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Infineon Technologies S25FL512SAGBHBA10

Part No.:
S25FL512SAGBHBA10
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL512SAGBHBA10.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:338

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Product details

Overview

S25FL512SAGBHBA10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC. It supports AutoBoot, CFI, and DDR read modes, and is qualified for Industrial Plus (–40°C to +105°C) operation in FBGA package.

For engineers reviewing the S25FL512SAGBHBA10 datasheet, S25FL512SAGBHBA10 pinout, S25FL512SAGBHBA10 application, or S25FL512SAGBHBA10 equivalent, key selection criteria include Quad/DDR read bandwidth, 100K program-erase cycles, OTP security, sector protection granularity, and AEC-Q100 Grade 2 qualification for automotive control modules.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-power operation. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible system-level voltage scaling.

The command set includes full SPI compatibility with S25FL-A/K/P families, extended 32-bit addressing, and dedicated commands for Advanced Sector Protection (ASP), OTP programming, and Fast/Quad/DDR read modes - all executed via a single 4-wire or 8-wire SPI interface.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512 Mb (64 MB) - supports firmware images, boot code, and configuration data for complex embedded systems.
Read Bandwidth (Quad)52 MBps at 104 MHz - enables fast boot and real-time code execution from flash without XIP latency penalties.
Erase GranularityUniform 256-KB sectors - simplifies firmware update partitioning and wear leveling in OTA applications.
Endurance & Retention100,000 P/E cycles / 20-year data retention - meets long-life requirements for industrial gateways and automotive ECUs.
Security Features1024-byte OTP + ASP + Status Register block protection - provides immutable root-of-trust and field-upgradeable secure boot enforcement.
Operating Temperature–40°C to +105°C (Industrial Plus) - validated for under-hood automotive and high-ambient industrial control environments.
Package24-ball FBGA (FAB024, 6 × 8 mm, Pb-free) - surface-mount compatible with automated PCB assembly and thermal management in compact modules.

Pinout & Package

24-ball FBGA (FAB024, 6 × 8 mm footprint, 0.8 mm pitch), RoHS-compliant, with exposed thermal pad. Pinout optimized for signal integrity in high-speed SPI Multi-I/O operation.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for command/address/data transfer; supports daisy-chain and multi-device SPI configurations.
SCKSerial Clock InputEdge-triggered clock up to 133 MHz SDR or 80 MHz DDR; phase/polarity modes 0 and 3 supported.
IO0–IO3Multi-I/O BidirectionalConfigurable as SI/SO/WP#/HOLD# in standard mode or quad I/O for high-throughput read/write operations.
VCCCore Supply2.7–3.6 V power for internal logic and array; decoupling required per layout guidelines for stable erase/write margins.
VIOI/O Supply1.65–3.6 V independent rail - allows interfacing with 1.8 V or 3.3 V host controllers without level shifters.
RESET#Hardware Reset InputAsynchronous active-low reset that forces device into known state; required for safe recovery after brown-out or watchdog timeout.

Key Features

FeatureDesign Value
AutoBoot FunctionExecutes preconfigured Normal or Quad Read at power-up/reset - eliminates host-side boot initialization delay and reduces BOM count.
Hardware ECCOn-the-fly single-bit error correction with no software overhead - ensures data integrity during long-term storage and high-temperature operation.
Quad-Input Page ProgrammingEnables reliable programming at low clock frequencies (<20 MHz) - critical for resource-constrained microcontrollers with limited SPI peripheral capabilities.
Advanced Sector Protection (ASP)Password- or boot-code-controlled individual sector locking - prevents unauthorized firmware modification while allowing selective field updates.
Common Flash Interface (CFI)Standardized parameter table accessible via SPI - enables automatic driver detection and runtime configuration in Linux U-Boot and RTOS environments.

Applications

Automotive Engine Control Unit (ECU)Industrial PLC Firmware Storage

Use Scenario: Stores calibrated engine maps, diagnostic routines, and OTA update payloads in AEC-Q100 Grade 2 qualified ECU modules.

IC Role / Device Role / Timing Role: Nonvolatile code storage with AutoBoot and hardware ECC - ensures deterministic boot timing and fault-tolerant firmware persistence.

Use Value: 256-KB uniform sectors align with ISO 26262 ASIL-B update partitions; 105°C rating supports placement near powertrain electronics.

Use Scenario: Holds ladder logic programs, I/O configuration tables, and safety firmware for DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: High-reliability SPI flash with ASP and OTP - secures proprietary control algorithms against tampering and accidental overwrite.

