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Infineon Technologies S25FL512SAGBHBB10
- Part No.:
- S25FL512SAGBHBB10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHBB10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,267
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Product details
Overview
S25FL512SAGBHBB10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, and uniform 256-KB sector architecture. It supports Quad Read up to 52 MBps, on-chip ECC, AutoBoot, and CFI/SFDP compliance. Used in industrial control firmware storage where high-density, reliable nonvolatile code execution is required.
For engineers reviewing the S25FL512SAGBHBB10 datasheet, S25FL512SAGBHBB10 pinout, S25FL512SAGBHBB10 application, or S25FL512SAGBHBB10 equivalent, this page delivers verified electrical specs, package mapping, real-world use cases, and validated alternatives for embedded firmware storage design and migration planning.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling single-bit error correction via hardware ECC and supporting both SDR and DDR SPI modes. It features dual voltage domains: 2.7–3.6 V core (VCC) and 1.65–3.6 V I/O (VIO), allowing interoperability with 1.8 V and 3.3 V host controllers.
The command set is backward-compatible with S25FL-A/K/P families and includes Quad-Input Page Programming (QPP), Advanced Sector Protection (ASP), and 1024-byte OTP array. Extended 32-bit addressing enables full 512 Mb access without bank switching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - supports full firmware images for mid-tier microcontrollers without external memory expansion |
| Read Speed (Quad) | 52 MBps at 104 MHz (VIO = VCC = 3.0–3.6 V) - enables fast XIP (execute-in-place) boot from flash |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update partitioning and wear leveling implementation |
| Endurance | 100,000 program-erase cycles - sufficient for field firmware updates over 10+ years of industrial operation |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage for medical or infrastructure equipment |
| Voltage Ranges | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - supports mixed-voltage system integration with 1.8 V FPGAs or 3.3 V MCUs |
| Temperature Grade | Industrial Plus (–40°C to +105°C) - qualified for extended thermal environments in motor drives and power converters |
Pinout & Package
Package: 24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command latching; must be deasserted between commands to avoid bus contention |
| SCK | Serial Clock Input | Drives all timing for SDR/DDR read/write; supports up to 133 MHz SDR and 80 MHz DDR modes |
| IO0 | Serial Data I/O (SI) | Primary input for commands/address/data during standard SPI; functions as bidirectional data lane in Quad mode |
| IO1 | Serial Data I/O (SO) | Primary output for read data; also used as bidirectional lane in Dual/Quad modes |
| IO2 | Write Protect / I/O | Hardware write protection when asserted low; serves as third I/O lane in Quad mode |
| IO3 | Hold / I/O | Pauses ongoing transfer when asserted; doubles as fourth I/O lane in Quad mode |
| RESET# | Hardware Reset Input | Asynchronous reset that clears internal state and forces re-initialization of configuration registers |
| VCC | Core Supply | 2.7–3.6 V power for memory array and logic; decoupling required per datasheet layout guidelines |
| VIO | I/O Supply | Independent 1.65–3.6 V rail for interface pins-enables level-shifting without external translators |
| VSS | Ground | Common reference for VCC and VIO; requires low-inductance connection to minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates host-side boot initialization delay |
| Hardware ECC | On-the-fly single-bit error correction with no software overhead - improves field reliability without CPU intervention |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enables secure firmware update zones and bootloader isolation |
| Quad-Input Page Programming (QPP) | Reduces programming time in low-clock systems by using four lanes for address/data input - accelerates field updates on resource-constrained hosts |
| CFI & SFDP Compliance | Standardized parameter tables accessible via SPI - enables automatic driver configuration across toolchains and RTOS platforms |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data for programmable logic controllers operating in factory-floor environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP-capable Quad Read and AutoBoot - provides deterministic boot sequence and runtime code integrity. Use Value: 20-year data retention and 100K endurance ensure firmware remains valid across PLC service life without refresh; ASP prevents unauthorized modification of safety-critical logic. | Use Scenario: Holding boot code and sensor calibration data for radar/EPS ECUs requiring AEC-Q100 Grade 2 qualification (–40°C to +105°C). IC Role / Device Role / Timing Role: Primary boot flash with hardware ECC and CFI - guarantees safe startup under automotive transient conditions and supports OTA update rollback. Use Value: Dual voltage rails (VCC/VIO) simplify integration with 1.8 V SoC interfaces; OTP array stores cryptographic keys for secure boot verification. |
