Infineon Technologies S25FL512SAGBHB213
- Part No.:
- S25FL512SAGBHB213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHB213.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,056
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Product details
Overview
S25FL512SAGBHB213 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability embedded boot and code storage in industrial and automotive systems. It supports Quad Read up to 52 MBps, uniform 256-KB sector erase, 100,000 program-erase cycles, 20-year data retention, and operates across –40°C to +105°C (Industrial Plus grade).
For engineers reviewing the S25FL512SAGBHB213 datasheet, S25FL512SAGBHB213 pinout, S25FL512SAGBHB213 application, or S25FL512SAGBHB213 equivalent, this device delivers deterministic boot timing via AutoBoot, hardware-assisted ECC, OTP security, and dual-voltage I/O (VIO = 1.65–3.6 V) for flexible host interface integration.
Technical Context
This FL-S series flash implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction in hardware without firmware overhead. Its command set is fully compatible with S25FL-A/K/P families and supports both SDR and DDR SPI modes, including Fast, Dual, and Quad variants with 32-bit extended addressing.
The device integrates dedicated control logic for AutoBoot execution at power-up/reset, configurable block protection via status register bits, and Advanced Sector Protection (ASP) with password- or boot-code–controlled individual sector locking - all operating within a single 2.7–3.6 V core supply and independent 1.65–3.6 V I/O rail.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and configuration data in resource-constrained edge controllers. |
| Read Speed (Quad) | 52 MBps at VIO = VCC = 3.0–3.6 V - enables sub-100 ms boot time for 4 MB application binaries. |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and eliminates need for complex sector-mapping logic. |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial gateways. |
| Data Retention | 20 years minimum at +85°C - validated for long-life deployments in uncooled automotive ECUs. |
| Security | 1024-byte OTP array + ASP + hardware write protect - enables secure key storage and immutable bootloader partitioning. |
| Temperature Range | –40°C to +105°C (Industrial Plus) - qualified for under-hood and factory-floor environments without derating. |
Pinout & Package
Package: 24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction. |
| SCK | Serial Clock Input | Drives all timing for SDR/DDR commands; supports up to 133 MHz SDR and 80 MHz DDR modes. |
| IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes. |
| IO1 | Serial Output / I/O1 | Primary data output in standard SPI; bidirectional I/O1 in Dual/Quad; supports read data streaming. |
| IO2 | Write Protect / I/O2 | Hardware write protection when pulled low; also serves as I/O2 in Quad mode for address/data transfer. |
| IO3 | Hold / I/O3 | Pauses ongoing transaction when asserted; doubles as I/O3 in Quad mode for expanded bus width. |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and reinitializes flash controller logic. |
| VCC | Core Supply | 2.7–3.6 V core voltage; powers array and control logic; independent of I/O voltage rail. |
| VIO | I/O Supply | 1.65–3.6 V programmable I/O voltage; enables direct interfacing with 1.8 V or 3.3 V host MCUs. |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance PCB return path for signal integrity. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at preconfigured address on power-up/reset - eliminates boot loader polling delay. |
| Hardware ECC | On-the-fly single-bit error correction with no CPU intervention - ensures data integrity during read without software overhead. |
| Quad-Input Page Programming (QPP) | Enables efficient programming under slow clock hosts (e.g., 10 MHz MCU) by using all four I/O lines for write data. |
| Advanced Sector Protection (ASP) | Password- or boot-code–enabled per-sector lock - prevents unauthorized firmware modification in safety-critical applications. |
| CFI & SFDP Support | Standardized configuration access via Common Flash Interface and JEDEC JESD216 - enables automatic driver initialization in Linux/U-Boot. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware and configuration tables in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Primary boot memory executing AutoBoot at power-on; provides deterministic <100 ms startup latency via Quad Read. Use Value: 20-year data retention and 100K endurance ensure firmware integrity across 15+ year equipment lifecycles without refresh. | Use Scenario: Hosting boot code and sensor calibration data for radar/EPS ECUs requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Secure, temperature-hardened boot source with OTP-protected bootloader and ASP-locked safety-critical partitions. Use Value: Hardware ECC and –40°C to +105°C operation guarantee reliable boot under thermal stress and EMI-rich vehicle environments. |
| Medical Imaging System Code Storage | Smart Grid Communication Module |
