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Infineon Technologies S25FL512SAGBHIC13

Part No.:
S25FL512SAGBHIC13
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL512SAGBHIC13.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,138

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Product details

Overview

S25FL512SAGBHIC13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC. It supports AutoBoot, CFI, SFDP, and operates across industrial (–40°C to +85°C) and automotive AEC-Q100 Grade 2 (–40°C to +105°C) temperature ranges.

For engineers reviewing the S25FL512SAGBHIC13 datasheet, S25FL512SAGBHIC13 pinout, S25FL512SAGBHIC13 application, or S25FL512SAGBHIC13 equivalent, this device is selected for high-reliability boot code storage, firmware update partitions, and real-time configuration data in resource-constrained embedded systems requiring deterministic read latency and long-term data retention.

Technical Context

This FL-S family device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling single-bit ECC correction and uniform 256-KB sector erase granularity. It supports SPI clock modes 0 and 3, DDR read commands, and extended 32-bit addressing - eliminating need for bank switching in large-memory applications.

The device features dual power domains: core voltage (VCC = 2.7–3.6 V) and versatile I/O voltage (VIO = 1.65–3.6 V), allowing interoperability with 1.8 V or 3.3 V host controllers. Its command set maintains footprint and software compatibility with S25FL-A/K/P families while adding Quad-Input Page Programming (QPP) for low-clock-rate systems.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - supports full OS images or multi-application firmware partitions without external memory expansion
Read Speed (Quad)52 MBps at 104 MHz (VIO = VCC = 3.0–3.6 V) - enables sub-10 ms boot time for 512 KB bootloader
Erase GranularityUniform 256-KB sectors - simplifies firmware update logic and avoids partial-sector write complications
Endurance100,000 program-erase cycles - sufficient for field-upgradable devices with daily firmware updates over 27 years
Data Retention20 years minimum - guarantees integrity of calibration data, security keys, and configuration parameters in unpowered storage
ECCOn-die hardware single-bit error correction - eliminates need for external error-handling firmware overhead
Temperature RangeAEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive ECUs and industrial motor drives

Pinout & Package

Package: 24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command latching; must be held stable during command execution to prevent bus contention
SCKSerial Clock InputDrives all timing for command, address, and data transfer; supports up to 133 MHz SDR and 80 MHz DDR modes
IO0 (SI)Serial Input / I/O0Primary data input for commands/addresses; also functions as first I/O line in Dual/Quad modes
IO1 (SO)Serial Output / I/O1Primary data output during reads; serves as second I/O line in Dual/Quad configurations
IO2 (WP#)Write Protect / I/O2Hardware-enabled sector protection when asserted low; doubles as third I/O line in Quad mode
IO3 (HOLD#)Hold Input / I/O3Pauses ongoing read without deselecting chip; repurposed as fourth I/O line in Quad mode
RESET#Hardware Reset InputAsynchronous active-low reset that clears internal state and reinitializes flash controller logic
VCCCore Supply2.7–3.6 V power for memory array and control logic; decoupling required within 10 mm of pin
VIOI/O Supply1.65–3.6 V supply for interface buffers - enables mixed-voltage system integration
VSSGroundCommon reference for VCC and VIO; requires low-impedance connection to PCB ground plane

Key Features

FeatureDesign Value
AutoBootExecutes preconfigured Normal or Quad Read at power-up/reset - eliminates host-side boot initialization delay
Quad-Input Page Programming (QPP)Enables 512-byte page writes using four I/O lines simultaneously - reduces programming time by ~4× vs. standard SPI
Advanced Sector Protection (ASP)Password- or boot-code-controlled individual sector locking - prevents unauthorized firmware modification in production units
Common Flash Interface (CFI)Standardized register map for runtime identification of density, timings, and protection status - simplifies BSP portability across flash vendors
Serial Flash Discoverable Parameters (SFDP)JESD216-compliant parameter table accessible via SPI - enables automatic driver configuration without hard-coded timing values

Applications

Automotive ECU Boot MemoryIndustrial PLC Firmware Storage

Use Scenario: Storing boot code and safety-critical firmware in engine control units with AEC-Q100 Grade 2 qualification.

IC Role / Device Role / Timing Role: Primary nonvolatile boot source executing on cold start; delivers verified code to MCU within 8 ms via Quad Read.

Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity over full vehicle lifetime without recalibration or replacement.

