Infineon Technologies S25FL512SAGBHI213
- Part No.:
- S25FL512SAGBHI213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHI213.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,825
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Product details
Overview
S25FL512SAGBHI213 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for boot code and firmware storage in embedded systems. It supports Quad Read up to 52 MBps, uniform 256-KB sector erase, 100,000 program-erase cycles, and operates across –40°C to +105°C (Industrial Plus grade) in a 24-ball FBGA package.
For engineers reviewing the S25FL512SAGBHI213 datasheet, S25FL512SAGBHI213 pinout, S25FL512SAGBHI213 application, or S25FL512SAGBHI213 equivalent, key selection criteria include Quad DDR read performance (80 MBps), integrated ECC, AEC-Q100 Grade 2 qualification, and compatibility with S25FL-P family footprints.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-latency boot execution. Its dual-voltage I/O (VIO = 1.65–3.6 V) and core supply (VCC = 2.7–3.6 V) support mixed-signal SoC interfacing while maintaining signal integrity at up to 133 MHz SDR clock rates.
The logic block integrates SRAM latches, X/Y decoders, and configurable control logic supporting SPI modes 0/3, DDR command execution, AutoBoot from preselected address, and Common Flash Interface (CFI) for runtime configuration discovery. Sector protection is enforced via status register bits and Advanced Sector Protection (ASP) with password- or boot-code-controlled locking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and secure boot partitions in automotive ECUs and industrial controllers |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast application loading without external parallel bus overhead |
| Erase Unit | Uniform 256-KB sectors - simplifies file system wear leveling and OTA update partitioning |
| Endurance | 100,000 program-erase cycles - supports frequent field firmware updates over product lifetime |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage applications |
| Operating Temp | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive and factory-floor industrial use |
| Voltage Range | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - interoperable with 1.8 V and 3.3 V host interfaces |
Pinout & Package
Package: 24-ball FBGA (FAC024 footprint, 4 × 6 ball array, 0.8 mm pitch, Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock Input | Edge-triggered clock for SDR/DDR mode; supports up to 133 MHz (SDR) or 80 MHz (DDR) |
| IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O in Dual/Quad modes |
| IO1 | Serial Output / I/O1 | Primary data output in standard SPI; bidirectional in Dual/Quad; supports high-speed Quad Read |
| IO2 | Write Protect / I/O2 | Hardware write protection when pulled low; also serves as Quad I/O line during memory access |
| IO3 | Hold / I/O3 | Pauses ongoing transaction when asserted; doubles as fourth I/O line in Quad mode |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and reinitializes flash controller |
| VCC | Core Supply | 2.7–3.6 V power for memory array and logic; decoupling required per datasheet layout guidelines |
| VIO | I/O Supply | 1.65–3.6 V supply for interface pins; independent of VCC to support mixed-voltage host systems |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance PCB return path |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at power-up/reset from user-configurable address - eliminates host-side boot loader delay |
| Integrated ECC | On-the-fly single-bit error correction using internal hardware - no CPU overhead or external ECC controller needed |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - prevents unauthorized firmware modification in safety-critical systems |
| CFI & SFDP Support | Standardized configuration registers (JEDEC JESD216) - enables automatic driver initialization and runtime parameter discovery |
| OTP Array | 1024-byte one-time-programmable space - stores cryptographic keys, calibration data, or unique device identifiers |
Applications
| Automotive Powertrain ECU | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code and real-time control firmware in diesel/gasoline engine control units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary nonvolatile firmware repository with deterministic Quad Read latency for sub-100 ms cold start. Use Value: 20-year data retention and 100K endurance ensure compliance with 15-year vehicle service life requirements without refresh. | Use Scenario: Holds field-upgradable ladder logic and motion control algorithms in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability firmware storage with hardware write protection to prevent accidental corruption during network-based updates. Use Value: ASP and OTP enable secure credential storage and tamper-resistant firmware signing key management. |
| Medical Imaging System Boot Memory | Avionics Display Module |