Use Scenario: Holding FPGA configuration bitstreams and diagnostic firmware in portable ultrasound devices with strict reliability requirements. IC Role / Device Role / Timing Role: Nonvolatile code storage with CFI/SFDP auto-detection for plug-and-play driver compatibility across multiple SoC platforms. Use Value: Uniform 256-KB sectors simplify field update partitioning; Quad Read speed reduces system wake-up latency during battery-powered operation. | Use Scenario: Storing protocol stacks and encryption keys in DIN-rail mounted IoT gateways operating in outdoor substations. IC Role / Device Role / Timing Role: Secure flash with 1024-byte OTP for root-of-trust key storage and hardware write protection against remote firmware tampering. Use Value: Dual-voltage I/O (1.65–3.6 V) allows direct connection to 1.8 V communication SoCs without level shifters, reducing BOM cost and board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFI101 | Same die, SO16 package (300 mil); lacks FBGA mechanical robustness and thermal performance. | Better suited for prototyping or space-tolerant PCBs where rework is acceptable. | Select when manual soldering or legacy footprint compatibility is required. |
| Winbond W25Q512JVFIQ | 512 Mb Quad SPI flash; no hardware ECC, no ASP, only basic BP bits; 80 MBps Quad Read max. | Lower security and reliability; suitable for consumer-grade applications with shorter lifecycle. | Choose only if cost sensitivity outweighs ECC, ASP, and 20-year retention requirements. |
Compared with S25FL512SAGBHB213, the SO16 alternative trades package ruggedness for assembly flexibility, while the Winbond part omits critical automotive-grade features - making the Infineon device the sole choice for safety-critical, long-lifecycle deployments requiring hardware-enforced data integrity.
Availability
S25FL512SAGBHB213 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system code storage requiring stable component supply across extended product lifecycles.
Supply support for S25FL512SAGBHB213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, and memory solutions for industrial, automotive, and renewable energy markets.
The FL-S flash product line targets high-reliability embedded systems demanding deterministic boot, long-term data integrity, and AEC-Q100-compliant nonvolatile storage - especially where firmware security and thermal resilience are mandatory.
FAQ
Does S25FL512SAGBHB213 support DDR SPI mode?
Yes, it supports Fast Read DDR, Dual Read DDR, and Quad Read DDR commands at up to 80 MHz clock rate, delivering up to 80 MBps read throughput when VIO = VCC = 3.0–3.6 V. DDR mode requires precise setup/hold timing per AC specifications in Section 5.5 of the datasheet and is enabled via configuration register bit CR[3].
What is the function of the HOLD# pin during active read operations?
HOLD# pauses ongoing SPI transactions without resetting internal state - allowing the host to temporarily suspend data streaming (e.g., to service higher-priority interrupts). When asserted low, IO0–IO3 enter high-impedance state and SCK is ignored until HOLD# is deasserted, after which the transaction resumes from the exact bit position.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed via dedicated One-Time Program commands (0x4B, 0x42) and resides at fixed address 0x00000000. Once programmed, bits cannot be reset. Protection is enforced by Status Register Lock Bit (SR[7]) and requires Write Enable before any OTP write - preventing accidental overwrite during normal flash operations.
Can S25FL512SAGBHB213 operate with VIO = 1.8 V while VCC = 3.3 V?
Yes, it supports independent I/O and core supplies: VIO may be set from 1.65 V to 2.7 V (e.g., 1.8 V) while VCC remains within 2.7–3.6 V (e.g., 3.3 V). This allows direct interfacing with 1.8 V microcontrollers without level shifters, provided timing margins are verified per Section 4.5 DC characteristics and Section 5.2 AC test conditions.
S25FL512SAGBHB213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 750µs
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHB213 FAQ
1.How can I place an order for S25FL512SAGBHB213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHB213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHB213 reliable?
The price and inventory of S25FL512SAGBHB213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHB213 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHB213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHB213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHB213?
S25FL512SAGBHB213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHB213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHB213?
For technical support, including S25FL512SAGBHB213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHB213 requirements.
6.How does Aetrix verify that S25FL512SAGBHB213 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHB213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHB213 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHB213?
All S25FL512SAGBHB213 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHB213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHB213 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHB213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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