Use Value: Quad Read bandwidth (52 MBps) enables sub-100 ms firmware load times; 20-year retention guarantees uptime across 15+ year product lifecycles.

Medical Imaging System Boot Memory5G Baseband Radio Unit (RU) Configuration

Use Scenario: Stores FPGA bitstreams, sensor calibration data, and HIPAA-compliant boot firmware in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Secure, temperature-stable boot memory with CFI and OTP - satisfies IEC 62304 Class C software lifecycle requirements.

Use Value: 1024-byte OTP stores cryptographic keys; Industrial Plus temp range ensures reliability during sterilization cycles and extended clinical use.

Use Scenario: Holds radio calibration profiles, beamforming coefficients, and vendor-specific RU configuration parameters in O-RAN compliant small cells.

IC Role / Device Role / Timing Role: High-bandwidth, field-upgradable configuration store with DDR read capability - accelerates RU reconfiguration during network slicing events.

Use Value: Quad DDR Read (80 MBps) cuts profile load latency by >60% vs. legacy SPI flash; ASP enables carrier-specific parameter lockdown.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGMFI10Same die, SOIC-16 package (300 mil); lacks FBGA thermal performance and board space efficiency.Preferred for prototyping or low-volume industrial boards where reflow compatibility with through-hole legacy designs is needed.Select when mechanical fit or hand-soldering feasibility outweighs thermal/power density requirements.
Winbond W25Q512JWIM
(512 Mb, 1.8 V I/O)
1.8 V only I/O (no 3.3 V support); lower max Quad Read speed (40 MBps); no AutoBoot or ASP.Suitable for battery-powered edge nodes but not automotive or high-temp industrial use.Choose only if system operates exclusively at 1.8 V and security/temperature requirements are relaxed.

Compared with S25FL512SAGBHBA10, the SOIC variant trades thermal robustness for ease of assembly, while the Winbond alternative sacrifices automotive qualification, AutoBoot, and ASP for lower voltage operation - making the Infineon FBGA version optimal for mission-critical, thermally constrained, and secure firmware storage.

Availability

S25FL512SAGBHBA10 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging subsystems, and 5G radio unit configuration requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 compliance.

Supply support for S25FL512SAGBHBA10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure memory solutions, with global R&D and manufacturing infrastructure.

The FL-S family delivers high-performance, secure, and automotive-qualified serial NOR flash targeting code storage, boot memory, and firmware update applications in safety-critical and thermally demanding systems.

FAQ

What is the maximum clock frequency supported for Quad DDR read operations?

The S25FL512SAGBHBA10 supports Quad DDR read at up to 80 MHz clock frequency, delivering 80 MBps throughput when VIO = VCC = 3.0–3.6 V. This requires strict AC timing compliance per Section 5.5 of the datasheet, including setup/hold margins and controlled impedance routing on the host PCB.

Does this part support hardware reset via the RESET# pin, and what is its behavior?

Yes, the RESET# pin provides asynchronous hardware reset: asserting it low forces the device into a known idle state, clears internal command registers, and disables ongoing operations. Release must be synchronized with CS# deassertion to ensure clean restart; minimum pulse width is 20 ns per datasheet Section 2.3.

How is the 1024-byte OTP array accessed and protected?

The OTP array is accessed via dedicated JEDEC-standard One-Time-Program commands (0x4B, 0x42). Once programmed, bits cannot be erased. Protection is enforced by Status Register lock bits and hardware write-disable circuitry - OTP programming requires prior Write Enable and specific unlock sequences to prevent accidental writes.

Can the device operate with different voltages on VCC and VIO rails?

Yes - VCC (2.7–3.6 V) powers the core logic and flash array, while VIO (1.65–3.6 V) independently supplies the I/O buffer. This allows interfacing with 1.8 V microcontrollers while maintaining full 3.3 V array performance, provided both rails meet min/max specifications and sequencing requirements in Section 4.4.

S25FL512SAGBHBA10 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL512SAGBHBA10 FAQ

1.How can I place an order for S25FL512SAGBHBA10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGBHBA10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGBHBA10 reliable?

The price and inventory of S25FL512SAGBHBA10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHBA10 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGBHBA10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHBA10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGBHBA10?

S25FL512SAGBHBA10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGBHBA10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGBHBA10?

For technical support, including S25FL512SAGBHBA10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHBA10 requirements.

6.How does Aetrix verify that S25FL512SAGBHBA10 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGBHBA10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHBA10 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGBHBA10?

All S25FL512SAGBHBA10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHBA10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGBHBA10 part is unused and in its original packaging.

Return procedure for S25FL512SAGBHBA10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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