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Infineon Technologies S25FL512SAGBHB210

Part No.:
S25FL512SAGBHB210
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL512SAGBHB210.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,045

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Product details

Overview

S25FL512SAGBHB210 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and uniform 256-KB sector architecture. It supports Quad Read up to 52 MBps, AutoBoot at power-up, hardware/software block protection, and internal ECC for single-bit error correction. Used in industrial control firmware storage where high reliability, fast boot, and long-term data retention are required.

For engineers reviewing the S25FL512SAGBHB210 datasheet, S25FL512SAGBHB210 pinout, S25FL512SAGBHB210 application, or S25FL512SAGBHB210 equivalent, key selection criteria include Quad DDR read performance (80 MBps), AEC-Q100 Grade 2 qualification (–40°C to +105°C), OTP security array size (1024 bytes), and SO16/FBGA package compatibility with legacy S25FL-P designs.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling simultaneous read-while-write operation and deterministic erase timing across all 256-KB sectors. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible host interface integration without level-shifting.

The command set fully complies with JEDEC JESD216 SFDP v1.6 and Common Flash Interface (CFI), allowing automatic configuration discovery by boot ROMs and runtime drivers. DDR mode requires VIO ≥ 3.0 V and supports Fast/Dual/Quad Read DDR with 80 MHz clock and 80 MBps peak throughput.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - sufficient for full firmware images plus OTA update partitions in resource-constrained embedded systems
Read Speed (Quad)52 MBps at 104 MHz - enables sub-100 ms boot time for 4 MB application code
Erase UnitUniform 256-KB sectors - simplifies wear leveling and avoids partial-sector fragmentation
Endurance100,000 program-erase cycles - supports field firmware updates over 10+ years of industrial deployment
Data Retention20 years minimum at +85°C - meets long-lifecycle requirements for infrastructure and automotive ECUs
Security1024-byte OTP + ASP - allows secure key storage and per-sector password-based write lock independent of status register
Temperature RangeAEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive applications without derating
Voltage RangeVCC: 2.7–3.6 V; VIO: 1.65–3.6 V - interoperable with 1.8 V or 3.3 V microcontrollers without external translators

Pinout & Package

Package: 24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command decoding; must be held low for entire multi-byte transaction
SCKSerial Clock InputDrives all command/address/data transfers; supports modes 0 and 3; DDR mode requires stable edge alignment
IO0 (SI)Serial Input / I/O0Standard input for commands/addresses; becomes bidirectional I/O0 in Dual/Quad mode
IO1 (SO)Serial Output / I/O1Standard output for read data; becomes bidirectional I/O1 in Dual/Quad mode
IO2 (WP#)Write Protect / I/O2Hardware lock for top/bottom sectors when WP# = LOW; also functions as Quad I/O2 in extended mode
IO3 (HOLD#)Hold Input / I/O3Pauses ongoing transfer without deselecting chip; doubles as Quad I/O3 in extended mode
RESET#Hardware Reset InputAsynchronous active-low reset that clears internal state and reinitializes command parser
VCCCore Supply2.7–3.6 V analog/digital core power; decoupling capacitor required within 10 mm of pin
VIOI/O Supply1.65–3.6 V logic-level reference for all I/O pins; independent of VCC for mixed-voltage systems
VSSGroundCommon return path for VCC and VIO; requires low-impedance PCB plane connection

Key Features

FeatureDesign Value
AutoBoot ExecutionExecutes preconfigured Normal or Quad Read at power-up/reset - eliminates host-side boot loader delay and reduces BOM count
Internal ECC EngineHardware-accelerated single-bit error correction on read - no CPU overhead or software driver dependency
Quad-Input Page Programming (QPP)Accepts 512-byte page data via four I/O lines simultaneously - cuts programming time by ~4× vs standard SPI in low-clock-rate MCUs
Advanced Sector Protection (ASP)Password- or boot-code-triggered individual sector lock - prevents unauthorized firmware modification without affecting unprotected sectors
JEDEC SFDP v1.6 ComplianceSelf-describing parameter table accessible via standard command - enables plug-and-play driver initialization without hard-coded timing tables

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing real-time control firmware and configuration parameters in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Primary nonvolatile code storage with deterministic 256-KB sector erase and AutoBoot execution at cold start.

Use Value: 20-year data retention and 100K endurance ensure firmware integrity across 15+ year equipment lifecycles without recalibration or replacement.

Use Scenario: Holding boot code and safety-critical sensor fusion algorithms for camera/radar ECU in Level 2+ ADAS systems.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified boot memory with Quad DDR read (80 MBps) to meet ASIL-B boot timing constraints.

Use Value: Hardware ECC and OTP-secured keys prevent bit-flip corruption and unauthorized firmware injection during vehicle operation.

