Infineon Technologies S25FL512SAGBHI310
- Part No.:
- S25FL512SAGBHI310
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHI310.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,921
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Product details
Overview
S25FL512SAGBHI310 from Infineon is a 512 Mb (64 MB) SPI Multi-I/O serial NOR flash memory with 3.0 V core supply, supporting Quad and DDR read modes up to 80 MHz clock rate and 80 MBps throughput, featuring uniform 256-KB sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C) in FBGA package.
For engineers reviewing the S25FL512SAGBHI310 datasheet, S25FL512SAGBHI310 pinout, S25FL512SAGBHI310 application, or S25FL512SAGBHI310 equivalent, key selection factors include Quad/DDR read performance, OTP security, hardware/software block protection, and automotive-grade temperature operation with 20-year data retention.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density NOR flash with integrated ECC for single-bit error correction during programming. Its dual-voltage I/O interface supports VIO from 1.65 V to 3.6 V independent of VCC (2.7–3.6 V), allowing interoperability with low-voltage controllers.
The command set is fully compatible with S25FL-P family footprints and extends support to 32-bit addressing, CFI, SFDP, and AutoBoot functionality-enabling automatic execution of Normal or Quad Read at power-up from a preconfigured address without host intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for boot code, firmware, and configuration storage in resource-constrained embedded systems |
| Read Throughput (Quad DDR) | 80 MBps at 80 MHz - enables fast firmware loading and real-time code execution from flash |
| Erase Unit | Uniform 256-KB sectors - simplifies partitioning and wear-leveling in firmware update architectures |
| Endurance | 100,000 program-erase cycles - supports frequent over-the-air (OTA) updates in automotive ECUs |
| Data Retention | 20 years minimum - ensures long-term reliability in industrial control and automotive applications |
| Temperature Range | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive environments |
| Security | 1024-byte OTP array + hardware/software block protection + ASP - enables secure boot key storage and sector lockdown |
Pinout & Package
Package: 24-ball FBGA (FAC024 footprint, 4 × 6 ball array, 6 mm × 8 mm, 0.8 mm pitch, Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command/address/data transfer; required for all operations |
| SCK | Serial Clock Input | Drives timing for all SPI transactions; supports SDR (modes 0/3) and DDR protocols |
| IO0 (SI) | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| IO1 (SO) | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| IO2 (WP#) | Write Protect / I/O2 | Hardware write-protection enable when asserted low; also serves as Quad I/O2 in expanded mode |
| IO3 (HOLD#) | Hold Input / I/O3 | Pauses ongoing SPI transaction without deselecting chip; doubles as Quad I/O3 |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and reinitializes flash controller |
| VCC | Core Supply | 2.7–3.6 V core voltage; powers logic, array, and ECC circuitry |
| VIO | I/O Supply | 1.65–3.6 V independent I/O rail; decouples interface voltage from core for mixed-voltage systems |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance PCB connection |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Functionality | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates host boot delay and simplifies cold-start sequence |
| Integrated Hardware ECC | Automatic single-bit error correction during programming - reduces host software overhead and improves field reliability |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enables fine-grained firmware partitioning and secure OTA update zones |
| 32-Bit Addressing Support | Enables full 512 Mb address space access without bank switching - simplifies memory mapping in large-firmware applications |
| JEDEC SFDP Compliance | Self-describing parameter table accessible via standard command - allows automatic driver configuration without hard-coded timing values |
Applications
| Automotive ECU Firmware Storage | Industrial PLC Boot Memory |
|---|---|
Use Scenario: Storing boot loader, safety-critical application code, and calibration data in engine control units requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with AutoBoot execution and hardware-based sector protection against unintended writes. Use Value: 20-year data retention and 100K endurance ensure reliable operation over vehicle lifetime; Grade 2 temp rating supports under-hood deployment. | Use Scenario: Hosting real-time OS kernel and deterministic control logic in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability firmware repository with Quad DDR read (80 MBps) to minimize boot time and support deterministic startup. Use Value: Uniform 256-KB erase blocks simplify firmware update scheduling; OTP stores cryptographic keys for secure firmware validation. |
| Medical Imaging System Configuration | Avionics Display Module Storage |
