Infineon Technologies S25FL512SAGBHI313
- Part No.:
- S25FL512SAGBHI313
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHI313.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,993
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Product details
Overview
S25FL512SAGBHI313 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and uniform 256-KB sector architecture. It supports Quad Read at up to 52 MBps, internal hardware ECC for single-bit correction, and AutoBoot execution from preselected address on power-up or reset - deployed in industrial control firmware storage and automotive infotainment boot code retention.
For engineers reviewing the S25FL512SAGBHI313 datasheet, S25FL512SAGBHI313 pinout, S25FL512SAGBHI313 application, or S25FL512SAGBHI313 equivalent, key selection criteria include Quad DDR read performance (80 MBps), AEC-Q100 Grade 2 qualification (–40°C to +105°C), OTP security array size (1024 bytes), and SO16/FBGA package compatibility with legacy S25FL-P designs.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing across SPI SDR and DDR modes. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support mixed-signal SoC interfacing while maintaining full command set compatibility with S25FL-A/K/P families.
The integrated control logic handles automatic ECC generation during programming, uniform 256-KB sector erase with 100,000 program-erase cycles, and configurable block protection via status register bits or advanced sector protection (ASP) using boot code or password. CFI and SFDP tables provide standardized configuration discovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images including bootloader, OS kernel, and application binaries in resource-constrained embedded systems |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables sub-100 ms full firmware load time for real-time boot sequences |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and eliminates need for complex sector-mapping logic in host firmware |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial gateways |
| Data Retention | 20 years minimum - ensures long-term reliability without refresh in unpowered storage applications |
| Security | 1024-byte OTP array + ASP - allows secure key storage and per-sector write lock enforcement independent of host processor trust |
| Temperature Range | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive ECUs without derating |
| I/O Voltage Range | 1.65 V to 3.6 V - interoperable with 1.8 V and 3.3 V host controllers without level shifters |
Pinout & Package
Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, Pb-free). Pin assignments validated per Infineon datasheet Rev. *U (2025-04-03), Section 6.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate valid transaction |
| SCK | Serial Clock Input | Master-generated clock driving all SPI transfers; supports up to 133 MHz SDR and 80 MHz DDR modes |
| IO0 (SI) | Serial Input / I/O0 | Primary data input for standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| IO1 (SO) | Serial Output / I/O1 | Primary data output for standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| IO2 (WP#) | Write Protect / I/O2 | Hardware write protection enable when low; doubles as Quad I/O2 in multi-line read/write operations |
| IO3 (HOLD#) | Hold Input / I/O3 | Pauses ongoing SPI transfer without deselecting chip; doubles as Quad I/O3 in multi-line mode |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that forces device into known state and clears internal command pipeline |
| VCC | Core Supply | 2.7–3.6 V core voltage powering array and logic; decoupling required within 10 mm of pin |
| VIO | I/O Supply | 1.65–3.6 V independent I/O rail enabling mixed-voltage system integration |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance connection to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically initiates Normal or Quad Read from user-defined address on power-up/reset - eliminates host CPU polling delay in boot-critical paths |
| Hardware ECC | On-the-fly single-bit error correction during read/program - removes need for software-based BCH or Hamming overhead in safety-critical firmware |
| Quad DDR Support | 80 MBps sustained read throughput with DDR clocking - reduces boot latency by >40% vs. SDR Quad in high-performance microcontrollers |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enables secure OTA update partitioning without exposing keys to host firmware |
| CFI & SFDP Compliance | Standardized JEDEC JESD216 parameter tables - enables automatic driver configuration in Linux MTD and Zephyr flash subsystems |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data for programmable logic controllers operating in factory-floor environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Nonvolatile boot memory providing deterministic <100 ms firmware load time at –40°C to +85°C, with AutoBoot ensuring immediate execution after cold start. Use Value: Eliminates external watchdog initialization delays and guarantees first-instruction fetch within 200 µs of CS# assertion due to hardware-managed read pipeline. | Use Scenario: Holding boot code and sensor calibration data for radar processing units requiring AEC-Q100 compliance and secure firmware integrity verification. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) serial NOR flash with OTP-protected cryptographic keys and ASP-locked calibration sectors. Use Value: Enables secure boot chain validation via hardware ECC and prevents unauthorized sector reprogramming during vehicle service using password-locked ASP. |
| Medical Imaging System Configuration | Network Switch Boot Loader Storage |
