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Infineon Technologies S25FL512SAGBHI210
- Part No.:
- S25FL512SAGBHI210
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHI210.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,022
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Product details
Overview
S25FL512SAGBHI210 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for embedded boot code storage and firmware execution in resource-constrained systems. It supports Quad Read at up to 52 MBps, features hardware ECC, 256-KB uniform sectors, 100,000 program-erase cycles, and operates across –40°C to +105°C (Industrial Plus grade).
For engineers reviewing the S25FL512SAGBHI210 datasheet, S25FL512SAGBHI210 pinout, S25FL512SAGBHI210 application, or S25FL512SAGBHI210 equivalent, key selection criteria include SPI DDR support, AutoBoot capability, OTP security, AEC-Q100 Grade 2 qualification, and compatibility with S25FL-P family footprints.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic read latency and robust data integrity. Its dual-voltage I/O (1.65–3.6 V) and core supply (2.7–3.6 V) decouple timing-critical signaling from power domain constraints.
The logic block integrates SRAM latches, X/Y decoders, and dedicated control logic for command decoding, sector protection, and automatic ECC generation during programming-eliminating software overhead for single-bit error correction without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images including bootloader, RTOS, and application binaries in space-constrained designs. |
| Interface | SPI Multi-I/O with DDR option - enables high-throughput reads using dual/quad lines and double-data-rate clocking for bandwidth-sensitive boot paths. |
| Read Speed | Quad Read: 52 MBps @ VIO = VCC = 3.0–3.6 V - reduces boot time by >60% vs. standard SPI in microcontroller-based edge nodes. |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update partitioning and eliminates need for complex wear-leveling in host firmware. |
| Endurance & Retention | 100,000 P/E cycles / 20-year data retention - validated for industrial and automotive control modules requiring long-term field reliability. |
| Security | 1024-byte OTP array + ASP + hardware/software block protection - supports secure boot key storage and immutable configuration lockdown. |
| Temperature Range | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive ECUs and industrial PLCs without derating. |
Pinout & Package
Package: 24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command/address/data transfer; must be asserted before SCK edge to initiate valid transaction. |
| SCK | Serial Clock Input | Master-generated clock driving all SPI operations; supports modes 0 and 3, plus DDR timing with precise setup/hold requirements. |
| IO0 (SI) | Serial Input / I/O0 | Primary data input for commands and addresses; functions as bidirectional I/O0 in Dual/Quad modes for multiplexed data transfer. |
| IO1 (SO) | Serial Output / I/O1 | Primary data output during reads; serves as bidirectional I/O1 in Dual/Quad modes, enabling simultaneous read/write on shared bus lines. |
| IO2 (WP#) | Write Protect / I/O2 | Hardware write-protection enable when low; doubles as I/O2 in Quad mode for expanded data lane count during high-speed reads. |
| IO3 (HOLD#) | Hold Input / I/O3 | Pauses ongoing SPI transaction without deselecting device; also functions as I/O3 in Quad mode for full 4-lane data throughput. |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and forces reinitialization of configuration registers and protection settings. |
| VCC | Core Supply | 2.7–3.6 V power for memory array and control logic; independent of I/O voltage for mixed-signal system integration. |
| VIO | I/O Supply | 1.65–3.6 V selectable I/O voltage - allows direct interfacing with 1.8 V or 3.3 V controllers without level shifters. |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance connection to minimize noise coupling into sensitive analog blocks. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Automatically executes Normal or Quad Read at power-up/reset from preconfigured address - eliminates host CPU initialization delay for deterministic boot timing. |
| Internal Hardware ECC | Single-bit error correction applied automatically during page programming - removes software ECC overhead and guarantees data integrity without host intervention. |
| Common Flash Interface (CFI) | Standardized JEDEC-compliant register map providing runtime-configurable parameters (density, timings, protection status) - enables generic flash drivers across multiple vendors. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled per-sector locking - enforces hierarchical firmware update policies and prevents unauthorized modification of critical boot sectors. |
| Extended Addressing (32-bit) | Supports >16 MB addressing space - future-proofs design for larger firmware growth without changing flash controller interface or driver stack. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, safety-critical control algorithms, and calibration tables in engine management systems requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary nonvolatile firmware repository with deterministic Quad Read access for sub-100 ms cold-start boot compliance. Use Value: 256-KB uniform sectors simplify OTA update partitioning; hardware ECC ensures ASIL-B data integrity without software checksum overhead. | Use Scenario: Holds real-time OS kernel, ladder logic interpreter, and I/O configuration in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: High-reliability firmware storage with AutoBoot and CFI support for vendor-agnostic bootloader portability. Use Value: 100,000 P/E cycles and 20-year retention meet 15+ year product lifecycle requirements; VIO/VCC separation enables direct interface with 1.8 V FPGA configuration interfaces. |
