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Infineon Technologies S25FL512SAGBHBC13
- Part No.:
- S25FL512SAGBHBC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHBC13.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,251
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Product details
Overview
S25FL512SAGBHBC13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC. It supports AutoBoot, CFI, and DDR read modes, and is qualified for Industrial Plus (–40°C to +105°C) operation in FBGA package.
For engineers reviewing the S25FL512SAGBHBC13 datasheet, S25FL512SAGBHBC13 pinout, S25FL512SAGBHBC13 application, or S25FL512SAGBHBC13 equivalent, this device serves as a high-density, low-power, AEC-Q100 Grade 2–capable boot code and firmware storage solution with programmable sector protection and 20-year data retention.
Technical Context
This FL-S series flash implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true Quad I/O operation and DDR-capable command execution. Its control logic integrates configurable status registers, OTP array, and Advanced Sector Protection (ASP) with password- or boot-code–based sector locking.
The device supports extended 32-bit addressing, SPI clock modes 0 and 3, and dual-voltage operation (VCC = 2.7–3.6 V, VIO = 1.65–3.6 V), allowing interoperability across legacy and low-voltage host controllers while maintaining full command set compatibility with S25FL-A/K/P families.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images, bootloader, and configuration tables in resource-constrained embedded systems |
| Read Speed (Quad) | 52 MBps at VIO = VCC = 3.0–3.6 V - enables fast code XIP (execute-in-place) from flash without local RAM buffering |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update partitioning and wear leveling in OTA applications |
| Endurance | 100,000 program-erase cycles - supports frequent field updates in industrial gateways and automotive ECUs |
| Data Retention | 20 years minimum - ensures long-term reliability in unattended infrastructure equipment |
| ECC | Internal hardware single-bit error correction - eliminates need for external error-handling logic in safety-critical boot paths |
| Operating Temp | –40°C to +105°C (Industrial Plus) - validated for under-hood automotive and outdoor telecom deployments |
| Package | 24-ball FBGA (FAB024, 6 × 8 mm) - compact footprint compatible with high-density PCB layouts and automated assembly |
Pinout & Package
24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant. Ball layout optimized for signal integrity in high-speed SPI Multi-I/O operation with dedicated VIO/VCC separation and ground-signal-ground routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for command/address/data transfer; must be held stable during multi-byte operations |
| SCK | Serial Clock Input | Drives all timing for command, address, and data phases; supports up to 133 MHz SDR and 80 MHz DDR |
| IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| IO1 | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| IO2 | Write Protect / I/O2 | Hardware write protection when asserted low; also serves as I/O2 in Quad mode |
| IO3 | Hold / I/O3 | Pauses ongoing operation without resetting internal state; doubles as I/O3 in Quad mode |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and reinitializes command parser |
| VCC | Core Supply | 2.7–3.6 V power for memory array and control logic; decoupling required per datasheet layout guidelines |
| VIO | I/O Supply | 1.65–3.6 V independent supply for I/O buffers - enables mixed-voltage system interfacing |
| VSS | Ground | Common reference for VCC and VIO; multiple balls assigned to minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Automatically executes Normal or Quad Read at power-up/reset from user-configurable address - reduces boot latency and host CPU initialization overhead |
| Quad-Input Page Programming (QPP) | Enables full 512-byte page writes using all four I/O lines - improves programming throughput in low-clock-rate microcontrollers |
| Advanced Sector Protection (ASP) | Per-sector lock via boot code or 128-bit password - prevents unauthorized firmware modification in certified automotive and industrial systems |
| Common Flash Interface (CFI) | Standardized JEDEC-compliant parameter table accessible via serial commands - enables automatic driver detection and configuration in OS-agnostic bootloaders |
| OTP Array (1024 bytes) | User-programmable one-time storage for keys, calibration data, or device-specific identifiers - isolated from main array and protected by lock bits |
Applications
| Automotive ECU Boot Storage | Industrial Gateway Firmware |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware in engine control units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AutoBoot and hardware write protection activated at power-on. Use Value: Ensures deterministic boot sequence and prevents accidental overwrites during CAN FD firmware updates. | Use Scenario: Holding Linux kernel, root filesystem, and secure boot keys in edge computing gateways deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability firmware storage with 20-year data retention and ASP-enabled sector lockdown for OTA update partitions. Use Value: Eliminates need for external ECC logic and supports field-upgradable secure boot without hardware redesign. |
