Infineon Technologies S25FL512SAGBHBB13
- Part No.:
- S25FL512SAGBHBB13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHBB13.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,873
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL512SAGBHBB13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply (2.7–3.6 V), and 16-pin SOIC package. It supports Quad Read at up to 52 MBps, features hardware ECC, 256-KB uniform sector erase, 100,000 program-erase cycles, and operates across –40°C to +105°C (Industrial Plus grade). Used for firmware storage in embedded controllers and boot code execution in industrial gateways.
For engineers reviewing the S25FL512SAGBHBB13 datasheet, S25FL512SAGBHBB13 pinout, S25FL512SAGBHBB13 application, or S25FL512SAGBHBB13 equivalent, key selection factors include Quad DDR read performance (80 MBps), OTP security (1024-byte array), AEC-Q100 Grade 2 qualification, CFI/SFDP compliance, and SOIC-16 footprint compatibility with legacy S25FL-A/K/P families.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing. Its dual-voltage I/O (VIO = 1.65–3.6 V) allows interoperability with 1.8 V or 3.3 V host controllers while maintaining full 512 Mb addressability via 32-bit extended addressing.
The command set supports both standard SPI modes (0/3) and DDR operation, with AutoBoot functionality enabling automatic Normal or Quad Read at power-up from a preselected address. Internal hardware ECC provides single-bit error correction without software overhead during read operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in resource-constrained edge nodes |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast boot time and real-time code execution from flash |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and avoids fragmentation in OTA update systems |
| Endurance | 100,000 program-erase cycles - supports frequent field firmware updates over 10+ years of service |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage applications |
| Operating Temp | –40°C to +105°C (Industrial Plus) - validated for deployment in harsh thermal environments |
| Security | 1024-byte OTP + ASP - enables secure key storage and per-sector write protection via password or boot code |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, with standard JEDEC MS-012AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock Input | Drives all synchronous transfers; supports up to 133 MHz SDR or 80 MHz DDR clock rates |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection; doubles as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Suspends ongoing transfer without deselecting device; doubles as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for logic and array; decoupling required within 10 mm of pin |
| VIO | I/O Supply | 1.65–3.6 V independent rail - enables mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at power-up/reset from user-configurable address - eliminates external boot controller dependency |
| Hardware ECC | On-the-fly single-bit error correction during reads - improves data integrity without CPU intervention or latency penalty |
| Quad-Input Page Programming | Enables efficient programming under low-clock-rate hosts (e.g., microcontrollers with ≤20 MHz SPI) - reduces write time by 4× vs. standard SPI |
| CFI & SFDP Compliance | Provides standardized configuration metadata (JEDEC JESD216) - enables automatic driver initialization in Linux U-Boot and RTOS BSPs |
| Advanced Sector Protection | Password- or boot-code-controlled individual sector locking - supports secure OTA update partitioning and root-of-trust isolation |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data for programmable logic controllers operating in factory-floor environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary boot memory executing XIP (eXecute-In-Place) code directly from flash during cold start and runtime firmware updates. Use Value: 256-KB uniform sectors simplify update scheduling; 100K endurance supports 20+ years of field upgrades; Industrial Plus temp rating ensures reliability at +105°C ambient. | Use Scenario: Holding boot loader and safety-critical sensor fusion firmware in automotive camera modules compliant with ISO 26262 ASIL-B requirements. IC Role / Device Role / Timing Role: Secure nonvolatile storage with AEC-Q100 Grade 2 qualification and OTP-based cryptographic key vaulting. Use Value: 1024-byte OTP stores immutable root keys; ASP enables isolated protection of boot code region; 20-year retention guarantees lifetime data integrity. |
| Medical Imaging Device Code Storage | Smart Grid Communication Module |
Use Scenario: Hosting diagnostic firmware and calibration tables in portable ultrasound units requiring FDA-grade traceability and zero-field failure risk. IC Role / Device Role / Timing Role: High-reliability code and parameter store with hardware ECC and CFI/SFDP auto-discovery for certified BSP integration. Use Value: Single-bit ECC prevents silent corruption in critical imaging pipelines; 20-year retention meets medical device lifecycle mandates; SOIC-16 eases rework and validation. | Use Scenario: Storing protocol stacks and encryption keys in DIN-rail-mounted smart meters communicating over PRIME or G3-PLC networks. IC Role / Device Role / Timing Role: Secure, field-upgradable memory supporting AES-256 key management and firmware rollback protection. Use Value: Block protection + ASP prevents unauthorized firmware modification; Quad Read speed enables rapid decryption key loading; SOIC package supports conformal coating for outdoor enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFV00 | Same die, FBGA-24 (FAB024) package; no SOIC option; identical electrical specs and command set | Preferred for space-constrained PCBs where BGA routing and thermal performance outweigh rework needs | Select when board area is limited and automated assembly is available |
| Winbond W25Q512JVIM | 512 Mb SPI NOR, but lacks AutoBoot, hardware ECC, and ASP; supports only standard SPI (no DDR) | Suitable for cost-sensitive consumer devices without safety or long-life requirements | Choose only if ECC, sector-level protection, and DDR read are not required |
Compared with S25FL512SAGBHBB13, the FBGA variant offers identical functionality in smaller form factor, while Winbond's part trades advanced reliability features for lower cost-making Infineon's SOIC version optimal for industrial field-upgrade and safety-critical boot applications.
Availability
S25FL512SAGBHBB13 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging devices, and smart grid communication systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.
Supply support for S25FL512SAGBHBB13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, and security solutions for industrial, automotive, and IoT markets.
The S25FL-S family targets high-reliability embedded systems needing secure, high-speed, long-life nonvolatile memory - designed specifically for boot code execution, firmware storage, and secure key management in mission-critical applications.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SAGBHBB13 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively when VIO = VCC = 3.0–3.6 V. This requires strict PCB layout adherence to DDR timing constraints including matched trace lengths and controlled impedance.
Does this device require external hardware ECC circuitry?
No. The device integrates on-die hardware ECC that automatically detects and corrects single-bit errors during read operations without external components or software overhead. The ECC engine operates transparently and does not affect read latency or require host-side intervention.
Can the SOIC-16 package be used as a drop-in replacement for older S25FL-A series devices?
Yes - the S25FL512SAGBHBB13 maintains pin-to-pin compatibility, command set alignment, and footprint equivalence with S25FL-A, S25FL-K, and S25FL-P families. No hardware redesign is needed, though firmware may require minor updates to leverage new features like AutoBoot or DDR commands.
Is the 1024-byte OTP area one-time programmable only, or can it be erased?
The 1024-byte OTP (One-Time Programmable) array is permanently programmed after initial write - individual bits can be set (to '0') but never reset (to '1'). Once programmed, contents are retained for 20 years and survive power cycles, resets, and temperature extremes per AEC-Q100 Grade 2 specifications.
S25FL512SAGBHBB13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL512SAGBHBB13 FAQ
1.How can I place an order for S25FL512SAGBHBB13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHBB13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHBB13 reliable?
The price and inventory of S25FL512SAGBHBB13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHBB13 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHBB13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHBB13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHBB13?
S25FL512SAGBHBB13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHBB13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHBB13?
For technical support, including S25FL512SAGBHBB13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHBB13 requirements.
6.How does Aetrix verify that S25FL512SAGBHBB13 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHBB13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHBB13 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHBB13?
All S25FL512SAGBHBB13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHBB13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHBB13 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHBB13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL512SAGBHBB13 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