| Medical Imaging System Code Storage | Networking Equipment Configuration Flash |
Use Scenario: Storing FPGA bitstreams and application firmware in portable ultrasound devices subject to strict regulatory retention and reliability requirements. IC Role / Device Role / Timing Role: High-reliability NOR flash with uniform 256-KB erase blocks - enables atomic firmware updates and deterministic recovery after power loss. Use Value: 52 MBps Quad Read speed reduces boot time below 500 ms; 20-year retention meets FDA Class II device lifecycle expectations. | Use Scenario: Holding configuration profiles, MAC tables, and failover images in enterprise switches and routers deployed in telecom central offices. IC Role / Device Role / Timing Role: Persistent configuration store with block protection and SFDP support - allows dynamic driver adaptation across multiple switch ASIC generations. Use Value: 1024-byte OTP stores immutable root-of-trust keys; CFI/SFDP enables zero-touch provisioning in automated manufacturing lines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SDSBHI10 | Same die, identical pinout and timing; differs only in SOIC-16 packaging (vs. FAB024 BGA) | Limited to PCBs with through-hole or gull-wing footprint; lower thermal performance than BGA | Select for legacy board reuse or prototyping where BGA assembly is unavailable |
| Winbond W25Q512JWIM (1.8 V I/O variant) | 1.8 V only I/O (1.7–2.0 V), no VIO/VCC separation; lacks ASP and AutoBoot | Requires level translation in 3.3 V systems; no hardware-assisted secure boot flow | Choose only if system uses 1.8 V-only host and cost sensitivity outweighs security/feature needs |
Compared with S25FL512SAGBHBB10, the Cypress alternative offers identical functionality in SOIC-16 but sacrifices thermal and density advantages of BGA; Winbond's part trades voltage flexibility and security features for lower unit cost in 1.8 V–only designs.
Availability
S25FL512SAGBHBB10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system code storage requiring stable component supply across multi-year production cycles.
Supply support for S25FL512SAGBHBB10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The S25FL-S family targets high-reliability embedded systems needing robust, pin-compatible NOR flash with advanced data integrity and security features for mission-critical firmware storage.
FAQ
What is the difference between S25FL512SAGBHBB10 and S25FL512SAGMFI10?
S25FL512SAGBHBB10 uses the FAB024 24-ball FBGA package (6 × 8 mm), while S25FL512SAGMFI10 uses the FAC024 24-ball FBGA (4 × 6 mm). Both share identical electrical specs, timing, and feature set, but differ in ball pitch and layout compatibility-FAB024 has 0.8 mm pitch, FAC024 has 0.5 mm pitch. PCB redesign is required for interchange.
Does S25FL512SAGBHBB10 support Dual Transfer Rate (DTR) mode?
No. S25FL512SAGBHBB10 supports DDR (Double Data Rate) SPI mode-not DTR. DDR mode transfers data on both clock edges during read operations (e.g., Fast Read DDR, Quad Read DDR), achieving up to 80 MBps. DTR is a JEDEC JESD251 standard not implemented in this FL-S generation.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte One-Time-Programmable (OTP) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. It is intended for storing immutable values such as cryptographic keys, device IDs, or calibration constants that must survive field updates and power cycles.
Is hardware reset (RESET#) required for reliable operation?
Yes. Asserting RESET# asynchronously clears internal state machines and reloads configuration registers from nonvolatile shadow storage. This is critical after power-up instability or voltage brownout events to prevent command corruption or register misconfiguration-especially before executing sensitive operations like sector protection or OTP programming.
S25FL512SAGBHBB10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL512SAGBHBB10 FAQ
1.How can I place an order for S25FL512SAGBHBB10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHBB10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHBB10 reliable?
The price and inventory of S25FL512SAGBHBB10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHBB10 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHBB10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHBB10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHBB10?
S25FL512SAGBHBB10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHBB10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHBB10?
For technical support, including S25FL512SAGBHBB10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHBB10 requirements.
6.How does Aetrix verify that S25FL512SAGBHBB10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHBB10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHBB10 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHBB10?
All S25FL512SAGBHBB10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHBB10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHBB10 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHBB10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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