| Medical Imaging System Configuration | Avionics Data Logger |
Use Scenario: Storing calibration profiles, sensor compensation tables, and regulatory compliance metadata in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure configuration store with OTP-backed cryptographic keys and block-protected calibration sectors. Use Value: Meets IEC 62304 traceability requirements through hardware-enforced write protection and immutable key storage. | Use Scenario: Recording flight-critical telemetry and black-box logs in UAVs operating across –40°C to +105°C ambient conditions. IC Role / Device Role / Timing Role: Temperature-hardened firmware and log storage with uniform 256-KB erase blocks aligned to flight segment boundaries. Use Value: Guarantees consistent erase performance and endurance across thermal cycling, avoiding partial-block corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI10 | Same die, SOIC-16 package (300 mil); lacks FBGA thermal performance and board space efficiency | Better suited for prototyping and low-volume industrial controls where manual soldering is acceptable | Select when mechanical compatibility with legacy SOIC footprints is required and thermal derating is not critical |
| Winbond W25Q512JWIM (512Mb, 1.8V) | 1.8 V I/O only; no VIO/VCC separation; lower max Quad Read speed (40 MBps); no AutoBoot or ASP | Targeted at ultra-low-power IoT nodes, not automotive or industrial temperature-grade systems | Choose only for cost-sensitive, battery-powered designs where extended temp range and advanced protection are unnecessary |
Compared with S25FL512SAGBHBC13, the SOIC variant trades thermal robustness and density for ease of assembly, while the Winbond part sacrifices automotive qualification, AutoBoot, and sector-level security for lower voltage operation and bill-of-materials cost.
Availability
S25FL512SAGBHBC13 is available at Aetrix Electronics and suitable for automotive ECU development, industrial gateway production, and avionics data logger manufacturing requiring stable component supply, long-lifecycle support, and AEC-Q100–compliant sourcing.
Supply support for S25FL512SAGBHBC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for automotive, industrial, and IoT applications.
The FL-S family targets high-reliability embedded systems needing secure, high-speed, temperature-qualified serial NOR flash with advanced data protection and seamless migration from legacy S25FL-A/K/P devices.
FAQ
What is the purpose of the VIO pin on the S25FL512SAGBHBC13?
The VIO pin supplies independent power to the I/O buffer circuitry, supporting 1.65–3.6 V operation. This allows direct interfacing with 1.8 V or 3.3 V host processors without level shifters, while VCC (2.7–3.6 V) powers the core memory array - enabling mixed-voltage system design with optimal signal integrity.
Does the S25FL512SAGBHBC13 support execute-in-place (XIP) operation?
Yes - its Quad Read mode delivers up to 52 MBps at 3.0–3.6 V, enabling real-time XIP execution of firmware code directly from flash. The device supports continuous burst reads with wrap-around addressing and low-latency command execution, eliminating the need to copy code to RAM before execution in resource-constrained MCUs.
How does Advanced Sector Protection (ASP) differ from standard block protection?
ASP provides per-sector locking controlled either by boot code execution or a 128-bit password stored in OTP, whereas standard block protection uses status register bits to protect contiguous sector ranges. ASP enables fine-grained, dynamic, and cryptographically enforced protection - critical for secure boot partitions and regulatory-compliant firmware updates.
Is the S25FL512SAGBHBC13 pin-compatible with earlier S25FL-P series devices?
Yes - it maintains identical FBGA (FAB024) ball mapping and command set compatibility with S25FL-P devices, including Quad I/O and DDR read commands. However, it adds AutoBoot, enhanced ASP, and improved endurance (100K cycles vs. 50K in older P-series), making it a drop-in replacement with functional upgrades for migration paths.
S25FL512SAGBHBC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHBC13 FAQ
1.How can I place an order for S25FL512SAGBHBC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHBC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHBC13 reliable?
The price and inventory of S25FL512SAGBHBC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHBC13 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHBC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHBC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHBC13?
S25FL512SAGBHBC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHBC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHBC13?
For technical support, including S25FL512SAGBHBC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHBC13 requirements.
6.How does Aetrix verify that S25FL512SAGBHBC13 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHBC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHBC13 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHBC13?
All S25FL512SAGBHBC13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHBC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHBC13 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHBC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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