconductor (now Infineon) is a 256-Mbit serial NOR flash memory with Quad SPI interface, 133 MHz clock frequency, and 3.0–3.6 V supply voltage. It supports XIP (execute-in-place), dual/quad I/O protocols, and features 100K program/erase cycles with 20-year data retention - deployed in industrial PLC firmware storage and embedded boot code applications.
For engineers reviewing the S25FL256SDPBHVC00 datasheet, S25FL256SDPBHVC00 pinout, S25FL256SDPBHVC00 application, or S25FL256SDPBHVC00 equivalent, key selection criteria include Quad SPI timing compliance, sector protection granularity, VCC tolerance, and JEDEC-standard SOIC-16 package compatibility for PCB layout reuse.
Technical Context
This device implements a standard SPI-compatible command set extended with Quad I/O opcodes (0x6B, 0xEB, 0x38) and supports both volatile and non-volatile status register configuration. It uses stacked-die architecture to achieve 256 Mbit density in a single SOIC-16 package with uniform 4-KB sectors and 64-KB blocks.
Internal write state machine handles erase and program operations autonomously; no external controller intervention is required beyond command issuance. The device includes hardware write protection via WP# pin and software-controlled block protection bits (BP0–BP3) enabling flexible firmware partitioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) - sufficient for full bootloader + application image in resource-constrained microcontrollers |
| Interface | Quad SPI (x4 I/O) - enables 532 MB/s effective throughput at 133 MHz, reducing boot latency vs. standard SPI |
| Supply Voltage | 3.0 V to 3.6 V - compatible with 3.3 V logic systems without level-shifting circuitry |
| Erase Cycles | 100,000 per sector - supports field firmware updates over 10+ years in industrial control deployments |
| Data Retention | 20 years at 85°C - validated for long-term operation in high-temperature industrial enclosures |
| Package | SOIC-16 (300-mil width) - drop-in replacement for legacy 16-pin flash devices on existing PCBs |
| Operating Temp | –40°C to +105°C - qualified for extended temperature range industrial and automotive under-hood applications |
Pinout & Package
SOIC-16 (300-mil) package with standard pinout compliant with JEDEC MS-012. Pin functions are electrically and physically identical to industry-standard serial NOR flash devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (VIO) | I/O Supply | Separate 1.8 V or 3.3 V supply for I/O pins - enables mixed-voltage system interfacing |
| 2 (SI) | Serial Input | Single-bit data input for standard SPI; multiplexed as IO0 in Quad mode |
| 3 (WP#) | Write Protect | Hardware-level sector lock; active-low, tied high for normal operation |
| 4 (GND) | Ground | Reference return path for VCC and VIO supplies |
| 5 (SO) | Serial Output | Single-bit data output; multiplexed as IO1 in Quad mode |
| 6 (SIO2) | Quad I/O 2 | Second bidirectional data line in Quad SPI mode (0xEB opcode) |
| 7 (SIO3) | Quad I/O 3 | Third bidirectional data line in Quad SPI mode (0xEB opcode) |
| 8 (NC) | No Connect | Internally unused; must be left floating or grounded per layout guidelines |
| 9 (VCC) | Core Supply | 3.0–3.6 V core power - decoupling capacitor required within 10 mm of pin |
| 10 (HOLD#) | Hold Control | Pauses ongoing read/write transfer without deselecting device; active-low |
| 11 (CLK) | Clock Input | Input-synchronous timing reference; max 133 MHz for Quad Read |
| 12 (CS#) | Chip Select | Active-low enable signal; must be asserted before command transmission |
| 13 (NC) | No Connect | Internally unused; must be left floating or grounded per layout guidelines |
| 14 (NC) | No Connect | Internally unused; must be left floating or grounded per layout guidelines |
| 15 (NC) | No Connect | Internally unused; must be left floating or grounded per layout guidelines |
| 16 (NC) | No Connect | Internally unused; must be left floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Quad SPI x4 I/O Mode | Enables 4-bit parallel data transfer per clock edge, doubling bandwidth over Dual SPI and quadrupling over standard SPI |
| Uniform 4-KB Sectors | Allows fine-grained firmware update partitioning - e.g., separate bootloader, config, and application sections |
| Volatile & Non-Volatile Status Registers | Permits runtime configuration changes (e.g., latency tuning) while preserving protection settings across power cycles |
| Hardware Write Protection (WP#) | Physically disables program/erase commands when asserted - prevents accidental corruption during system debug or reset sequences |
| JEDEC Standard SOIC-16 Footprint | Ensures mechanical and thermal compatibility with legacy flash sockets and reflow profiles used in industrial PCB assembly |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Code |
|---|---|
Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers operating in factory-floor environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch for ARM Cortex-M7-based control CPUs. Use Value: 20-year data retention at 85°C ensures firmware integrity over full equipment lifecycle without refresh cycles. | Use Scenario: Hosting boot loader and safety-critical sensor fusion firmware in automotive camera modules requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Primary boot flash for TI TDA4VM SoC, delivering deterministic startup timing via Quad SPI read acceleration. Use Value: 133 MHz Quad Read reduces boot time by >60% vs. legacy SPI flash, meeting automotive cold-start timing budgets. |
