Infineon Technologies S25FL512SAGBHAC10
- Part No.:
- S25FL512SAGBHAC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHAC10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,288
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Product details
Overview
S25FL512SAGBHAC10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC for single-bit error correction. It supports AutoBoot, CFI, and DDR read modes, and is qualified for industrial temperature range (–40°C to +85°C) in SO16 package.
For engineers reviewing the S25FL512SAGBHAC10 datasheet, S25FL512SAGBHAC10 pinout, S25FL512SAGBHAC10 application, or S25FL512SAGBHAC10 equivalent, key selection factors include Quad/DDR read bandwidth, 100K program-erase cycles, OTP security, sector protection granularity, and SOIC-16 footprint compatibility with legacy S25FL-A/K/P families.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density NOR flash with deterministic latency and robust data integrity. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible host interface integration across mixed-signal SoCs and microcontrollers.
The command set fully complies with JEDEC JESD216 SFDP v1.6 and Common Flash Interface (CFI), allowing automatic configuration discovery and seamless firmware update stack integration. Sector erase is uniform at 256 KB, and page programming uses a 512-byte buffer with Quad-Input Page Programming (QPP) support for low-clock-rate systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images, boot code, and parameter storage in resource-constrained embedded systems |
| Read Bandwidth (Quad) | 52 MBps at 104 MHz - enables fast XIP (execute-in-place) execution without external RAM buffering |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and avoids fragmentation in OTA update partitions |
| Endurance | 100,000 program-erase cycles - supports frequent field firmware updates over product lifetime |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage for industrial logging or calibration data |
| ECC | On-die hardware single-bit error correction - eliminates need for external ECC logic or software overhead |
| Temperature Range | –40°C to +85°C (Industrial) - validated for operation in factory automation, networking, and edge compute environments |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, standard JEDEC MS-012AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command/address/data transfer; supports daisy-chaining with multiple devices |
| SCK | Serial Clock Input | Edge-triggered clock for synchronous SPI communication; supports modes 0 and 3, up to 133 MHz SDR or 80 MHz DDR |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| WP# / IO2 | Write Protect Input / I/O2 | Hardware lock for status register and sector protection; doubles as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing transaction without deselecting chip; doubles as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required per datasheet layout guidelines |
| VIO | I/O Supply | 1.65–3.6 V independent I/O voltage - enables interfacing with 1.8 V or 3.3 V controllers without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Function | Automatically executes Normal or Quad Read at power-up/reset from preconfigured address - reduces boot loader complexity and startup latency |
| OTP Array | 1024-byte one-time-programmable region - stores immutable keys, calibration constants, or device-specific identifiers |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enables fine-grained firmware partitioning and secure OTA staging |
| Extended Addressing | 32-bit addressing support - unlocks full 512 Mb address space without bank switching or address remapping |
| Footprint Compatibility | Pins and command set compatible with S25FL-A/K/P families - allows drop-in replacement and design reuse across generations |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware and configuration tables in programmable logic controllers with periodic field updates. IC Role / Device Role / Timing Role: Primary nonvolatile boot and application code storage with deterministic Quad Read access for jitter-sensitive motion control loops. Use Value: 52 MBps Quad Read and 256-KB uniform erase enable fast, atomic firmware swaps without runtime interruption. | Use Scenario: Holding boot code and safety-critical sensor fusion algorithms in camera/radar ECUs requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP-based cryptographic key storage and ASP-protected update partitions. Use Value: 20-year data retention and 100K endurance ensure functional safety compliance over vehicle lifetime under thermal cycling. |
| Networking Equipment Configuration | Medical Imaging System Parameter Storage |
Use Scenario: Persisting switch/router configuration profiles, MAC tables, and TLS certificates in enterprise-grade network infrastructure. IC Role / Device Role / Timing Role: Trusted configuration store with hardware write protection and CFI/SFDP auto-discovery for plug-and-play firmware management. Use Value: Block protection and OTP prevent unauthorized configuration tampering; Quad Read accelerates config reload after failover. | Use Scenario: Archiving calibrated sensor offsets, gamma correction LUTs, and DICOM metadata in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-integrity parameter archive with ECC and 20-year retention - critical for regulatory traceability and diagnostic repeatability. Use Value: On-die ECC eliminates soft errors in stored calibration data; uniform sector erase simplifies field recalibration workflows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFA10 | Same die, FBGA-24 (FAB024) package instead of SO16; identical electrical specs and command set | Used where board space is constrained and BGA assembly capability exists | Select when footprint miniaturization outweighs through-hole or rework requirements |
| Winbond W25Q512JVFIQ | 512 Mb SPI NOR, but lacks AutoBoot, ASP, and on-die ECC; different SFDP structure and sector map | Lower-cost option for non-safety-critical consumer applications without advanced protection needs | Choose only if OTP, sector-level password protection, and hardware ECC are not required |
Compared with S25FL512SAGBHAC10, the S25FL512SAGNFA10 offers identical functionality in a smaller BGA package, while the W25Q512JVFIQ trades security and reliability features for cost-making it unsuitable for industrial or automotive firmware storage where data integrity is mandatory.
Availability
S25FL512SAGBHAC10 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, networking equipment, and medical imaging systems requiring stable component supply, long-lifecycle support, and guaranteed Pb-free manufacturing.
Supply support for S25FL512SAGBHAC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT markets.
The FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life serial NOR flash - optimized for firmware storage, boot code execution, and mission-critical parameter retention.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SAGBHAC10 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively when VIO = VCC = 3.0–3.6 V. DDR timing requires strict PCB layout adherence to setup/hold margins specified in Section 5.5 of the datasheet.
Does this part support hardware write protection independent of software commands?
Yes - the WP# pin provides hardware-based write protection for status registers and sector protection bits. When asserted low, it prevents all program and erase operations regardless of software command sequence, offering fail-safe protection against accidental or malicious firmware corruption.
Is the SO16 package RoHS-compliant and lead-free?
Yes - the S25FL512SAGBHAC10 uses a Pb-free, RoHS-compliant SOIC-16 package (JEDEC MS-012AC), with matte tin finish on leads and no lead content in die attach, mold compound, or plating layers, meeting EU Directive 2011/65/EU and IPC-J-STD-609A Class 1 standards.
How does AutoBoot simplify system initialization?
AutoBoot executes a preconfigured Normal or Quad Read command automatically at power-up or reset, fetching boot code directly from a user-defined start address. This eliminates the need for external boot ROM or complex bootloader handshaking, reducing BOM count and shortening cold-start time by up to 15 ms in typical implementations.
S25FL512SAGBHAC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHAC10 FAQ
1.How can I place an order for S25FL512SAGBHAC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHAC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHAC10 reliable?
The price and inventory of S25FL512SAGBHAC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHAC10 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHAC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHAC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHAC10?
S25FL512SAGBHAC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHAC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHAC10?
For technical support, including S25FL512SAGBHAC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHAC10 requirements.
6.How does Aetrix verify that S25FL512SAGBHAC10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHAC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHAC10 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHAC10?
All S25FL512SAGBHAC10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHAC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHAC10 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHAC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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