Use Scenario: Retaining FPGA configuration bitstreams and DICOM protocol stacks in portable ultrasound devices requiring 20-year data retention and low-power standby. IC Role / Device Role / Timing Role: Low-quiescent-current (70 µA typical) flash memory supporting fast Quad Read for rapid FPGA reconfiguration during device wake-up. Use Value: Reduces system wake-up latency from sleep mode to <150 ms while maintaining data integrity over full product lifecycle without refresh cycles. | Use Scenario: Hosting U-Boot and OpenWrt kernel images in carrier-grade Ethernet switches where firmware update resilience and concurrent read/write are mandatory. IC Role / Device Role / Timing Role: High-endurance (100K cycles) flash with uniform 256-KB sectors enabling atomic firmware swap without partial-sector corruption risk. Use Value: Supports zero-downtime firmware upgrades via dual-bank emulation using dedicated sector ranges, verified by hardware ECC on every read. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SDSBHI301 | Same die, identical electrical specs, but SO16 package (300 mil) instead of FAB024 BGA | Limited to board space-constrained designs requiring through-hole or surface-mount SOIC layout | Select when PCB reworkability, thermal dissipation, or legacy footprint compatibility outweigh BGA density benefits |
| Winbond W25Q512JWIM > 512Mb | 512 Mb density, 1.8 V I/O only (no 3.3 V support), no AEC-Q100 qualification, lower endurance (50K cycles) | Suitable for cost-sensitive consumer IoT gateways, not automotive or industrial control | Choose only for non-automotive applications where 1.8 V-only interface and reduced reliability budget are acceptable |
Compared with S25FL512SAGBHI313, the SO16 alternative offers identical functionality in legacy-compatible packaging, while the Winbond part trades AEC-Q100 qualification and endurance for lower cost and 1.8 V optimization - making it unsuitable for safety-critical or high-cycle-update deployments.
Availability
S25FL512SAGBHI313 is available at Aetrix Electronics and suitable for industrial automation firmware storage, automotive ADAS boot memory, and medical imaging configuration retention requiring stable component supply across extended product lifecycles.
Supply support for S25FL512SAGBHI313 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure memory solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The FL-S family targets high-reliability embedded systems requiring AEC-Q100 qualification, deterministic boot timing, and hardware-enforced security - designed specifically for automotive ECUs, industrial PLCs, and medical devices demanding 20-year data retention.
FAQ
What is the maximum Quad DDR read speed of the S25FL512SAGBHI313?
The device achieves 80 MBps Quad DDR read throughput at 80 MHz clock frequency with VIO = VCC = 3.0–3.6 V. This performance is measured under JEDEC-compliant AC test conditions and requires proper PCB layout with matched trace lengths and controlled impedance (50 Ω ±10%) for all I/O lines to maintain signal integrity.
Does the S25FL512SAGBHI313 support hardware reset recovery without host intervention?
Yes. The RESET# pin provides asynchronous hardware reset that clears internal command state, resets status registers, and forces the device into standby mode. After deassertion, the device automatically enters AutoBoot mode if enabled, executing a preconfigured read command without host SPI traffic - critical for fail-safe boot recovery in automotive systems.
How is the 1024-byte OTP array used in secure firmware deployment?
The OTP array is one-time programmable and stores immutable values such as cryptographic root keys, device-specific identifiers, or secure boot policy flags. Once written, contents cannot be erased or modified. It is accessed via dedicated JEDEC-standard commands and protected against accidental overwrite by hardware fuse-lock mechanisms verified during manufacturing test.
Can the S25FL512SAGBHI313 operate with different core and I/O voltages simultaneously?
Yes. The device supports independent VCC (2.7–3.6 V) and VIO (1.65–3.6 V) supplies, enabling direct interface with 1.8 V microcontrollers while maintaining full 3.3 V core performance. This eliminates level-shifter components and reduces BOM count in mixed-voltage designs, provided both supplies meet datasheet ripple and sequencing requirements.
S25FL512SAGBHI313 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL512SAGBHI313 FAQ
1.How can I place an order for S25FL512SAGBHI313 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHI313 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHI313 reliable?
The price and inventory of S25FL512SAGBHI313 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHI313 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHI313?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHI313 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHI313?
S25FL512SAGBHI313 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHI313 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHI313?
For technical support, including S25FL512SAGBHI313 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHI313 requirements.
6.How does Aetrix verify that S25FL512SAGBHI313 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHI313 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHI313 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHI313?
All S25FL512SAGBHI313 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHI313, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHI313 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHI313:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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