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Infineon Technologies S25FL512SAGBHBA13

Part No.:
S25FL512SAGBHBA13
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL512SAGBHBA13.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,409

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Product details

Overview

S25FL512SAGBHBA13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, and integrated hardware ECC. It supports Quad Read up to 52 MBps, AutoBoot at power-up, and operates across –40°C to +105°C (Industrial Plus). Used in boot code storage for embedded microcontrollers and firmware images in industrial gateways.

For engineers reviewing the S25FL512SAGBHBA13 datasheet, S25FL512SAGBHBA13 pinout, S25FL512SAGBHBA13 application, or S25FL512SAGBHBA13 equivalent, key selection factors include Quad DDR read performance (80 MBps), OTP security (1024-byte array), AEC-Q100 Grade 2 qualification, and SO16 package compatibility with legacy S25FL-A/K/P families.

Technical Context

This FL-S series flash implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling single-bit error correction via on-die ECC logic and supporting both SDR and DDR SPI protocols. It uses a 32-bit extended addressing mode and maintains command-set and footprint compatibility with prior S25FL-A, S25FL-K, and S25FL-P families.

The device features dual voltage domains: core supply (VCC = 2.7–3.6 V) and versatile I/O supply (VIO = 1.65–3.6 V), allowing interoperability with 1.8 V or 3.3 V host controllers. Its AutoBoot function executes preconfigured Normal or Quad Read commands at reset, simplifying boot sequence design without external logic.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - sufficient for full firmware images and configuration data in resource-constrained edge devices.
Read Speed (Quad)52 MBps at VIO = VCC = 3.0–3.6 V - enables fast boot loading and real-time firmware updates.
Erase UnitUniform 256-KB sectors - simplifies partitioning for OTA update rollback and secure firmware staging.
Endurance100,000 program-erase cycles - supports frequent field firmware updates over product lifetime.
Data Retention20 years minimum - ensures long-term reliability in unattended industrial deployments.
Security1024-byte OTP + Advanced Sector Protection - enables immutable root-of-trust keys and per-sector write lock via password or boot code.
Temperature Range–40°C to +105°C (Industrial Plus) - qualified for use in high-ambient environments like motor drives and base station control units.

Pinout & Package

Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command execution; must be asserted before SCK edge to initiate transaction.
SCKSerial Clock InputDrives all timing for command, address, and data transfers; supports up to 133 MHz SDR and 80 MHz DDR modes.
SI / IO0Serial Input / I/O0Primary data input for commands/addresses; also functions as first I/O line in Dual/Quad modes.
SO / IO1Serial Output / I/O1Primary data output during reads; serves as second I/O line in Dual/Quad configurations.
WP# / IO2Write Protect Input / I/O2Hardware-enabled sector protection; low state locks selected sectors against program/erase when enabled in status register.
HOLD# / IO3Hold Input / I/O3Suspends ongoing SPI transfer without deselecting device; used for bus arbitration or interrupt handling.
VCCCore Supply2.7–3.6 V power for internal logic and array; decoupling required within 10 mm of pin.
VIOI/O Supply1.65–3.6 V supply for interface pins; independent of VCC, enabling mixed-voltage system integration.
VSSGroundCommon reference for VCC and VIO; requires low-impedance connection to PCB ground plane.

Key Features

FeatureDesign Value
Quad-Input Page Programming (QPP)Enables efficient programming in low-clock-rate systems by accepting four bytes per clock cycle, reducing total write time by ~4× vs standard SPI.
AutoBoot FunctionAutomatically executes Normal or Quad Read from user-defined address at power-up/reset - eliminates need for external boot controller or FPGA initialization logic.
Common Flash Interface (CFI)Provides standardized register-based identification and configuration data, enabling OS-agnostic flash drivers and automated BOM validation tools.
Hardware ECCOn-the-fly single-bit error correction with no software overhead - critical for maintaining data integrity in high-radiation or thermally stressed environments.
Advanced Sector Protection (ASP)Allows individual 256-KB sector locking via password or boot code execution - prevents unauthorized firmware modification without disabling entire flash region.

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing runtime firmware and configuration tables in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Primary boot memory mapped to MCU's XIP (execute-in-place) address space, delivering Quad Read at 52 MBps to meet <500 ms cold-start requirement.

Use Value: Uniform 256-KB erase blocks align with PLC firmware partitioning schemes; 20-year retention ensures zero field failures over equipment lifecycle.

