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Infineon Technologies S25FL512SAGBHID10

Part No.:
S25FL512SAGBHID10
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL512SAGBHID10.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,380

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Product details

Overview

S25FL512SAGBHID10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad-Input Page Programming, and hardware ECC. It supports Fast/Quad/DDR read modes up to 80 MHz DDR clock (80 MBps Quad Read DDR), operates from –40°C to +105°C (Industrial Plus), and is used in boot code storage for embedded microcontrollers.

For engineers reviewing the S25FL512SAGBHID10 datasheet, S25FL512SAGBHID10 pinout, S25FL512SAGBHID10 application, or S25FL512SAGBHID10 equivalent, key selection criteria include SPI Multi-I/O timing compliance, 256-KB uniform sector erase granularity, OTP-based secure boot configuration, AEC-Q100 Grade 2 qualification, and VIO voltage flexibility (1.65–3.6 V).

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling single-bit error correction via on-die hardware ECC and supporting both standard SPI (modes 0/3) and DDR-capable command protocols. Its CFI-compliant register set and JEDEC JESD216 SFDP table allow automatic configuration by host boot loaders.

The logic block diagram confirms dual-supply operation: VCC (2.7–3.6 V) powers the core and array, while VIO (1.65–3.6 V) independently supplies I/O drivers-enabling interoperability with 1.8 V or 3.3 V host controllers without level shifters.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - sufficient for full firmware images including bootloader, OS, and application binaries in resource-constrained edge devices.
Read Speed (Quad DDR)80 MBps at 80 MHz DDR clock - enables fast XIP (eXecute-In-Place) execution of code directly from flash in real-time control systems.
Erase GranularityUniform 256-KB sectors - simplifies firmware update partitioning and eliminates need for complex wear-leveling in MCU-based OTA updates.
Endurance100,000 program-erase cycles - supports frequent field firmware upgrades over 10+ years in industrial gateways and automotive ECUs.
Data Retention20 years minimum at +85°C - ensures long-term reliability of calibration data and security keys in unpowered storage.
Security1024-byte OTP array + ASP + status-register block protection - enables immutable root-of-trust boot code and per-sector write lock for secure boot partitions.
Temperature Range–40°C to +105°C (Industrial Plus) - qualified for under-hood automotive modules and high-ambient industrial PLCs without derating.
Voltage FlexibilityVIO = 1.65–3.6 V, VCC = 2.7–3.6 V - allows direct interfacing with 1.8 V FPGAs or 3.3 V MCUs without external level translators.

Pinout & Package

Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command decoding; must be asserted before SCK edge to initiate valid transaction.
SCKSerial Clock InputMaster-generated clock; supports SDR (up to 133 MHz) and DDR (up to 80 MHz) modes with configurable polarity/phase.
IO0 (SI)Serial Input / I/O0Primary data input during programming; bidirectional in Quad mode for address/data transfer.
IO1 (SO)Serial Output / I/O1Primary data output during reads; bidirectional in Quad mode; supports tri-state during multi-drop bus sharing.
IO2 (WP#)Write Protect / I/O2Hardware-enabled sector protection when pulled low; also functions as Quad I/O line during high-speed reads.
IO3 (HOLD#)Hold Input / I/O3Pauses ongoing SPI transfer without deselecting chip; doubles as Quad I/O line in extended command sequences.
RESET#Hardware Reset InputAsynchronous active-low reset that clears internal state and reinitializes flash controller; required for recovery after brownout.
VCCCore Power Supply2.7–3.6 V analog/digital core supply; decoupling capacitor mandatory within 10 mm of pin per layout guidelines.
VIOI/O Power Supply1.65–3.6 V independent I/O driver supply; enables mixed-voltage system integration without level shifters.
VSSGroundCommon reference for VCC and VIO; requires dedicated low-impedance plane connection in PCB stack-up.

Key Features

FeatureDesign Value
AutoBoot FunctionAutomatically executes Normal or Quad Read at power-up/reset from preconfigured address-eliminates host-side boot initialization delay.
Quad-Input Page Programming (QPP)Enables full 512-byte page writes using only IO0–IO3 pins at low clock rates (<20 MHz), reducing MCU GPIO overhead in cost-sensitive designs.
Hardware ECC EngineOn-die single-bit error correction with no software intervention-ensures data integrity in radiation-prone environments (e.g., automotive, aerospace).
Advanced Sector Protection (ASP)Password- or boot-code-controlled individual sector locking-prevents unauthorized firmware modification while allowing selective field updates.
JEDEC JESD216 SFDP SupportSelf-describing parameter table readable via standard SPI commands-enables automatic driver configuration across heterogeneous host platforms.

Applications

Automotive ECU Boot StorageIndustrial PLC Firmware Image

Use Scenario: Storing boot loader and safety-critical firmware in engine control units requiring AEC-Q100 Grade 2 qualification.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AutoBoot execution and hardware ECC for ASIL-B compliance.

Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity over full vehicle lifetime without refresh.

Use Scenario: Holding field-upgradable firmware and configuration data in programmable logic controllers operating continuously at +70°C ambient.

IC Role / Device Role / Timing Role: High-reliability SPI flash with uniform 256-KB erase blocks for deterministic OTA update timing.

Use Value: VIO flexibility (1.65–3.6 V) allows direct interface with 2.5 V FPGA configuration interfaces without level-shifting components.

Medical Imaging System Code StorageEdge AI Gateway Boot Memory

Use Scenario: Secure storage of diagnostic algorithm binaries and calibration tables in FDA-cleared imaging equipment.

IC Role / Device Role / Timing Role: Trusted boot source with 1024-byte OTP for cryptographic key storage and ASP for tamper-resistant partitioning.

Use Value: Hardware write protection prevents accidental or malicious corruption of regulatory-certified software images.

Use Scenario: Hosting Linux kernel, device tree, and inference model weights in fanless edge gateways deployed in telecom cabinets.

IC Role / Device Role / Timing Role: High-bandwidth Quad DDR flash (80 MBps) enabling fast XIP execution to reduce cold-boot latency.

Use Value: 80 MBps read speed cuts boot time by >40% vs. legacy SPI flash, improving system responsiveness during network failover events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGMFI10Same die, identical electrical specs, but in SO16 package (300-mil) instead of FAB024 BGA.Preferred for prototyping or space-tolerant designs where BGA rework is impractical.Select for manual assembly, legacy board compatibility, or thermal testing with exposed pad access.
Winbond W25Q512JWIM
(512 Mb, 1.8 V)
1.8 V-only VIO (1.7–2.0 V), lower max clock (133 MHz SDR only, no DDR), no hardware ECC.Suitable for ultra-low-power IoT nodes but lacks AEC-Q100 qualification and AutoBoot.Choose only if system uses 1.8 V I/O exclusively and does not require DDR performance or automotive-grade reliability.

Compared with S25FL512SAGBHID10, the SO16 variant offers identical functionality in through-hole-compatible packaging, while the Winbond alternative trades DDR capability, ECC, and temperature range for lower static power-making it viable only in non-safety-critical, 1.8 V–only systems.

Availability

S25FL512SAGBHID10 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and medical imaging system boot code deployment requiring stable component supply across multi-year production cycles.

Supply support for S25FL512SAGBHID10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure embedded solutions, with global R&D and manufacturing infrastructure.

The FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life nonvolatile storage-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data retention.

FAQ

What is the maximum supported clock frequency for Quad Read DDR mode?

The S25FL512SAGBHID10 supports Quad Read DDR at up to 80 MHz clock frequency, delivering 80 MBps effective throughput when VIO = VCC = 3.0–3.6 V. This is confirmed in the Performance Summary table (Datasheet Rev. *U, page 3) and requires proper DDR timing setup per Section 5.5. The device does not support DDR above 80 MHz, even with tighter voltage margins.

Does this part support hardware reset via the RESET# pin, and what is its behavior?

Yes, the RESET# pin provides asynchronous hardware reset: asserting it low clears internal command state, resets the address counter, and places the device in standby mode. After release, the flash enters ready state within 20 μs (max) and retains all configuration register settings. This function is fully documented in Section 2.3 and validated per AEC-Q100 stress testing.

Is the 1024-byte OTP array one-time programmable only, or can it be erased?

The 1024-byte OTP (One-Time Programmable) array is permanently programmable-bits can be changed from '1' to '0', but cannot be reverted. Erase operations are not supported. This is specified in Section 8.1 and enforced by hardware fuses; attempting to reprogram locked OTP bytes results in command rejection with status register error flag set.

How does Advanced Sector Protection (ASP) differ from standard block protection?

Standard block protection uses status register bits to lock contiguous sector ranges globally, while ASP enables per-sector locking via password or boot code authentication-allowing dynamic, fine-grained protection without affecting adjacent sectors. ASP is implemented in silicon (Section 8.4) and requires dedicated commands (e.g., 0x42/0x44); it is not emulated in firmware.

S25FL512SAGBHID10 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (6x8)

S25FL512SAGBHID10 FAQ

1.How can I place an order for S25FL512SAGBHID10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGBHID10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGBHID10 reliable?

The price and inventory of S25FL512SAGBHID10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHID10 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGBHID10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHID10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGBHID10?

S25FL512SAGBHID10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGBHID10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGBHID10?

For technical support, including S25FL512SAGBHID10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHID10 requirements.

6.How does Aetrix verify that S25FL512SAGBHID10 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGBHID10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHID10 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGBHID10?

All S25FL512SAGBHID10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHID10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGBHID10 part is unused and in its original packaging.

Return procedure for S25FL512SAGBHID10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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