Use Scenario: Storing FPGA configuration bitstreams, calibration profiles, and regulatory-compliant diagnostic firmware in MRI and CT scanner subsystems. IC Role / Device Role / Timing Role: Secure, radiation-tolerant (via ECC) nonvolatile memory with CFI/SFDP for plug-and-play driver compatibility across imaging platforms. Use Value: 1024-byte OTP stores device-specific calibration constants; hardware WP#/ASP prevents accidental corruption during field service. | Use Scenario: Holding display firmware, font assets, and DO-254-compliant boot images in cockpit display units operating in extended temperature environments. IC Role / Device Role / Timing Role: Automotive-grade NOR flash used as trusted boot source with verified 20-year retention and AEC-Q100 Grade 2 qualification. Use Value: Dual-voltage I/O (VIO = 1.8 V) enables direct interfacing with avionics SoCs; 32-bit addressing supports modular firmware partitioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFI101 | Same die, SOIC-16 package (300 mil); lacks FBGA mechanical robustness and thermal performance | Better suited for prototyping and low-vibration industrial boards where rework is routine | Select when board-level rework capability or legacy SOIC footprint compatibility is required |
| Winbond W25Q512JWIM (512 Mb, 1.8 V I/O) | 1.8 V only I/O (no 1.65–3.6 V versatility); no AEC-Q100 qualification; lower max Quad DDR throughput (64 MBps) | Targeted at cost-sensitive consumer IoT, not automotive or safety-critical industrial use | Select only for non-automotive designs with strict 1.8 V I/O constraints and no functional safety requirements |
Compared with S25FL512SAGBHI310, the SOIC variant trades mechanical ruggedness for rework flexibility, while the Winbond alternative sacrifices automotive qualification and I/O voltage flexibility for lower cost-making the Infineon FBGA part optimal for production automotive and high-reliability industrial deployments.
Availability
S25FL512SAGBHI310 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC development, and medical imaging system integration requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for S25FL512SAGBHI310 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with leadership in automotive-grade memory and sensor solutions.
The S25FL-S family delivers high-reliability SPI NOR flash optimized for automotive firmware storage, industrial boot memory, and safety-critical embedded systems requiring AEC-Q100 qualification and long-term data integrity.
FAQ
What is the maximum clock frequency supported for Quad DDR read operations?
The S25FL512SAGBHI310 supports Quad DDR read at up to 80 MHz clock frequency, delivering 80 MBps throughput when VIO = VCC = 3.0–3.6 V. This is confirmed in the Performance Summary section of the official Infineon datasheet (Rev. *U, page 3). The device does not support higher DDR frequencies even with overclocking, as timing margins are fixed by internal logic and flash array characteristics.
Does this part support hardware write protection independent of software commands?
Yes. Pin WP# (IO2) provides hardware write protection: when held low, it disables all program and erase operations regardless of status register settings. This function is electrically enforced and remains active even if the device is reset or powered cycled, making it suitable for fail-safe firmware protection in automotive and industrial systems.
Is the 24-ball FBGA package (FAC024) lead-free and RoHS compliant?
Yes. The S25FL512SAGBHI310 uses a Pb-free, RoHS-compliant FAC024 24-ball FBGA package with matte tin finish on solder balls. This is explicitly stated in the "Packages (all Pb-free)" section of the datasheet (page 2), and the part meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for surface-mount assembly.
Can the OTP array be programmed multiple times, or is it one-time only?
The 1024-byte OTP (One-Time Programmable) array is strictly one-time programmable: each bit can be changed from '1' to '0' only once, and no bits can be reset to '1'. Programming is performed via dedicated OTP Program commands (0x42/0x4B), and verification must be done externally-OTP contents are not erasable or modifiable after initial programming, ensuring permanent storage of keys or calibration data.
S25FL512SAGBHI310 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL512SAGBHI310 FAQ
1.How can I place an order for S25FL512SAGBHI310 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHI310 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHI310 reliable?
The price and inventory of S25FL512SAGBHI310 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHI310 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHI310?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHI310 transactions.
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4.How is shipping managed for S25FL512SAGBHI310?
S25FL512SAGBHI310 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHI310 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHI310?
For technical support, including S25FL512SAGBHI310 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHI310 requirements.
6.How does Aetrix verify that S25FL512SAGBHI310 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHI310 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHI310 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHI310?
All S25FL512SAGBHI310 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHI310, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHI310 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHI310:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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