Use Scenario: Holding field-upgradable ladder logic and motion control algorithms in programmable logic controllers operating in factory environments.

IC Role / Device Role / Timing Role: Firmware partition storage with ASP-enabled sector locking to prevent accidental overwrite during remote updates.

Use Value: Uniform 256-KB erase blocks align with typical PLC firmware image sizes, reducing update fragmentation and wear leveling complexity.

Medical Imaging System ConfigurationNetworking Equipment Bootloader

Use Scenario: Storing calibration coefficients, sensor profiles, and regulatory compliance data in FDA-cleared diagnostic imaging hardware.

IC Role / Device Role / Timing Role: Secure OTP-backed configuration store with 1024-byte one-time-programmable array for cryptographic keys.

Use Value: Hardware-enforced block protection prevents tampering with calibration data during service or field maintenance.

Use Scenario: Hosting U-Boot or Coreboot images in enterprise switches and routers requiring fast, deterministic boot sequences.

IC Role / Device Role / Timing Role: High-speed Quad Read DDR interface delivering 80 MBps throughput to meet sub-second boot SLA requirements.

Use Value: CFI and SFDP support enables automatic driver adaptation across multiple board revisions without firmware rework.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGMFI10Same die, SOIC-16 package (300 mil); lacks FBGA thermal performance and board space efficiencyBetter suited for prototyping or legacy PCBs with through-hole or wide-pitch layoutsSelect when mechanical compatibility with existing SOIC footprints is required over thermal or density optimization
Winbond W25Q512JWIM > 512Mb512 Mb, 1.8 V I/O compatible, but no AEC-Q100 qualification or ASP supportTargeted at consumer IoT gateways where automotive reliability and secure sector locking are not mandatedChoose only for cost-sensitive, non-automotive designs where extended temperature operation is unnecessary

Compared with S25FL512SAGBHIC13, the SOIC variant trades board-area efficiency and thermal robustness for assembly simplicity, while the Winbond alternative sacrifices automotive qualification and advanced protection for lower unit cost in commercial-grade applications.

Availability

S25FL512SAGBHIC13 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware deployment, and medical imaging system manufacturing requiring stable component supply across extended product lifecycles.

Supply support for S25FL512SAGBHIC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and trusted security solutions.

The FL-S flash product line targets high-reliability embedded systems needing deterministic boot performance, long-term data integrity, and automotive-grade qualification - especially where firmware security and field upgrade resilience are critical.

FAQ

Does S25FL512SAGBHIC13 support both SPI and QPI modes?

No. This device supports SPI protocol only, with Multi-I/O extensions (Dual/Quad I/O) enabled via command mode selection. It does not implement Quad Peripheral Interface (QPI) with 4-line command/address/data multiplexing. All commands, addresses, and data use standard SPI framing with configurable I/O lane count per operation.

What is the minimum VIO voltage required for Quad Read operation?

The minimum VIO voltage for Quad Read is 1.65 V. At VIO = 1.65–2.7 V, maximum Quad Read speed is 33 MBps (66 MHz clock). Full 52 MBps performance requires VIO ≥ 3.0 V. Both VIO and VCC must remain within their respective operating ranges during operation.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte One-Time-Programmable (OTP) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. Once written, contents are retained for 20 years and survive all subsequent power cycles, resets, and erase operations on the main array.

Is RESET# required for normal operation, or only during initialization?

RESET# is optional during normal operation but mandatory during power-up initialization and recovery from brown-out conditions. Asserting RESET# forces the device into a known state, clears internal command registers, and disables all ongoing operations - essential for deterministic recovery in safety-critical systems.

S25FL512SAGBHIC13 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL512SAGBHIC13 FAQ

1.How can I place an order for S25FL512SAGBHIC13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGBHIC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGBHIC13 reliable?

The price and inventory of S25FL512SAGBHIC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHIC13 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGBHIC13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHIC13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGBHIC13?

S25FL512SAGBHIC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGBHIC13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGBHIC13?

For technical support, including S25FL512SAGBHIC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHIC13 requirements.

6.How does Aetrix verify that S25FL512SAGBHIC13 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGBHIC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHIC13 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGBHIC13?

All S25FL512SAGBHIC13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHIC13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGBHIC13 part is unused and in its original packaging.

Return procedure for S25FL512SAGBHIC13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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