Medical Imaging System Update PartitionSmart Grid Communication Module

Use Scenario: Hosting field-upgradable diagnostic imaging firmware in portable ultrasound and MRI subsystems requiring regulatory traceability.

IC Role / Device Role / Timing Role: Secure firmware partition with 1024-byte OTP for cryptographic key storage and ASP for per-version sector locking.

Use Value: Enables HIPAA-compliant over-the-air updates while maintaining immutable audit logs in protected sectors.

Use Scenario: Storing protocol stacks (DLMS/COSEM, IEC 61850) and encryption certificates in utility smart meters deployed in outdoor substations.

IC Role / Device Role / Timing Role: Industrial temperature-grade (–40°C to +105°C) flash with uniform sector erase for reliable certificate rotation in wide ambient swings.

Use Value: Eliminates need for external voltage translators due to 1.65–3.6 V VIO range, reducing bill-of-materials in cost-sensitive meter designs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SDSBHI21Same die, identical pinout and command set; differs only in marking and packaging (SO16 vs FBGA)Preferred for through-hole prototyping or legacy board reuse where SO16 footprint is fixedSelect when mechanical compatibility with existing SOIC layout is mandatory and thermal dissipation requirements are lower
Winbond W25Q512JWIM > 256KB sectors512 Mb density but uses 4-KB and 64-KB sector mix; lacks AutoBoot and ASP; supports octal DTR mode instead of DDRSuitable for cost-optimized consumer IoT gateways where boot speed and sector granularity are less criticalChoose only if DDR read bandwidth is unnecessary and OTP security is not required for certification compliance

Compared with S25FL512SAGBHB210, the SO16 alternative offers identical functionality in legacy-compatible packaging, while the Winbond part trades advanced security and deterministic erase for lower unit cost and octal interface flexibility - making it unsuitable for AEC-Q100 or IEC 62443-certified deployments.

Availability

S25FL512SAGBHB210 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system update partitioning requiring stable component supply across extended product lifecycles.

Supply support for S25FL512SAGBHB210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure memory solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.

The FL-S family targets high-reliability embedded systems needing deterministic flash performance, integrated security, and automotive qualification - designed specifically for mission-critical boot and firmware storage in harsh environments.

FAQ

What is the maximum Quad DDR read throughput of the S25FL512SAGBHB210?

The device achieves 80 MBps Quad DDR read throughput at 80 MHz clock frequency with VIO = VCC = 3.0–3.6 V. This requires strict setup/hold timing compliance per datasheet Section 5.5 and is validated across the full industrial temperature range (–40°C to +105°C). No external DLL or phase alignment circuitry is needed - the internal timing controller manages DDR edge alignment automatically.

Does the S25FL512SAGBHB210 support hardware reset recovery without host intervention?

Yes. The RESET# pin provides asynchronous hardware reset that clears internal command state, resets all registers to default values, and forces reinitialization of the SPI interface. After RESET#, the device enters standby mode and waits for CS# assertion - no clock or command sequence is required to restore operation, enabling robust recovery from brown-out or watchdog timeout events.

How does Advanced Sector Protection (ASP) differ from standard block protection?

ASP enables password- or boot-code-triggered locking of individual 256-KB sectors, independent of status register bits. Unlike standard block protection - which locks contiguous sector ranges via SR bits - ASP allows fine-grained, dynamic sector lockdown without affecting adjacent sectors or requiring full register writes. This supports secure OTA update schemes where only modified sectors are unlocked during patching.

Can the S25FL512SAGBHB210 operate with VIO = 1.8 V while VCC = 3.3 V?

Yes. The device supports independent VIO (1.65–3.6 V) and VCC (2.7–3.6 V) supplies. At VIO = 1.8 V and VCC = 3.3 V, it maintains full Quad Read functionality at up to 66 MHz (33 MBps), compliant with JEDEC JESD216 SFDP parameter tables. All I/O pins are referenced to VIO, so level-shifting is unnecessary when interfacing with 1.8 V microcontrollers.

S25FL512SAGBHB210 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL512SAGBHB210 FAQ

1.How can I place an order for S25FL512SAGBHB210 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGBHB210 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGBHB210 reliable?

The price and inventory of S25FL512SAGBHB210 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHB210 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGBHB210?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHB210 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGBHB210?

S25FL512SAGBHB210 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGBHB210 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGBHB210?

For technical support, including S25FL512SAGBHB210 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHB210 requirements.

6.How does Aetrix verify that S25FL512SAGBHB210 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGBHB210 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHB210 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGBHB210?

All S25FL512SAGBHB210 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHB210, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGBHB210 part is unused and in its original packaging.

Return procedure for S25FL512SAGBHB210:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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