Use Scenario: Holding boot loader and safety-critical sensor fusion firmware in front-camera ECU modules certified to ISO 26262 ASIL-B.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash providing deterministic boot timing via AutoBoot and CFI-verified parameter discovery.

Use Value: Hardware ECC and 100K-cycle endurance support repeated OTA updates under vehicle vibration and thermal cycling conditions.

Medical Imaging Control BoardSmart Grid Communication Module

Use Scenario: Hosting FPGA configuration bitstreams and calibration data in portable ultrasound systems requiring rapid power-on readiness.

IC Role / Device Role / Timing Role: Nonvolatile storage interfaced to ARM Cortex-A9 via QSPI controller; leverages Quad DDR mode (80 MBps) for sub-second FPGA reconfiguration.

Use Value: 1024-byte OTP stores cryptographic keys for secure bitstream authentication; SO16 package fits tight board space constraints.

Use Scenario: Storing protocol stacks (DLMS/COSEM, IEC 61850) and metering firmware in ANSI C12.22-compliant smart meters operating in outdoor substations.

IC Role / Device Role / Timing Role: Industrial Plus temperature-rated flash supporting extended temperature operation and remote firmware updates via HAN/LAN interfaces.

Use Value: Advanced Sector Protection isolates communication stack partitions from application firmware, preventing corruption during partial updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGMFI10Same die, FBGA-24 (FAB024) package; lacks SO16 option; identical electrical specs and command set.Preferred where board space is constrained and BGA assembly capability exists.Select when footprint flexibility is needed and BGA rework infrastructure is available.
Winbond W25Q512JVFIQ512 Mb density, but uses 1.8 V / 3.3 V dual VIO; no AutoBoot or ASP; ECC implemented in software only.Suitable for cost-sensitive consumer designs where security and deterministic boot are not required.Choose only if AEC-Q100 qualification, hardware ECC, and sector-level protection are non-critical.

Compared with S25FL512SAGBHBA13, the Infineon FBGA variant offers identical functionality in smaller form factor, while the Winbond part trades security and automotive qualification for lower unit cost and broader voltage tolerance - making it viable only in non-safety-critical contexts.

Availability

S25FL512SAGBHBA13 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging control boards, and smart grid communication modules requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S25FL512SAGBHBA13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing facilities.

The FL-S flash product line targets high-reliability embedded systems requiring deterministic boot, long-term data integrity, and automotive-grade qualification - designed specifically for firmware storage in safety-critical and mission-critical applications.

FAQ

What is the maximum clock frequency supported in DDR mode?

The S25FL512SAGBHBA13 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively when VIO = VCC = 3.0–3.6 V. DDR timing requires strict setup/hold compliance per datasheet Section 5.5.

Does this part support XIP (execute-in-place) operation?

Yes - the device supports XIP when interfaced with compatible QSPI controllers (e.g., ARM Cortex-M7/M33, NXP i.MX RT series) that implement continuous read mode and proper cache coherency. Quad and DDR read modes are recommended for optimal instruction fetch throughput.

How is the 1024-byte OTP array accessed and protected?

The OTP array is accessed via dedicated JEDEC-standard One-Time-Program commands (0x4B, 0x42) and locked permanently after programming. Once written, OTP contents cannot be erased or modified. Access requires Write Enable and specific unlock sequences defined in Section 9.7 of the datasheet.

Can the HOLD# and WP# pins be left unconnected in a simple application?

No - HOLD# must be pulled high (via ≥10 kΩ resistor) to prevent unintended suspension of SPI transfers; WP# must be pulled high or actively driven to disable hardware write protection. Leaving either floating may cause erratic behavior or accidental sector locking during noise events.

S25FL512SAGBHBA13 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL512SAGBHBA13 FAQ

1.How can I place an order for S25FL512SAGBHBA13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGBHBA13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGBHBA13 reliable?

The price and inventory of S25FL512SAGBHBA13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHBA13 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGBHBA13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHBA13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGBHBA13?

S25FL512SAGBHBA13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGBHBA13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGBHBA13?

For technical support, including S25FL512SAGBHBA13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHBA13 requirements.

6.How does Aetrix verify that S25FL512SAGBHBA13 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGBHBA13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHBA13 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGBHBA13?

All S25FL512SAGBHBA13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHBA13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGBHBA13 part is unused and in its original packaging.

Return procedure for S25FL512SAGBHBA13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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