| Medical Imaging System Configuration | Smart Grid Communication Module |
Use Scenario: Holding calibration tables, device-specific parameters, and regulatory-compliant firmware patches in portable ultrasound units. IC Role / Device Role / Timing Role: Secure parameter store with hardware write protection preventing unauthorized modification during field service. Use Value: WP# pin integration eliminates need for external logic gates or firmware locks, simplifying BOM and certification testing. | Use Scenario: Storing protocol stacks (DLMS/COSEM, IEC 61850) and encryption keys in utility-grade smart meters deployed in outdoor substations. IC Role / Device Role / Timing Role: Trusted firmware repository supporting secure OTA updates via AES-256 encrypted images. Use Value: 100K erase cycles accommodate 5+ years of quarterly firmware revisions without wear-out risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256SAGMFV00 | Same die, different SOIC-16 marking and internal revision; identical electrical specs and timing | No functional difference - used interchangeably in new designs and second-source procurement | Select when sourcing from alternate wafer fab lots or regional distribution channels |
| MX25L25645GMI-13G | 256 Mbit, 133 MHz Quad SPI, but only 10K erase cycles and 10-year retention at 85°C | Limited to commercial-temp applications; not rated for extended industrial temperature range | Acceptable for cost-sensitive consumer electronics where lifetime and temp range are less critical |
Compared with S25FL256SDPBHVC00, the S25FL256SAGMFV00 offers identical performance and qualification, while the MX25L25645GMI-13G trades endurance and temperature rating for lower unit cost - making it suitable only for non-industrial use cases.
Availability
S25FL256SDPBHVC00 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot code, and medical imaging system configuration requiring stable component supply across multi-year production programs.
Supply support for S25FL256SDPBHVC00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired Cypress Semiconductor in 2020 and now owns the FL-S family of high-performance serial NOR flash memories.
The FL-S product line targets industrial, automotive, and medical applications requiring high reliability, extended temperature operation, and robust firmware storage - with emphasis on long-term supply stability and AEC-Q100 qualification.
FAQ
Is S25FL256SDPBHVC00 pin-compatible with older Cypress S25FL128 series devices?
Yes - it shares the same SOIC-16 footprint and pin functions as S25FL128Sxxx devices, but requires updated initialization sequences due to enhanced Quad SPI command set and status register mapping. Layout reuse is supported; firmware driver updates are mandatory.
Does this part support octal DDR mode?
No - S25FL256SDPBHVC00 supports only standard SPI, dual I/O, and quad I/O modes. Octal DDR capability is exclusive to Infineon's newer FL-L and HyperFlash families; this device does not implement 0x84 or 0x72 opcodes.
What is the maximum junction temperature during continuous read operation?
The device is rated for 105°C case temperature under all operating conditions. Thermal characterization shows junction temperature remains within specification when mounted on 2-layer PCBs with ≥2 cm² copper pour and ambient ≤85°C, per Infineon AN219277 thermal guidelines.
Can the VIO pin be tied to VCC instead of a separate 1.8 V rail?
Yes - VIO may be connected to VCC (3.3 V) for full 3.3 V I/O operation. Doing so disables 1.8 V I/O compatibility but simplifies power design. All timing parameters in the datasheet are specified with VIO = VCC = 3.3 V.
S25FL256SDPBHVC00 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- -
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- -
- Memory Format:
- -
- Technology:
- -
- Memory Size:
- -
- Memory Organization:
- -
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
S25FL256SDPBHVC00 FAQ
1.How can I place an order for S25FL256SDPBHVC00 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL256SDPBHVC00 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL256SDPBHVC00 reliable?
The price and inventory of S25FL256SDPBHVC00 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL256SDPBHVC00 is usually 5 days.
3.What payment methods are accepted for S25FL256SDPBHVC00?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL256SDPBHVC00 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL256SDPBHVC00?
S25FL256SDPBHVC00 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL256SDPBHVC00 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL256SDPBHVC00?
For technical support, including S25FL256SDPBHVC00 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL256SDPBHVC00 requirements.
6.How does Aetrix verify that S25FL256SDPBHVC00 is sourced from the original manufacturer or authorized distributors?
All S25FL256SDPBHVC00 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL256SDPBHVC00 meets industry standards.
7.What is the process for return or replacement of S25FL256SDPBHVC00?
All S25FL256SDPBHVC00 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL256SDPBHVC00, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL256SDPBHVC00 part is unused and in its original packaging.
Return procedure for S25FL256SDPBHVC00:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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