Infineon Technologies S25FL512SAGBHM210

Overview

S25FL512SAGBHM210 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC. It supports AutoBoot, CFI, SFDP, and operates across industrial (–40°C to +85°C) and automotive AEC-Q100 Grade 2 (–40°C to +105°C) temperature ranges.

For engineers reviewing the S25FL512SAGBHM210 datasheet, S25FL512SAGBHM210 pinout, S25FL512SAGBHM210 application, or S25FL512SAGBHM210 equivalent, key selection factors include Quad DDR read performance (80 MBps), 100,000 program-erase cycles, OTP security (1024 bytes), sector protection modes, and FBGA-24 (FAB024) package compatibility with legacy S25FL-P family footprints.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing for boot code and firmware storage in resource-constrained embedded systems. Its dual-voltage I/O (VIO = 1.65–3.6 V) decouples signal integrity from core power, supporting mixed-voltage host interfaces.

The SPI interface supports all four clock polarity/phase modes (0 and 3), DDR operation, 32-bit extended addressing, and command sets compatible with S25FL-A/K/P families-ensuring migration path continuity. Internal hardware ECC provides single-bit error correction without software overhead during read operations.

Key Specifications

Pinout & Package

Package: 24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Compared with S25FL512SAGBHM210, the SOIC variant trades package ruggedness for assembly simplicity, while the Winbond part sacrifices Infineon-specific security and boot features for broader voltage flexibility-making the original optimal for automotive and safety-critical firmware storage.

Availability

S25FL512SAGBHM210 is available at Aetrix Electronics and suitable for automotive powertrain ECUs, industrial PLCs, medical imaging subsystems, and avionics data loggers requiring stable component supply, long lifecycle assurance, and AEC-Q100 compliance.

Supply support for S25FL512SAGBHM210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.

The S25FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life nonvolatile storage-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and hardware-based data protection.

FAQ

What is the maximum clock frequency supported in Quad DDR mode?

The S25FL512SAGBHM210 supports Quad DDR operation up to 80 MHz, delivering 80 MBps read throughput. This requires VIO = VCC = 3.0–3.6 V and proper PCB layout with matched trace lengths and controlled impedance (50 Ω ±10%) on all four I/O lines to maintain signal integrity and timing margins.

Does this device require external hardware ECC circuitry?

No. The device integrates dedicated hardware ECC logic that automatically detects and corrects single-bit errors during read operations. No external circuitry or software intervention is needed-the correction occurs transparently within the data path before output to the host interface.

Can the OTP area be reprogrammed after initial programming?

No. The 1024-byte OTP (One-Time Programmable) array is permanently locked after programming. Once written, bits can only be changed from '1' to '0'; no mechanism exists to reset or reprogram any portion. This ensures cryptographic keys or calibration data remain immutable throughout product life.

Is the FAB024 FBGA package compatible with standard reflow profiles?

Yes. The Pb-free FAB024 package is qualified for standard lead-free reflow per IPC/JEDEC J-STD-020, with peak temperature up to 260°C. Thermal profile must maintain ramp rates ≤3°C/s, dwell time at peak ≥60 s, and avoid thermal shock between stages to prevent solder voiding or ball lift.