Use Scenario: Stores certified boot firmware and diagnostic routines in MRI/CT scanner mainboards operating in temperature-controlled environments. IC Role / Device Role / Timing Role: Trusted boot source with CFI/SFDP auto-discovery for safe, validated startup sequence. Use Value: Uniform 256-KB sectors simplify FDA-mandated firmware versioning and rollback mechanisms. | Use Scenario: Provides display firmware and graphics assets in DO-178C-compliant cockpit display units with strict thermal and radiation tolerance. IC Role / Device Role / Timing Role: Radiation-tolerant nonvolatile memory supporting hot-swap firmware updates during maintenance windows. Use Value: Industrial Plus temperature range (–40°C to +105°C) and ECC ensure operation in sealed, convection-cooled avionics enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFI101 | Same die, SOIC-16 package (300 mil); lacks FBGA mechanical robustness and thermal dissipation | Better suited for prototyping and low-vibration lab environments | Select when board space allows larger footprint and thermal budget is not constrained |
| Winbond W25Q512JWQI | 512 Mb, 1.8 V I/O only; no VIO/VCC separation; lower max Quad Read speed (40 MBps) | Targeted at cost-sensitive consumer IoT, not automotive or industrial temperature grades | Choose only if host system uses 1.8 V I/O exclusively and AEC-Q100/Industrial Plus qualification is unnecessary |
Compared with S25FL512SAGBHI213, the SOIC variant trades mechanical ruggedness for ease of hand-soldering, while the Winbond part sacrifices voltage flexibility and temperature rating for lower unit cost-neither matches the combined AEC-Q100 Grade 2, dual-voltage I/O, and 80 MBps DDR read capability of the original.
Availability
S25FL512SAGBHI213 is available at Aetrix Electronics and suitable for automotive powertrain modules, industrial PLCs, medical imaging subsystems, and avionics displays requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S25FL512SAGBHI213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and security solutions for automotive, industrial, and communications markets.
The FL-S family targets high-reliability embedded systems needing fast, secure, and long-life serial NOR flash-designed specifically for automotive ECU boot, industrial control firmware, and safety-certified applications.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SAGBHI213 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively when VIO = VCC = 3.0–3.6 V. This is confirmed in the Performance Summary table on page 3 of the official datasheet (Rev. *U).
Does this part include hardware-based write protection?
Yes. The device provides dual-layer hardware write protection: WP# pin assertion disables all program/erase commands, and status register bits (SRWD, SEC, TB, BP[2:0]) enable sector-level lock-down. These features are fully documented in Section 8.3 (Block Protection) of the datasheet.
Is the 24-ball FBGA package lead-free and RoHS compliant?
Yes. All packages for the S25FL512SAGBHI213-including the FAC024 FBGA-are Pb-free and RoHS compliant, as explicitly stated in the "Packages (all Pb-free)" section on page 2 of the datasheet and verified in Infineon's official material declarations.
Can this flash be used with a 1.8 V microcontroller interface?
Yes. The device supports VIO from 1.65 V to 3.6 V independently of VCC (2.7–3.6 V), allowing direct connection to 1.8 V hosts. However, maximum read speeds are reduced at lower VIO (e.g., Quad Read drops to 33 MBps at 66 MHz when VIO = 1.65–2.7 V), as specified in the Performance Summary table.
S25FL512SAGBHI213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHI213 FAQ
1.How can I place an order for S25FL512SAGBHI213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHI213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHI213 reliable?
The price and inventory of S25FL512SAGBHI213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHI213 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHI213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHI213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHI213?
S25FL512SAGBHI213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHI213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHI213?
For technical support, including S25FL512SAGBHI213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHI213 requirements.
6.How does Aetrix verify that S25FL512SAGBHI213 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHI213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHI213 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHI213?
All S25FL512SAGBHI213 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHI213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHI213 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHI213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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