| Medical Imaging Device Boot Memory | Edge AI Gateway Firmware Image |
Use Scenario: Stores certified diagnostic firmware and FPGA bitstreams in portable ultrasound and MRI subsystems operating across –40°C to +85°C ambient. IC Role / Device Role / Timing Role: Secure boot memory with OTP-locked cryptographic keys and ASP-protected boot vector table. Use Value: 1024-byte OTP provides tamper-resistant key storage; ASP prevents accidental overwrite of boot vector during field firmware updates. | Use Scenario: Hosts Linux kernel, device tree, and inference model weights in battery-powered smart sensors performing local AI inference at the network edge. IC Role / Device Role / Timing Role: High-bandwidth SPI flash supporting fast Quad DDR reads to reduce boot latency and improve wake-from-sleep responsiveness. Use Value: 80 MBps Quad DDR read rate accelerates kernel decompression; low 70 µA standby current extends battery life between wake cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFI101 | Same die, SOIC-16 package (300 mil); lacks FBGA mechanical robustness and thermal performance for high-vibration environments. | Preferred for prototyping and low-volume PCBs where through-hole or wide-body SOIC is acceptable. | Select when board space permits SOIC and vibration/thermal stress is not a concern. |
| Winbond W25Q512JWIM (512 Mb, 1.8 V I/O) | 1.8 V only I/O (no 3.3 V compatibility); no AutoBoot or ASP; lower endurance (50K cycles). | Suitable for cost-sensitive consumer IoT gateways with fixed 1.8 V host interfaces and shorter product lifecycles. | Choose only if host system uses 1.8 V I/O exclusively and advanced protection features are unnecessary. |
Compared with S25FL512SAGBHI210, the SOIC variant trades mechanical ruggedness for ease of hand-soldering, while the Winbond part sacrifices automotive-grade reliability and security for lower cost and simpler interface-making the Infineon FBGA version optimal for mission-critical industrial and automotive deployments.
Availability
S25FL512SAGBHI210 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC boot memory, and medical imaging device boot code requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S25FL512SAGBHI210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The FL-S family targets high-reliability embedded systems needing fast, secure, and scalable serial NOR flash-designed specifically for deterministic boot, firmware update resilience, and AEC-Q100-compliant operation.
FAQ
What is the maximum supported clock frequency for Quad DDR read operations?
The S25FL512SAGBHI210 supports Quad DDR read at up to 80 MHz clock frequency, delivering 80 MBps throughput when VIO and VCC are both set to 3.0–3.6 V. This requires strict adherence to DDR timing specifications in Section 5.5 of the datasheet, including tDSH, tDHL, and tDQMH setup/hold margins.
Does this device require external hardware ECC circuitry?
No. The S25FL512SAGBHI210 includes fully integrated hardware ECC that automatically detects and corrects single-bit errors during page programming and read operations. No external circuitry or software intervention is needed to maintain data integrity across its full 100,000-cycle endurance rating.
Can the AutoBoot address be modified after initial programming?
Yes. The AutoBoot address is stored in a dedicated configuration register (CR3[7:0]) and can be updated via the Write Configuration Register command (01h). Changes take effect after reset and do not require OTP programming-enabling flexible field updates to boot vector locations without device replacement.
Is the FAB024 FBGA package compatible with standard reflow profiles?
Yes. The FAB024 package (6 × 8 mm, 0.8 mm pitch) is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260°C for 30 seconds. Its Pb-free, RoHS-compliant construction supports standard lead-free assembly processes without special thermal management requirements.
S25FL512SAGBHI210 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHI210 FAQ
1.How can I place an order for S25FL512SAGBHI210 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHI210 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHI210 reliable?
The price and inventory of S25FL512SAGBHI210 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHI210 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHI210?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHI210 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHI210?
S25FL512SAGBHI210 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHI210 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHI210?
For technical support, including S25FL512SAGBHI210 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHI210 requirements.
6.How does Aetrix verify that S25FL512SAGBHI210 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHI210 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHI210 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHI210?
All S25FL512SAGBHI210 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHI210, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHI210 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHI210:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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